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PDF Solutions PDF Solutions is a leader in big data analytics solutions for semiconductor and electronics.

SEMICON Taiwan 2026 is underway, and our team is on the floor at Booth J2834.Every AI chip runs on data. So do we. That'...
09/02/2026

SEMICON Taiwan 2026 is underway, and our team is on the floor at Booth J2834.

Every AI chip runs on data. So do we. That's the message we're bringing to Hall 1 this week, across three focus areas:

✔️ Fabless: Ship AI chips faster and surface risk before it escalates
✔️ Fabs & OSATs: See every wafer, predict every outcome
✔️ Equipment OEMs & Fabs: Connect and control every tool, secure every connection

Tomorrow morning, our own Kimon Michaels takes the stage at the Next Generation IC Design Summit to talk about designing intelligence and shaping the next era of semiconductor innovation.

If you're at the show, stop by Booth J2834. We'd like to show you what a real data backbone for the AI chip era looks like.

AI is changing how chips get designed and how they get made. At PDF Solutions, we're bringing both sides of that convers...
09/01/2026

AI is changing how chips get designed and how they get made. At PDF Solutions, we're bringing both sides of that conversation together.

Ming Zhang, VP at PDF Solutions, opens the ESD Alliance Design Session at SEMICON West with a look at why bridging design and manufacturing with AI is now a business imperative, not a nice-to-have.

Later in the day, Kimon Michaels of PDF Solutions presents on scaling AI-ready data platforms, secure data exchange, and ecosystem collaboration from front-end design through advanced packaging.

The session covers where AI is already delivering results:
✅ Architecture exploration and verification
✅ Intelligent DFM
✅ Virtual metrology
✅ Predictive maintenance

Will you be there?

📅 Tuesday, October 13, 2026
📍 Moscone Center, San Francisco
🕥 10:30 AM – 4:00 PM Pacific

08/31/2026

AI is changing how semiconductor teams work with data. Exensio®️ Aurora is helping lead that transformation.

At PDF Solutions CONNECT 2026, you'll get an inside look at how Exensio Aurora is enabling more intuitive data exploration, faster answers, and smarter manufacturing decisions. Alongside customer presentations, technical sessions, and live demonstrations, CONNECT brings together industry experts to explore the future of AI-driven semiconductor analytics.

🚀 Experience the next generation of semiconductor analytics.

Register now: https://events.pdf.com/connect2026/

What does it take to build a data architecture for semiconductor manufacturing at petabyte scale?Said Akar, General Mana...
08/27/2026

What does it take to build a data architecture for semiconductor manufacturing at petabyte scale?

Said Akar, General Manager and Head of Development at PDF Solutions, shares his perspective in a new video on the thinking behind Exensio® Aurora, our latest analytics architecture.

His insight: semiconductor data isn't just big. It's wide, varied, and shaped unlike anything a generic system was designed for. That's why we built Aurora from the ground up to handle it, with AI and automation built in.

Watch the video, then join us at PDF Solutions CONNECT, October 15–16 in San Francisco, to see it live.

Register now: https://events.pdf.com/connect2026/
Read more: https://go.pdf.com/l/814523/2026-08-24/d1wgq

Semiconductor manufacturing doesn't have a data problem. It has a speed-to-insight problem.That's why we built Exensio®️...
08/26/2026

Semiconductor manufacturing doesn't have a data problem. It has a speed-to-insight problem.

That's why we built Exensio®️ Aurora, a new architecture for our Exensio solution designed for petabyte-scale data and secure agentic AI deployment across manufacturing operations.

What changes with Aurora:
✅ Distributed computation delivers roughly 25x faster performance on large datasets at comparable hardware cost.
✅ Our Manufacturing Data House adds richer context so engineers can ask "why is yield declining?" instead of just querying datasets.
✅ Workflows encode engineering expertise as guardrails, improving repeatability and reducing AI hallucination.
✅ Secure, flexible deployment options protect proprietary IP, including on-premises.
✅ Orchestrate AI Agents to answer complex operations questions.

Exensio was built for semiconductor analytics. Exensio Aurora is built for semiconductor intelligence. Read the entire article at SemiWiki.com https://bit.ly/4wLUoM1

We'll demo Exensio Aurora first at PDF Solutions CONNECT 2026, October 15-16 in San Francisco. Register today to join us! https://bit.ly/4xH3zyz

What would you ask a system that could analyze all your manufacturing data, not just a sample?

We're heading to SEMICON Taiwan 2026. Find us at booth  , September 2-4 at TaiNEX 1 & 2, Taipei.Dr. Kimon Michaels, our ...
08/25/2026

We're heading to SEMICON Taiwan 2026. Find us at booth , September 2-4 at TaiNEX 1 & 2, Taipei.

Dr. Kimon Michaels, our Executive VP of Products and Solutions and Co-Founder, presents "From Front-End to Advanced Packaging: Scalable AI-Ready Data Platform, Secure Data Exchange and Ecosystem Collaboration," 9:00-9:25 AM.

SEMICON Taiwan brings together the region's semiconductor ecosystem — design, manufacturing, materials, and equipment — to align on where the industry is headed next.

We'll be there talking about how we generate and integrate data across the supply chain. And how we use AI to drive fast improvements in yield, quality and efficiency from fabless, to equipment OEMs to fabs and OSATs!

Stop by booth and talk to us, and be sure to catch Kimon's session!

70% of AI initiatives in semiconductor manufacturing never scale past the pilot phase.Jon Holt, Sr. Director of Product ...
08/24/2026

70% of AI initiatives in semiconductor manufacturing never scale past the pilot phase.

Jon Holt, Sr. Director of Product Management at PDF Solutions, joins a live Digest webinar on September 1 2026, to break down why, and what fab and operations leaders can do differently.

Jon, with Ahmed Ben Slimane and moderated by Peter Singer will present the following:
✅ The 8 core pillars connecting traditional CIM with modern AI, from sensors to autonomous applications
✅ Why workforce shifts on the fab floor are raising operational risk
✅ How advanced packaging and heterogeneous integration are becoming strategic answers to capacity constraints

Who should attend?
Process engineers, yield engineers, fab operations managers, APC and CIM teams, equipment engineers, manufacturing IT leaders, and executives responsible for driving AI and digital transformation initiatives in semiconductor manufacturing environments.

Register to attend live or receive the recording. https://www.semiconductor-digest.com/ai-smart-mfg-webinar-sep-2026/

08/20/2026

What happens when engineers can test a new algorithm on real production data without ever touching the live tool? Aziz Safa, Corporate VP & GM of Intel Foundry Automation at Intel, walks through exactly that in our latest video.

At PDF Solutions, this is the kind of automation we build every day. Structured data like WIP, sort, test, and e-test lives in one place, powering labor, equipment, and factory-wide productivity gains, even when the underlying dataset runs into hundreds of petabytes.

Watch the video above to hear Safa's take, and join us at PDF Connect 2026 to learn more.

Register here: https://events.pdf.com/connect2026/

Chiplets are pushing design and manufacturing closer together than ever. The data has to keep up.At SEMICON Taiwan 2026,...
08/19/2026

Chiplets are pushing design and manufacturing closer together than ever. The data has to keep up.

At SEMICON Taiwan 2026, Dr. Kimon Michaels, our Executive Vice President of Products and Solutions, Director, and Co-Founder, is speaking on how we're bringing together an AI-ready data platform, secure data exchange, and supply chain orchestration into one solution.

He'll walk through our Exensio Aurora architecture and how adaptive test is evolving for multi-chiplet, heterogeneously integrated systems.

Join us Sept 3 at the Next Gen IC Design Summit at SEMICON Taiwan!

At PDF Solutions, we've seen it firsthand: the smartest AI model in the world can't compensate for fragmented data or a ...
08/18/2026

At PDF Solutions, we've seen it firsthand: the smartest AI model in the world can't compensate for fragmented data or a siloed fab.

Our Senior Director of Product Management, Jon Holt, breaks down the framework behind our ASMC 2026 tutorial, an 8-pillar model that connects traditional manufacturing systems with modern AI, from sensors on the floor to agentic AI in production.

Over 70% of AI pilots in our industry never scale. We believe the fix isn't a better algorithm. It's building the right foundation first, then earning trust with engineers, then scaling with discipline.

Read the full article here: https://semiengineering.com/from-hype-to-implementation-building-the-core-pillars-for-ai-in-semiconductors/

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