Amkor Technology, Inc.

08/06/2026

Understanding the semiconductor industry requires more than expertise in a single discipline. It requires seeing how technology, operations, finance and communications work together to move a business forward.

During a recent Lunch & Learn at Amkor Technology headquarters, interns heard from leaders across the organization, including Omer Dossani, vice president, Global Test Services; Wade Beckstead, senior manager, Operations Finance; Kris Pugsley, vice president, Marketing Communications; and Wayne Ga***rd, senior director, Creative.

Through their perspectives, interns gained a deeper understanding of how different functions contribute to Amkor's strategy, support customers and help drive innovation across the semiconductor ecosystem. The session provided more than an introduction to individual departments. It offered a broader view of how cross-functional collaboration turns ideas into outcomes and vision into ex*****on.

Investing in future talent means helping the next generation understand not only what we do, but how every part of the business contributes to long-term success.

Learn more about the career opportunities Amkor has to offer: https://bit.ly/4kPXOsg

08/05/2026

Missed our Q2 2026 earnings call? The replay is now available.

The semiconductor market is being shaped by growing demand for advanced computing and intelligent systems. In Q2 2026, Amkor Technology delivered record revenue of $1.9 billion, with Computing and Automotive & Industrial end markets contributing record results and helping drive strong profitability.

Watch the full earnings webcast for additional insights into our second-quarter performance, market trends and business outlook: https://bit.ly/4gGRqo1

08/04/2026

𝐂𝐚𝐧 𝐚 𝐩𝐚𝐜𝐤𝐚𝐠𝐞 𝐛𝐞 𝐜𝐨𝐧𝐬𝐢𝐝𝐞𝐫𝐞𝐝 "𝐟𝐥𝐚𝐭 𝐞𝐧𝐨𝐮𝐠𝐡" 𝐢𝐟 𝐢𝐭'𝐬 𝐨𝐧𝐥𝐲 𝐟𝐥𝐚𝐭 𝐚𝐭 𝐫𝐨𝐨𝐦 𝐭𝐞𝐦𝐩𝐞𝐫𝐚𝐭𝐮𝐫𝐞?

One growing industry debate is whether traditional flatness measurements still reflect real-world performance. Mike Kelly, vice president of Chiplets and Flip Chip BGA Integration at Amkor Technology, notes that future approaches may focus more on balancing stress and CTE effects across the package stack and optimizing for operating conditions rather than assembly conditions alone.

Read the latest Semiconductor Engineering article by Gregory Haley: https://bit.ly/4w1bMfG

As packages get larger and thinner, warpage is becoming a process-control problem rather than a simple flatness spec.

07/30/2026

𝐓𝐡𝐞 𝐟𝐮𝐭𝐮𝐫𝐞 𝐨𝐟 𝐨𝐮𝐫 𝐢𝐧𝐝𝐮𝐬𝐭𝐫𝐲 𝐬𝐭𝐚𝐫𝐭𝐬 𝐰𝐢𝐭𝐡 𝐩𝐞𝐨𝐩𝐥𝐞.

This National Intern Day, we're celebrating the interns who spent the summer learning, growing and making an impact across Amkor Technology.

Through new experiences, meaningful projects and strong team connections, they gained skills that will help shape their careers while contributing to the work we do every day. Their curiosity, fresh perspectives and willingness to learn remind us that advancing what's next starts with investing in the next generation.

Thank you for everything you've brought to Amkor. We're excited to see where your journey takes you next.

Learn more about careers at Amkor Technology: https://bit.ly/4kPXOsg

07/29/2026

Amkor Technology is pleased to participate in the 𝐒𝐦𝐚𝐫𝐭 𝐒𝐞𝐦𝐢𝐜𝐨𝐧𝐝𝐮𝐜𝐭𝐨𝐫 𝐀𝐜𝐚𝐝𝐞𝐦𝐲, where students and industry professionals will explore the technologies helping shape the next generation of AI semiconductors.

As part of the program, JaeHyeon Seo, SoC product development division manager, will discuss how advanced packaging is helping address growing demands for AI performance and power efficiency. The session will cover heterogeneous integration, chiplets, 2.5D/3D architectures and HBM, along with key engineering challenges that will influence future AI system design.

Explore our advanced packaging technologies: https://bit.ly/3Kw8RoZ

07/29/2026

Earlier this month at Nano Biz Forum, EunSook Sohn, characterization division manager at Amkor Technology, discussed how advanced packaging is enabling the next generation of AI-driven computing. Her presentation explored the growing importance of chiplets, heterogeneous integration and HBM, and how simulation and characterization help accelerate development and optimize performance.

Learn more about Amkor’s advanced packaging solutions: https://bit.ly/3Kw8RoZ

07/28/2026

Amkor Technology is proud to participate in 𝐀𝐜𝐜𝐞𝐥𝐞𝐫𝐚𝐭𝐢𝐧𝐠 𝐈𝐧𝐧𝐨𝐯𝐚𝐭𝐢𝐨𝐧 𝐢𝐧 𝐀𝐝𝐯𝐚𝐧𝐜𝐞𝐝 𝐏𝐚𝐜𝐤𝐚𝐠𝐢𝐧𝐠 𝐚𝐧𝐝 𝐇𝐞𝐭𝐞𝐫𝐨𝐠𝐞𝐧𝐞𝐨𝐮𝐬 𝐈𝐧𝐭𝐞𝐠𝐫𝐚𝐭𝐢𝐨𝐧 𝐰𝐢𝐭𝐡 𝐀𝐈, presented by IMAPS Silicon Valley and hosted by Samsung Semiconductor.

Mike Kelly, vice president of Chiplets and Flip Chip BGA Packaging Development and Integration, will explore emerging package fabrication methods, advanced design and test strategies, decoupling capacitor approaches, and the role of 2D and 3D integration in enabling next-generation AI systems.

Register for the symposium: https://bit.ly/4frR3g1

07/27/2026

Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced financial results for the second quarter ended June 30, 2026.

“Amkor delivered record second quarter revenue and strong profitability, with record revenue in our Computing and Automotive & Industrial end markets," said Kevin Engel, president and chief executive officer. "During the first half of 2026, we expanded strategic partnerships across the semiconductor ecosystem, advanced key customer programs in AI and HPC, and continued the expansion of our Advanced packaging and test capacity. We expect these actions will strengthen our competitive position, increase our earnings power and create sustainable shareholder value.”

Read the full press release for more details on our Q2 2026 performance: https://bit.ly/4yHL8ej

07/24/2026

Amkor and NVIDIA Announce Strategic Partnership to Advance AI Infrastructure

Amkor Technology, Inc. has announced a multi-year strategic partnership with NVIDIA to develop advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms.

As AI drives unprecedented demand for performance, energy efficiency, and system-level integration, advanced packaging has become a critical enabler of next-generation computing. Through this collaboration, NVIDIA and Amkor will align technology roadmaps to advance innovations in high-density interconnects and heterogeneous integration while expanding advanced packaging capacity in the United States.

The agreement supports Amkor’s Arizona expansion and reinforces a shared commitment to strengthening domestic semiconductor manufacturing, enhancing supply chain resilience, and accelerating AI innovation at scale.

Read the full press release at https://bit.ly/44KWrom

07/22/2026

Fine-pitch hybrid bonding is expected to play an important role in the next generation of advanced semiconductor packaging.

Check out Semiconductor Engineering's latest article from Gregory Haley featuring insights from Mike Kelly, Vice President of Chiplets and FCBGA Integration at Amkor Technology, on the challenges and considerations for scaling hybrid bonding to high-volume manufacturing.

🔗 Read the full article: https://bit.ly/4vAxhDD

Hybrid bonding already works in production, but finer-pitch die-to-wafer integration must preserve fab-level surface and alignment control at back-end volumes and costs.