06/04/2026
Amkor Technology made a strong impact at ECTC 2026, connecting with more than 2,700 attendees, including a large community of students and future industry talent. The winner of our raffle giveaway at the Amkor booth was Dr. Nia Richards of KLA, helping add excitement and engagement to our presence on the show floor.
Our newly enhanced booth drew steady traffic throughout the event, showcasing Amkor’s advanced packaging leadership and creating meaningful conversations around career opportunities, especially at our upcoming Amkor Technology Arizona (ATA) facility in Peoria. We also strengthened key supplier relationships through productive discussions and collaboration opportunities.
Top of mind for attendees were ATA’s progress, workforce development and future packaging and test capabilities. We also saw strong engagement with advanced technologies, including Amkor's S-Connect™ and S-SWIFT™ technology, and co-packaged optics, wafer-level solutions, advanced test services, quantum computing and memory. Our collaborations with AMD, Apple, Taiwan Semiconductor Manufacturing Company and NVIDIA further reinforced our role in enabling next-generation innovation. Our package displays were a clear highlight, sparking technical discussions across the show floor.
Our technical leadership was on full display. JongMin Park’s poster on glass core substrates for and drew significant attention and strong engagement from attendees. Suresh Jayaraman and KyungRok Park helped drive deeper discussions onsite.
At our sponsored luncheon, Kris Pugsley’s presentation on scaling global capabilities to U.S. manufacturing resonated with a full, highly engaged audience, spotlighting Amkor’s expanding U.S. presence.
A great team effort all around, strengthening our brand, showcasing innovation and deepening connections across the ecosystem.
We look forward to seeing you at ECTC 2027 in Denver! https://ectc.net