Amkor Technology, Inc.

10/07/2026

This week, Amkor Technology Vietnam received the Top 5 Notable FDI Partners of the Year title at the Better Choice Awards 2026. The recognition is part of the newly launched Nation Builders Awards, which honor businesses that strengthen the country's infrastructure, technology, energy and manufacturing base.

For Amkor, the award recognizes years of work alongside Vietnam's high-tech sector. The focus going forward stays the same: create lasting value, grow local talent and help Vietnam take a larger role in the global technology value chain.

Help shape what comes next in Vietnam's semiconductor industry. Explore open roles at Amkor Vietnam: https://bit.ly/47y9Jps

10/06/2026

Amkor Technology is pleased to participate in SMTA International 2026, where industry leaders will gather to discuss the latest developments in electronics manufacturing and semiconductor packaging.

As AI and HPC continue to shape the industry's direction, YoungDo Kweon will share perspectives on advanced packaging technologies and their role in enabling next-generation semiconductor innovation. We look forward to contributing to the conversations helping define the future of our industry.

Learn more about the event and register: https://www.smtai.org/

Surface Mount Technology Association - SMTA

10/05/2026

Amkor Technology joined customers, partners and industry peers at the 2026 IMAPS Symposium to exchange ideas, share technical expertise and explore solutions for some of the industry's most pressing challenges. Through presentations on heterogeneous integration, chiplet architectures and advanced interconnect technologies, Amkor highlighted approaches designed to address the thermal, electrical and manufacturing complexities shaping next-generation devices.

Thank you to everyone who visited our booth, attended our presentations and shared insights throughout the symposium. Meaningful industry progress depends on collaboration, and we appreciate the opportunity to learn, connect and advance what's next together.

Visit our events page to see where Amkor will be sharing insights and collaborating with partners at upcoming industry events: https://amkor.com/events/

10/02/2026

Manufacturing is often measured by what it produces. Its greatest impact, however, comes from the people who make it possible.

Every day, teams across Amkor Technology apply their expertise, curiosity and commitment to help advance an industry that powers technologies used around the world. Their work reflects the collaboration, problem-solving and continuous learning that define modern manufacturing.

On Manufacturing Day, we're recognizing the employees who help move our industry forward while inspiring the next generation to explore the opportunities manufacturing can offer.

Explore the opportunities and career paths shaping the future of manufacturing at Amkor: https://bit.ly/4gkKhIa

09/29/2026

Can materials that shrink when heated help solve one of advanced packaging's biggest challenges?

As package, interposer and panel sizes continue to grow, warpage is becoming an increasingly difficult manufacturing constraint. Controlling thermal mismatch can affect bonding quality, equipment handling and production scalability.

In this discussion, Knowlton Olmstead, senior manager of wafer services at Amkor Technology, shares how warpage impacts manufacturing processes and why negative thermal expansion materials are drawing industry attention. The article explores what could be one of the more promising approaches for managing warpage as package sizes continue to increase.

Read the latest Semiconductor Engineering article by Bryon Moyer: https://bit.ly/4iTHdFS

Molding compounds and underfill can improve thermal stability.

09/28/2026

Join Amkor Technology at the ISIG Executive Summit China, a senior-level forum bringing together semiconductor executives and technology leaders to discuss the trends, innovations and collaborations shaping the future of the industry.

During the event, Amkor's Jun Wang, senior vice president, Manufacturing & Engineering, will share insights into the latest packaging technologies and Amkor's expertise in enabling next-generation semiconductor solutions.

Learn more about the event: https://theisig.com/

09/25/2026

Amkor Technology advanced 250 positions in 3BL's 2026 100 Best Corporate Citizens ranking, moving from No. 358 to No. 108 among the 1,000 largest U.S. public companies evaluated.

The 100 Best Corporate Citizens ranking is a comprehensive external benchmark that evaluates the largest publicly traded U.S. companies across 221 corporate responsibility and sustainability factors.

Amkor improved its position across every major pillar measured by the ranking. Amkor's Information Technology sector rank climbed from No. 66 to No. 27, the largest gain in the sector this year, and the company placed No. 28 for Climate Change and No. 14 for Human Rights.

This broad-based progress reflects the contributions of teams across Amkor worldwide, and we thank our customers, suppliers and stakeholders for their continued support of Amkor's corporate responsibility program.

Learn more about what drove the improvement on our blog: https://bit.ly/4rvPxOd

09/24/2026

Earlier this month, representatives from the U.S. House Foreign Affairs Committee (HFAC) and the House Committee on Science, Space, and Technology (HSST) visited Amkor Technology’s K5 facility in Korea for discussions on the AI supply chain.

As AI continues to evolve rapidly, conversations focused on the critical role of advanced semiconductor packaging and the importance of collaboration in strengthening supply chain resilience and supporting long-term industry competitiveness.

The visit also provided an opportunity to exchange perspectives on future technology demands, packaging innovation and the continued evolution of the semiconductor ecosystem that will help enable the next generation of AI.

Explore the innovations shaping the future of AI-enabled semiconductor packaging: https://bit.ly/4wDGImw

09/24/2026

Amkor Technology will participate in IEMT 2026, a leading forum for advancing electronic materials, semiconductor packaging and manufacturing technologies.

Representatives from Amkor will share technical insights on topics ranging from power packaging reliability and assembly process optimization to wafer dicing innovation and manufacturing efficiency. Attendees can expect practical perspectives on addressing some of the industry's most pressing challenges in performance, quality and scalability.

Learn more about the event: https://bit.ly/4xI3D0i

09/23/2026

Arizona Governor Katie Hobbs recently highlighted the impact of Amkor Technology's planned Arizona Advanced Packaging and Test campus on the state's continued leadership in semiconductor growth and innovation.

“Arizona is proud to be home to Amkor Technology and its planned $12 billion Advanced Packaging and Test campus. This historic investment further strengthens Arizona’s position as North America’s epicenter for semiconductor growth and innovation. Amkor’s expansion will bolster our statewide economy, create thousands of family‑sustaining jobs for Arizonans, and help drive our economic progress for decades to come.”

Learn more about Amkor's Arizona Advanced Packaging and Test campus: https://bit.ly/4wZdn66