10/16/2026
OCTOBER 16 | Through-Hole Technology (THT) Assembly
DID YOU KNOW?
Not every electronic component can be placed using automated Surface Mount Technology (SMT). Think about a connector that gets plugged and unplugged repeatedly or a large transformer that needs additional support. These components often require a stronger mechanical connection than surface mounting alone can provide.
That's where Through-Hole Technology (THT) comes in.
Unlike SMT, where components are mounted directly onto the surface of a circuit board, THT involves inserting component leads through pre-drilled holes in the circuit board and soldering them into place, providing both an electrical connection and additional mechanical strength.
STEP 1 — COMPONENT PREPARATION: Components are identified, verified and, when necessary, their leads are formed or trimmed to meet assembly requirements.
STEP 2 — COMPONENT INSERTION: Components are inserted into designated holes on the circuit board, either manually or with the assistance of specialized equipment.
STEP 3 — SOLDERING: Depending on the assembly, components may be soldered by hand or using automated soldering equipment. The video below shows the ERSA Versaflow and The solder creates the electrical connection between the component leads and the circuit board.
STEP 4 — INSPECTION: Solder joints, component placement and workmanship are inspected to verify they meet applicable quality standards and customer requirements.
And just like SMT, additional steps such as cleaning, testing and inspection may be required depending on the customer's specifications. Many of the products we manufacture at Matric require a combination of SMT and THT, allowing us to use the right assembly method for each component.