Teradyne Inc

10/19/2026

Roy Chorev joined Teradyne straight out of school, and he’s still here. What kept him? Interesting problems, great colleagues, and a culture where good ideas count for more than titles. 💡

Roy now leads our Compute Test Division as VP & GM, and his team is growing. We’re hiring across a wide range of roles to help test the processors behind AI, data centers, and next-generation computing.

If you want work where your expertise matters from day one, we’d love to meet you.

🔗 Explore open roles: https://hubs.li/Q04B3XCg0

10/16/2026

Meet Matthew Martinez, our HR AI Co-op. 🌟

At Teradyne, interns and co-ops aren’t on the sidelines. They take on real projects, bring new ideas and see their work make an impact. Matthew is showing what that looks like as he helps shape how AI supports our people.

Interested in an internship or co-op where your ideas turn into results? Learn more about our programs here ➡️ https://hubs.li/Q04zNcZD0

10/14/2026

🗣 At ITC, hear from Teradyne’s Matt Knowles on how design and test come together. Visit booth 204 to see Siemens Streaming Scan Network (SSN) over PCIe running live on UltraFLEXplus, using Siemens Tessent Silicon Executable software integrated with Teradyne’s UltraPort server and IG-XL.
Stop by to see it for yourself!

10/14/2026

🗣 Day 1 at SEMICON West! Teradyne’s Roy Chorev and Universal Robots’ Mike DeGrace show how test and automation work side by side at booth 1143, with UltraFLEXplus S and a Universal Robots cobot.
Stop by through October 15 to see it for yourself, and join our 15-minute talks today and tomorrow.

10/13/2026

Teradyne has integrated Siemens’ Tessent Silicon Executable into UltraPort and IG-XL on UltraFLEXplus, so Streaming Scan Network content reaches the device over its own PCIe interface. In our latest blog, we explain how it carries DFT work from Tessent to the tester, the bench, and the system.

Read the full article:

Teradyne UltraFLEXplus delivers Siemens Tessent Streaming Scan Network content over PCIe through UltraPort and IG-XL, with failure data in Tessent formats.

10/12/2026

Today Teradyne and FormFactor announced a strategic collaboration to develop and validate complete test solutions for AI and high-performance compute devices, combining Teradyne’s automated test platforms with FormFactor’s probe, interface and device characterization expertise.

Every test cell is a tightly coupled system, and its performance hinges on how precisely its many subsystems operate as one. As devices move into advanced packaging, high-bandwidth memory and silicon photonics, how well those pieces come together decides how quickly a new device moves from technology development to high-volume manufacturing.

Our customers move fastest when they have a choice of validated solutions. That is why Teradyne is committed to an open ecosystem, and this collaboration is the latest step in that strategy.

Read the announcement → https://hubs.li/Q04zYd5n0

10/12/2026

📢 Teradyne Introduces UltraFLEXplus S Series for Edge AI Applications

Today we introduced UltraFLEXplus S, a single-module system that extends the UltraFLEXplus architecture to maximize output per square meter for high-mix, variable-volume manufacturing. It brings engineering and production test, including tri-temperature, to MCUs, multimedia, and devices. The first model, UltraFLEXplus S24, is a 24-slot system that shares the UltraFLEXplus instrument ecosystem, IG-XL software, and test program library, so existing engineering investment carries over.

🔗Learn more: https://hubs.li/Q04zTJg50

10/08/2026

Heading to ? Join us as we share how Teradyne helps our customers test and manufacture AI hardware, from wafer to data center.

🔹 Booth #1143: See live demos and drop in for Teradyne Talks, 15-minute sessions with our experts on Tuesday and Wednesday.
🔹 Test Vision Symposium: Hear our experts, presentations include a keynote on the advanced packaging roadmap through test, plus a session, a panel, and AI-focused posters.
🔹 Physical AI in Semiconductor Manufacturing: Mike DeGrace of Robots explores enabling Physical AI in semiconductor manufacturing, alongside NVIDIA, Lam Research, Applied Materials and Siemens.

👉 Add our sessions to your SEMICON West agenda: https://bit.ly/47N72QQ

10/07/2026

We're so thrilled to be exhibiting at the Society of Women Engineers annual conference in Boston, November 5-6!

Be sure to check us out at booth #7028 at the career fair.

Want to interview with us on the spot? Upload your resume here for a chance to be scheduled with our recruiting team ⬇️
https://bit.ly/4APUR3c

10/07/2026

The pursuit of innovation continues at . From wafer to data center, discover how Teradyne advances test and automation for technologies shaping what's next.