BIWIN

BIWIN BIWIN produces high-quality flash storage in embedded, consumer, corporate and industrial.

BIWIN's experience in production (along with its complete packaging, testing, and production lines) ensures BIWIN products are superior in performance, earning BIWIN many awards and a reputation for providing global customers with high-quality storage products. At the end of 2021, the company opened its latest facility, BIWIN Huizhou Science and Technology Zone, with a state-of-the-art R&D lab and

110,000 m2 of production. Our founders started in the flash storage business in Shenzhen, China in 1995, embracing the "WIN-WIN" business philosophy that would later become the hallmark for BIWIN. In 2009 they made a key decision for the business: to add IC encapsulation (or IC packaging) process into the factory. A remarkable milestone that the vast majority of competing companies still don't have (they outsource the process or buy the packaged IC packaged). This successful step led to the 2010 creation of the company we know today, BIWIN Storage Technology Company.

08/25/2026

BIWIN is excited to connect with industry leaders at embedded world Exhibition&Conference North America 2026, showcasing our latest memory and storage solutions for the enterprise, automotive, industrial, PC OEM, and embedded markets.

Highlights:

👉 SP5002 Enterprise SSDs- high-speed, high-capacity E3.S & E1.L enterprise SSDs for AI and hyperscale infrastructure, drastically reducing data center rack footprints with up to 61.44 TB per single slot and 14,700 MB/s read performance in a cost-efficient design.

👉Industrial Storage Solutions

Engineered for harsh and mission-critical industrial environments, our wide-temperature eMMC, LPDDR, and 2.5” SATA / mSATA / M.2 SSDs deliver high endurance, energy efficiency, and long-term lifecycle support.

👉 ePoP5X – With an ultra-thin 0.54 mm profile that reduces PCB area by up to 75%, ePoP5X integrates LPDDR5X + eMMC 5.1 in a single package—offering up to 8,533 MT/s DRAM and 400 MB/s storage, ready to accelerate mass adoption of AI and AR applications.

👉 Mini SSD - Winner of TIME "Best Inventions of 2025" and an EDISON Award--announces the latest model BL130 Mini SSD with 3700/3400 MB/s and the size of a small coin.

📍 Booth number: #6104

📍 Location: Anaheim Convention Center, Anaheim, CA

📅 Dates: Sep 22–24, 2026

BIWIN is proud to announce a new strategic partnership with TERA Indústria de Semicondutores S.A. to expand the manufact...
08/12/2026

BIWIN is proud to announce a new strategic partnership with TERA Indústria de Semicondutores S.A. to expand the manufacturing and distribution of memory and storage solutions in Brazil. 🎉

By combining BIWIN’s global expertise in memory and storage technology with TERA’s local manufacturing capabilities in Manaus, this collaboration will support localized production, technology exchange, and the development of advanced solutions for Brazil’s growing electronics ecosystem. 🏭

The partnership will focus on delivering a broad portfolio of memory and storage products, including embedded storage solutions, DRAM modules, NAND Flash-based products, PCIe NVMe SSDs, and industrial-grade solutions to serve OEM and electronics customers in Brazil.

Together with TERA, we are taking another step toward building a more resilient semiconductor supply chain and bringing innovative memory solutions closer to customers around the world. 🌏

👇 More details:

https://www.biwintechnology.com/biwin-tera-semiconductor-partnership-brazil/

08/07/2026

AI is rewriting the rules of computing—and memory and storage must evolve just as fast. ↗️

At FMS 2026, BIWIN showcased how we’re addressing the demands of the AI era. Our comprehensive memory and storage portfolio spans applications from the data center to the edge, with enterprise storage solutions drawing strong interest from industry leaders seeking greater performance, capacity, efficiency, and scalability for increasingly data-intensive workloads.

Behind these innovations is BIWIN’s end-to-end capability in product design, controller development, advanced packaging, and manufacturing—enabling us to transform ideas into scalable solutions built for real-world deployment. 🚀

Thank you to everyone who visited us, exchanged ideas with our team, and shared their perspectives on the future of AI, memory, and storage. 👏

The conversation continues.

That's a wrap on FMS 2026! 🎬BIWIN made a strong impression this week, showcasing a powerful lineup of memory and storage...
08/07/2026

That's a wrap on FMS 2026! 🎬

BIWIN made a strong impression this week, showcasing a powerful lineup of memory and storage innovations—from AI-ready enterprise solutions to ultra-compact embedded designs. 🚀

It was the perfect opportunity to demonstrate what truly sets us apart: end-to-end vertical integration. From wafer sourcing and in-house controller development to advanced packaging and high-volume manufacturing, we deliver complete, tailored solutions across enterprise, embedded, OEM, industrial, and automotive markets.

💡 A closer look at our enterprise portfolio:

For AI workloads, data centers, and hyperscale infrastructure, we highlighted our high-speed, high-capacity enterprise storage ecosystem—including CXL memory modules, PCIe 4.0/5.0 NVMe SSDs, and SATA SSDs—in the industry's most critical form factors (E1.L, E3.S, and 2.5-inch U.2).

Thank you to everyone who visited our booth. We look forward to seeing you at the next event!

BIWIN is bringing the heat to FMS: Future of Memory and Storage 2026! 🔥Visit Booth #619 to explore BIWIN’s latest advan...
08/07/2026

BIWIN is bringing the heat to FMS: Future of Memory and Storage 2026! 🔥

Visit Booth #619 to explore BIWIN’s latest advancements, designed to address the escalating demands of AI model training and high-performance computing:

🔹 Mini SSD – Winner of TIME "Best Inventions of 2025" and an EDISON Award--announces the latest model BL130 Mini SSD with 3700/3400 MB/s and the size of a small coin.

🔹 LPDDR5X – Breaking barriers with 9600 MT/s data rate and 128 Gb density, all within a highly integrated 12.4 x 8.2 mm FBGA package for next-gen mobile devices.



BIWIN at FMS 2026: Storage built for the AI era.We're showcasing a complete storage and memory products portfolio:✅ Ente...
08/05/2026

BIWIN at FMS 2026: Storage built for the AI era.

We're showcasing a complete storage and memory products portfolio:

✅ Enterprise: CXL memory modules, PCIe 4.0/5.0 NVMe, and SATA SSDs in all key form factors (E1.L, E3.S, and 2.5-inch U.2).

✅ Industrial/Automotive: eMMC, LPDDR, UFS and 2.5-inch SATA, mSATA, and M.2 SSDs engineered for extreme reliability and critical missions.

Star Products:

⭐ SP5002 Enterprise SSDs - High-speed, high-capacity E3.S & E1.L enterprise SSDs for AI and hyperscale infrastructure.

⭐ TDS601 Industrial SSD - Industrial Wide-Temperature SSD for video surveillance and edge computing.

⭐ TAU208 Automotive UFS 3.1 - AEC-Q100 compliant automotive-grade storage featuring 3D TLC NAND for fast, reliable data performance.

📍 Visit BIWIN at Booth #619 to explore the future of enterprise storage.



08/05/2026

Thanks to NVM Express for stopping by our booth at FMS 2026!

BIWIN is showcasing enterprise storage solutions, including PCIe 4.0/5.0 NVMe SSDs, SATA SSDs, and CXL 2.0 memory expansion modules across multiple form factors — 2.5-inch, U.2, E1.L, and E3.S — designed to power AI, cloud, and hyperscale data centers.

Visit BIWIN at Booth #619 to explore the future of enterprise storage.

🔗
https://www.biwintechnology.com/product/sp5002-enterprise-pcie-ssd/

https://www.biwintechnology.com/product/sp50y-pcie-gen5-nvme-enterprise-ssd/

https://www.biwintechnology.com/product/sp509-enterprise-pcie-ssd/

As AI training, real-time inference, and cloud-native workloads continue to grow, enterprise storage must deliver more t...
07/31/2026

As AI training, real-time inference, and cloud-native workloads continue to grow, enterprise storage must deliver more than speed—it requires workload-specific performance, scalability, and efficiency.

BIWIN’s enterprise storage portfolio covers PCIe 4.0/5.0 NVMe SSDs, SATA SSDs, and CXL 2.0 memory expansion modules, supporting multiple form factors including 2.5-inch, U.2, E1.L and E3.S to meet the evolving needs of modern data centers.

Built for diverse enterprise workloads:

🔹 SP5002 (QLC NAND) — Optimized for read-intensive applications such as AI data lakes, distributed storage, and large-scale archives, providing high capacity with improved cost efficiency.

🔹 SP50Y Enterprise PCIe 5.0 SSD — Powered by a next-generation controller and NVMe 2.0 compliance, SP50Y delivers Gen5 performance with capacities up to 16 TB and 1/3 DWPD endurance for demanding AI, cloud, virtualization, and database workloads.

🔹 SP509 & SP519 — Deliver low latency, consistent QoS, and high reliability for AI training, inference, HPC, cloud services, and mission-critical databases.

Visit BIWIN at FMS 2026 to discover more:

📍 Booth: Booth #619
📍 Location: Santa Clara Convention Center, California, USA
📅 Dates: Aug 4–6, 2026

Address

8725 NW 18th Terrace, Suite #400
Miami, FL
33172

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