10/08/2026
🎉 The 5th GMIF2026 Innovation Summit has officially wrapped up in Shenzhen!
Under the theme "The Future Built on AI Memory and Storage," we welcomed speakers and partners including Morgan Stanley, Peking University's School of Integrated Circuits, Samsung Semiconductor, Sandisk, Solidigm, Arm, Silicon Motion, BIWIN, Lenovo, NEXWISE, Infplane, SYNCORE, Dify, PARATERA, Genstoraige, Numbers Law, and OKN Technology.
💡 Key takeaways from the day:
🔹 AI inference is raising the strategic value of memory and storage, and the "memory wall" is driving innovation in architecture and advanced packaging.
🔹 HBF and heterogeneous multi-media architectures (HBM + NAND + RRAM) are emerging as ways to balance performance, capacity, and cost.
🔹 Data tiering and memory offloading, powered by high-capacity QLC SSDs, are becoming core to AI system design.
🔹 Cloud, edge, and device are shaping new memory & storage demands across AI PCs, smart vehicles, AI/AR glasses, and robotics.
🔹 From compute buildout to "token factories," deeper coordination across compute, memory, storage, networking, and software is a defining trend.
A heartfelt thank you to our co-hosts, the Shenzhen Memory Industry Association (SMIA) and Peking University's School of Integrated Circuits, as well as every speaker, partner, and attendee who made this fifth edition possible. 🙏
Five years in, GMIF will keep building a more specialized, differentiated platform for the global memory and storage community. See you next year! 👋
