Kupros, Inc.

06/08/2026

Something big is coming from Kupros.

We’ve spent the last few years proving that electronics don’t have to stay flat, rigid, wired, and outsourced.

Circuits, antennas, sensors, and shielding should be built directly into the part, right where they belong.

We’re getting ready to show the next step.

Cu29 is just the beginning.

04/20/2026

It’s been a busy late winter and early spring for Kupros, and we’re back on the road again.

This time, we’re heading to Miami for eMerge Americas (April 22–23, 2026), where we’ve been selected as a finalist in the pitch competition.

We’ll be pitching on stage and showcasing Kupros on the floor, bringing 3D printed electronics into the conversation at the intersection of space and defense.

If you’re at eMerge this week, come find us. We’ll be showing how Cu29 is enabling embedded electronics directly into printed structures, turning standard 3D printers into something a lot more powerful.

Looking forward to the conversations, the competition, and seeing what everyone else is building.

More to come from Miami.

04/15/2026

We won!!!

Kupros has been awarded the RAPID + TCT Materials Award 2026.

This recognition places Cu29 alongside some of the most advanced work in additive manufacturing, including organizations like NASA and General Motors.

What started as a technology out of Naval Surface Warfare Center Crane has evolved into the world’s first all-metal, conductive filament for FDM, enabling real electronics to be printed directly into parts.

This milestone belongs to our team. The engineering effort behind Cu29, from materials development to process optimization, is what made this possible.

Thank you to NSWC Crane for the foundation and continued support.

No polymers. No inks. No post-processing.
Just functional electronics, printed directly into parts.

We’re proud of this moment.

And we’re just getting started.

04/08/2026

Kupros is honored to be selected as a finalist for the Rice University Veterans Business Battle.

We’re excited to be pitching alongside an incredible group of veteran-led companies and showcasing how Cu29 is redefining additive manufacturing electronics, enabling circuits, antennas, and sensors to be printed directly into parts.

Looking forward to being in Houston and connecting with the VBB community.

04/01/2026

We’re competing for the 2026 eMerge Americas Fan Favorite Award, and this one is decided entirely by votes.

You can vote up to 10 times per day, and it resets daily.

If you want to support what we’re building at Kupros, here’s the link:
https://pr.easypromosapp.com/p/999577

Appreciate everyone who takes a minute to vote.

Vote for your Favorite 2026 Startup!Select your favorite startup from the 2026 eMerge Americas Startup Accelerator + Showcase cohort to show your support.

03/23/2026

Kupros has been selected as a featured startup in the 2026 eMerge Americas Accelerator + Showcase.

We’ll be in Miami this April exhibiting and pitching Cu29, our all-metal conductive filament that enables embedded electronics to be manufactured directly into parts using standard 3D printers.

If you’re attending, come find us and let’s connect.

03/16/2026

Kupros is set up and ready at AMUG 2026 in Reno.

We’re excited to be part of the Startup Launchpad and to connect with the additive manufacturing community this week. If you’re attending the conference, come find us at Booth 208 and say hello.

We’ll be talking about Cu29, our all-metal conductive filament designed to print embedded electronics directly using standard FDM 3D printers.

Looking forward to meeting everyone here in Reno.

03/15/2026

Kupros is excited to be at AMUG 2026 in Reno, Nevada this week as part of the Startup Launchpad.

We’re getting set up today and looking forward to connecting with the additive manufacturing community when the event opens this afternoon.

If you're attending AMUG, stop by and say hello. We’ll be sharing what we’ve been building with Cu29, our all-metal conductive filament for printing embedded electronics directly with standard FDM workflows.

Looking forward to seeing everyone in Reno.

02/10/2026

We’ve been doing some exploratory work printing conductive traces directly on an FDM 3D printer using a Prusa XL with a 5-toolhead setup.

This clip shows Cu29 being printed as part of a multi-material workflow. No foil, no paste, no post-processing. Just standard FDM tool changes and printed geometry.

For us, the focus is less about “can it conduct” and more about where geometry, interfaces, and thermal paths become the real constraints once you start embedding power and signal into polymer parts.

Still early testing, but useful data for anyone thinking about embedded electronics, structural electronics, or multi-material additive manufacturing.

Happy to compare notes with others working in this space.

01/29/2026

We recently pushed over 300 amps through a FDM-printable metal conductor during destructive electrical testing.

The goal wasn’t to show something off, but to understand real behavior and failure modes rather than relying on assumptions about “conductive filament.” In this setup, we discharged a supercapacitor bank through printed lengths of Cu29. The current exceeded the limits of our digital meters and pegged an analog ammeter beyond 300 A. At lower voltages, heating was minimal and stable for short-duration tests. At higher voltages, we saw localized arcing at connection points, but no bulk thermal runaway or filament failure.

This is exploratory testing, not a published spec or qualification. It’s part of the process of learning how printed metal conductors actually behave under extreme electrical stress, especially for embedded power and structural electronics.