High Density Packaging Users Group

09/19/2020

HDP User Group is pleased to announce it is hosting a free webinar that will provide its members and others in the electronic industry the latest information on issues facing Aerospace electronics. Worldwide Experts in the field will share their knowledge and concerns during the 3-hour Webinar, which is open to all interested parties. Visit the HDP website for more information.

08/30/2016

ANNOUNCING THE HDP USER GROUP 2016 SEPTEMBER MEETING IN NASHVILLE TENNESSEE, WEDNESDAY, SEPTEMBER 21!

The September 2016 Fall Members Meeting will be held the 21st and 22nd of September in Nashville, Tennessee, USA. The meeting will be hosted by Kyzen. Meeting registration is required.

If you'd like to attend, please go to our website at www.hdpug.org, no later than September 9th.

Meeting Location:
iCenter, Inc.
5259 Harding Place
Nashville, TN 37217

Agenda:

Wednesday 21 September – Open Day for Members and Guests

8.00 Registration, coffee and socializing
8:30 Opening of the meeting – Marshall Andrews, HDPUser Group
Self-Introduction of Participants - All
Projects Review/Status Update Jack Fisher
9:00 Assembly and Pb Free Projects
Solder Joint Eval. Of New Surface Finishes – Jack Tan (Webex)
Component Rework Reliability – Mei Ming Khaw
Low Ag Alloy Solder Paste Reliability
Harsh Use Environment - Richard Coyle, Larry Marcanti
10:20 Group Picture & Break
11:05 High Frequency Projects
Physical Reliability of TSV Enables 3D-ICS– Yaw Obeng
High Frequency Measurements Phase 2 – Karl Sauter
11:50 Guest Presentation – Gene Weiner
12:35 Lunch
1:50 PWB Technology and Design Projects
Lead Free PWB Materials Reliability Phase 5 – Alun Morgan
Future HDI – Joe Smetana call in
Digital Speckle Correlation -Thilo Sack
Design Related PWB Material Damage – Alun Morgan
3:15 Break - 15 minutes
3:45 New Infrastructure Projects
Optoelectronics II – Brice Achkir
Anti Counterfeit of Electronics Phase 3 – Michelle Lam
4:30 New Project Ideas Follow Up Status – Jack Fisher
4:45 Feedback from Guests
5:00 Close of meeting
5:10 Plant Tour
7:00 Dinner

Thursday 22 September – Members Only Session

8:00 Coffee and socializing
8:20 Opening of the meeting, introductions – Marshall Andrews, HDP User Group
8:35 BOD report
Projects Review/Status Update– Chair: Jack Fisher, HDP User Group
8:45 PWB Technology and Design Projects
PTH Lifetime Predictor for TC -  Yoshi Hiroshima
Pad Cratering – Closeout Thilo Sack
Board Thickness Effect on ATC Reliability – Eric Lundeen
10:10 Break
PWB Environmental Life Cycle Analysis 2 - Erkko
Ultra-Thin HDI Multi-Purpose Test Vehicle – Erkko Helminen
Multiple Lamination – Joe Smetana Call in
11:40 – Lunch
PWB Back Drilling Failure Analysis Phase 2 – John Davignon
Counterfeit PCB materials –CloseoutTony Senese
1:00 High Frequency Projects
Smooth Copper Signal Integrity – Jim Fuller
High Frequency Flex - Glenn Oliver
1:50 Assembly/Pb Free Projects
Board Mounted Power Supply evaluation – Dan Prezioso
Electro-Chemical Migration Closeout – Mike Bixenmen
2:50 Break - 15 minutes
Mini Power Cycles - Trent Uhling
Press-Fit Technology – Closeout Lars Bruno
FCBGA Package Warpage 2 - Closeout Kirk VanDreel
X-Ray Tomography Signal Integrity - Dave Love
SAC Aging 3 - Richard Coyle
5:05 New Project Ideas
Any Other Business and Feedback from Attendees
5:35 Close of meeting
7:00 Dinner

06/03/2016

We got some good press on our meeting last week, here are two articles:

http://flex.iconnect007.com/landing/flex/article?skin=flex

http://www.iconnect007.com/index.php/article/97970/global-technology-development-hdp-user-group-european-meeting-2016/97973/?skin=pcb #97970

White Paper: With the move from low-mix to high mix-manufacturing, the need for optimizing throughput across multiple batches of different product is critical to maximizing manufacturing output. Overall line utilization... View White Paper

06/03/2016

Just back from a great meeting in Luxembourg. Two full days of technical sessions and a fantastic factory tour from our hosts, Circuit Foil. Here's a group photo taken on the first day.

04/23/2016

The next HDPUG Meeting will be held the 25th and 26th of May in Luxembourg! May 25 will be an open meeting - you don't have to be a member to join the meeting. If you're interested, just send a message or friend us and we'll send you the registration form.

AGENDA:

Wednesday 25 May – Open Day for Members and Guests
8.00 Registration, coffee and socializing
8:30 Opening of the meeting – Marshall Andrews, HDP User Group
8:45 Assembly and Pb Free Projects
Low Ag Alloy Solder Paste Reliability
Harsh Use Environment Alloy Evaluation
Component Rework Reliability
10:00 High Frequency Projects
X-Ray Tomography Signal Integrity
High Frequency Measurements Phase 2
TSV Failure Detection and Metrology
10:45 Guest Presentation – Prof. Dr.-Ing. Klaus-Dieter Lang, Head of the Institute, Fraunhofer IZM
11:45 Lunch
12:45 PWB Technology and Design Projects
Future HDI
Design Related PWB Material Damage
Counterfeit PCB materials
Lead Free PWB Materials Reliability Phase 5
2:00 New Infrastructure Projects
Optoelectronics II
Anti Counterfeit of Electronics Phase 3
2:40 New Project Ideas Follow Up Status
Digital Speckle Correlation
5.00 Start of Plant Tour Circuit Foil
7:00 Presentation and Buffet Dinner at Circuit Foil

Thursday 26 May – Members Only Session
9:15 PWB Technology and Design Projects
Board Thickness Effect on ATC Reliability
Pad Cratering
PWB Environmental Life Cycle Analysis 2
PTH Lifetime Predictor for TC – 25 minutes, Yoshi Hiroshima
Ultra-Thin HDI Multi-Purpose Test Vehicle
Multiple Lamination
PWB Back Drilling Failure Analysis Phase 2
12:10 – Lunch
1:10 High Frequency Projects
Smooth Copper Signal Integrity
High Frequency Flex
1:45 Assembly/Pb Free Projects
Board Mounted Power Supply evaluation
Electro-Chemical Migration
Mini Power Cycles
Press-Fit Technology
SAC Aging 3
FCBGA Package Warpage 2
7:00 Dinner

04/13/2016

Nice to see some fans or our organization out there!

04/07/2016

PWB Back Drilling Phase 2 Project Notice

The PWB Backdrilling Phase 2 project has started. If you would like to participate in the project please contact the facilitiator John Davignon or go to http://hdpug.org/pwb-back-drilling-phase-2 and click on subscribe. Below is a brief summary of the project.

We learned in Phase 1 of the project that the shallow back-drill fails earlier relative to the medium and deep back-drill. Phase 2 will focus on the shallow back-drill but on a much thicker 30 layer (compared to the phase 1 - 20 layer).

Phase 1 also proved that we could electrical measure stub length from a single layer. Phase 2 will expand this concept and measure stub lengths and signal performance/effect from various layers/depths within the 30 layer board

We learned in Phase 1 of the project that the shallow back-drill fails earlier relative to the medium and deep back-drill. Phase 2 will focus on the shallow back-drill but on a much thicker 30 layer (compared to the phase 1 - 20 layer).

03/22/2016

i-Connect 007 interviews us at the APEX meeting! Jack Fisher, Brian Butler, Wallace Ables, Mike Bixenman and John Davignon gave an interview about HDP at the conference. Here is the link: http://www.realtimewith.com

03/22/2016

HDP User Group Announces MacDermid Enthone Electronics Solutions as its Newest Member!

The High Density Packaging (HDP) User Group headquartered in the United States is pleased to announce that MacDermid Enthone Electronics Solutions has become a member.

“We are very interested in collaborating with other member companies, working together to overcome the technological challenges of next generation electronics, and providing high performance materials solutions for several of the HDP project programs.” said Michael Coll, Director of Electronics Specialties for MacDermid Enthone Electronics Solutions. MacDermid Enthone is a part of the MacDermid Performance Solutions group of businesses.

“MacDermid Enthone Electronics Solutions is the newest member of HDP User Group. MacDermid Enthone has a long history of delivering advanced technologies to the industry. We welcome their participation in our Smooth Copper Signal Integrity project which is studying the relationship between surface roughness measurements and Insertion Loss of various copper surface finish treatments”, said Marshall Andrews, Executive Director of HDP User Group.

As a Member, MacDermid Enthone will join over 50 of the major companies involved in the design and manufacturing of electronic products worldwide in addressing the major technical and environmental issues facing the industry today. Their participation will complement the other member companies and help keep HDP User Group technical projects moving forward.

About MacDermid Performance Solutions

MacDermid Performance Solutions is a subsidiary of Platform Specialty Products Corporation. Our companies manufacture a broad range of specialty chemicals and materials which are used in multi-step technological processes that enhance the products people use every day. Our innovative materials and processes are creating more opportunities and efficiencies for companies across key industries – including electronics, graphic arts, metal & plastic plating, and offshore oil production.

For more information, visit www.MacDermidPerformanceSolutions.com or contact Don Cullen at [email protected], +1 203.575.5700.

03/02/2016

HDP User Group, in partnership with SEMI, will have a table exhibit in the SEMICON Southeast Asia (SEA) show to be held in Penang from 26th to 28th April 2016. This premier semiconductor trade event in SEA will feature forums on the Internet of Things (IoT) and microelectronics ecosystem, the automation in high tech manufacturing in SEA, sustainability (green) manufacturing, and many more. HDP hopes to use this opportunity to expand our visibility to more than 185 companies and 7000 visitors in this industry, who are expected to attend the show. If you attend please come and visit with Jack Tan who is our project facilitator in Asia.

02/12/2016

Every organization has its dark side. Here is the "rowdy subset" of the HDPUG membership. This photo was taken outside of SEMI.org headquarters in Santa Clara where we just wrapped up our annual Silicon Valley meeting.

02/10/2016

Pictured. Bill Birch PWB Interconnect (HDP member), Kirsten Smit-Westenberg, EIPC Executive Director, and Emma Hudson Underwriters Labs Europe (HDP Member) at the EIPC Winter Conference in Dresden 21st and 22nd January 2016. Bill gave a presentation on Materials testing techniques developed in the HDP User Group Pb Free PWB Materials Reliability project.