Nordson Electronics Solutions

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Carlsbad, CA
Nordson Electronics Solutions

Your products. A lifespan of reliability. Plasma, coating, dispensing, and selective soldering.

We design surface treatment, conformal coating, precision dispensing, and selective soldering solutions that make reliable electronics an everyday reality. Through our ASYMTEK, MARCH, and SELECT brands, we supply the world's semiconductor, printed circuit board, and precision assembly manufacturers with the innovative fluid dispensing and surface treatment solutions they need to protect sensitive electronics.

10/13/2026

🚀 SEMICON West starts today!

As AI and high-performance computing drive larger package sizes and increased production volumes, manufacturers need packaging solutions that deliver both precision and scale.

ASYMTEK Vantage® XL is designed to meet that challenge. Built for large-format panel-level packaging, it combines integrated thermal management to mitigate warpage, independent dual-valve IntelliJet® jetting for high-precision UPH, confocal height sensing for reflective or glass panels, blazing fast multi-fiducial capture, and patented real-time skew correction to help maximize throughput, improve yield, and maintain process consistency.

Visit Nordson at Booth #5844 to see the ASYMTEK Vantage® XL in action and learn how we're helping manufacturers scale the next generation of advanced semiconductor packaging applications.

Booth 5844 | Moscone Center | San Francisco
October 13-15, 2026
Learn more: https://buff.ly/JmUNR5A

10/06/2026

SMTA Guadalajara starts tomorrow!

If you're focused on improving product quality, increasing yield, reducing manufacturing costs, and meeting demanding production schedules, stop by Booth 810 to learn about the latest Nordson conformal coating and precision fluid dispensing solutions. From coating consistency and process control to precise, repeatable material application, our technologies help electronics manufacturers optimize PCBA production and reliability.

We look forward to discussing your manufacturing challenges and showing how Nordson can help you achieve better outcomes across the production line.

Booth 810
October 7-8, 2026
Expo Guadalajara Salón Jalisco Halls D & E
Mariano Otero
Esquina Av de las Rosas
Guadalajara, Jalisco | Mexico

Learn more:
https://buff.ly/EGuYrd8
https://buff.ly/q4ievFV

09/29/2026

Liam's ready. Are you?

Join us at SEMICON West 2026 and stop by Booth #5844 to see the new Vantage® XL panel-level packaging solution in action.

October 13-15, 2026
Moscone Center | San Francisco

Designed for larger advanced packages on large-format panels, the Vantage XL processes more devices simultaneously to increase throughput while maintaining exceptional accuracy and repeatability.

At the booth, Liam Thorp will be demonstrating key capabilities including confocal height sensing and ultra-fast multi-fiducial capture, two critical features that accelerate underfill applications for large-format panels.

SEMICON West is all about turning ideas into impact, and we're excited to share how Nordson solutions are helping manufacturers improve yield, reduce variability, and bring next-generation devices to market faster.

Stop by, say hello, and catch a live demo with Liam!

Nordson Electronics Solutions | Booth #5844

Check it out on our website. https://buff.ly/JymzI5F

09/08/2026

When every micron matters.

Canvas® fluid dispensing software's Dot Placement Verification feature helps ensure fluid is dispensing exactly where it's intended. By automatically verifying dot placement against defined tolerances, manufacturers can identify alignment issues before they impact product quality, yield, or throughput.

The result? Greater confidence in dispense accuracy, reduced process variation, and more consistent production performance.

And that's just one example. Dot Placement Verification is part of a comprehensive suite of Canvas software features that help manufacturers achieve the precision, repeatability, and reliability demanded by today's advanced packaging applications.

09/01/2026

Dual-head jetting can dramatically increase throughput, but what happens when device pitch varies or individual parts are skewed in the carrier?

Traditional fixed-pitch systems struggle to compensate for these real-world production challenges. The result can be reduced efficiency, lower yield, and missed productivity opportunities.

The IntelliJet® Jetting System and Canvas® software, address these challenges with patented Real-Time Correction technology that automatically adjusts for:

💫 Irregular device pitch
💫 ndividual part skew
💫 Global workpiece skew
💫 X/Y translation offsets

By dynamically correcting for variation during production, manufacturers can leverage simultaneous dual-head jetting to increase throughput while maintaining precision and yield.

08/25/2026

💡 Heading to SEMICON Taiwan next week?

We're excited to officially introduce the new ASYMTEK Vantage® XL, engineered specifically for large-format panel-level packaging applications. With integrated thermal management, dual-valve jetting capabilities, and support for panels up to 510 × 515 mm, Vantage XL is designed to help manufacturers improve throughput, optimize yield, and scale production for next-generation semiconductor packages.

Get the details on our newest dispensing platform here. https://www.nordson.com/en/products/electronics-solutions-products/asymtek-vantage-series-next-generation-fluid-dispensing-capabilities

Then stop by Booth I2308 to connect with our team and learn how Vantage XL is helping drive the future of advanced packaging.

08/11/2026

Heading to SEMICON Taiwan 2026?

Make plans to visit Nordson Electronics Solutions and Nordson Test & Inspection at Booth I2308. We'll be showcasing the latest innovations in semiconductor advanced packaging and discussing solutions that help improve yield, enhance process control, and accelerate time to market.

📅 September 2-4, 2026
📍 TaiNEX 1 & 2, Taipei
📍 Booth I2308

And here's a teaser: next week's Reliability News newsletter will feature an exciting new equipment announcement. Stay tuned for the reveal and be sure to stop by the booth to connect with our team and learn what's new.

08/04/2026

Smaller packages. Higher performance. Greater complexity.

The future of semiconductors depends on manufacturing processes that can keep pace.

🚀 Nordson Electronics Solutions helps address today’s advanced packaging challenges with precision underfill dispensing and plasma treatment solutions that improve reliability, process control, and yield across flip-chip, wafer-level, and emerging panel-level packaging applications.

Enabling the next generation of semiconductor innovation, one precise process at a time.

How are you addressing the challenges of next-generation semiconductor packaging? Let’s connect and explore solutions for improving process control and yield.

Start Here: https://buff.ly/8QjdxNY

07/28/2026

Fluid viscosity changes. Your dispensing process shouldn’t.

ASYMTEK’s patented Calibrated Process Jetting (CPJ) continuously monitors dispense mass to maintain volumetric consistency, while CPJ+ goes a step further by automatically adjusting dispensing pressure in real time to maintain target weight-per-dot.

The result:
💡 Greater process stability
💡 Higher yields and repeatability
💡 Reduced operator dependency
💡 Improved Cpk and consistent takt time

Learn how closed-loop dispensing can help improve accuracy, repeatability, and process capability for your demanding applications. https://buff.ly/tHe9sWc

07/07/2026

Get precision at every angle.

Take your conformal coating capabilities beyond flat surfaces with the ASYMTEK Fifth-Axis Tilt Accessory. Designed to add controlled tilting motion, this powerful upgrade lets you dispense at angles—opening the door to more complex geometries, improved coverage, and greater process flexibility.

With tilt angles from 0° to 30°, programmers can align the applicator more closely with component geometry, improving coating uniformity and reducing defects caused by overspray or missed coverage.

Ideal for:
✨ Vertical PCB surfaces
✨ Underneath low-clearance components
✨ Areas shadowed by tall or densely packed parts
✨ Complex, high-density assemblies

Learn more and download the data sheet: https://buff.ly/xPyVtEC

Address

2762 Loker Avenue W
Carlsbad, CA
92010

Website

https://www.nordson.com/electronics

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