07/11/2025
Greetings from THERLECT Co., Ltd.
Founded in 2019, THERLECT specializes in thermal management design, simulation, and manufacturing solutions for electronic products. Our team consists of experts with over a decade of experience in system and brand-level thermal R&D, helping clients optimize product performance, shorten development cycles, and reduce costs.
Our core services include:
Thermal Simulation & Consulting — Siemens STAR-CCM+, Flotherm, FloEFD, and SimCenter 3D
Thermal Module Design & Manufacturing — including V***r Chamber, Heat Pipe, Liquid Cooling, and our advanced Ultra-Thin Cooling Plate (UTCP) technology
Customized Thermal Components Production — for applications in servers, industrial PCs, networking, automotive electronics, and low-earth orbit systems
Our proprietary UTCP (Ultra-Thin Cooling Plate) technology offers superior heat flux and temperature uniformity, outperforming traditional v***r chamber solutions in high-power-density designs. It has been successfully adopted by multiple global brands in various industries.
THERLECT operates manufacturing facilities in Taiwan and Kunshan, both certified with ISO 9001 and IATF 16949 quality systems, providing complete one-stop service — from thermal design and prototyping to mass production and validation.
We sincerely hope to explore collaboration opportunities with your company and support your next-generation product development with innovative and reliable thermal management solutions.