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Monday 09:00 - 17:00 Tuesday 09:00 - 17:00 Wednesday 09:00 - 17:00 Thursday 09:00 - 17:00 Friday 09:00 - 17:00

新盛光電子InnoVictor Co., Ltd., 建國北路二段147號4F, Taipei (2026)

29/01/2026

SPARKLAN

Connectivity for the Next Generation of AI Systems

Edge AI is becoming more common across many industries. In manufacturing, healthcare, transportation, and security, AI systems are expected to respond faster and operate reliably in everyday environments. Instead of sending all data to the cloud, more processing is now handled closer to where data is generated, allowing AI applications to react more quickly and operate more efficiently.

Building on this market direction, SparkLAN is expanding its AI product portfolio, covering both AI BOX and AI Carrier Board solutions based on the NVIDIA Jetson AGX Orin platform. This approach provides a consistent AI computing foundation while allowing customers to select the form factor that best fits their system design and deployment needs.

Within this product framework, AI Box and AI Carrier Board platforms represent two complementary approaches to deploying AI in systems. AI Box solutions offer a ready-to-use option for faster rollout, while AI Carrier Boards provide greater flexibility for customized system design and deeper hardware integration. They support different stages and requirements of AI deployment without the need to redesign the entire system architecture.

These solutions are well suited for applications such as Autonomous Mobile Robots (AMR), where AI systems must operate continuously, respond to changing environments, and integrate smoothly into real operating conditions.

23/07/2025

✨New SiP & WiFi Module Ready to
Ship with Multi-Country Regulation

SparkLAN’s new SiP and Wi-Fi modules are now ready to ship with multi-country regulatory compliance, including FCC, CE, IC, and MIC certifications.The certified product lineup includes WNFS-267AXI(BT), AP6676SDSR, AP5811SA, and AP6611S. These certifications ensure seamless integration for global markets.

The modules integrate advanced Wi-Fi 6/6E and Bluetooth 5.3 technologies, supporting tri-band connectivity (2.4GHz / 5GHz / 6GHz) with robust security and low power consumption. Designed for industrial reliability, all models operate within a wide temperature range of -40°C to 85°C, ensuring stable wireless performance in harsh environments. With form factors ranging from compact SiP designs to M.2 2230 and Type 1216 LGA modules, SparkLAN offers flexible wireless solutions for diverse embedded, AIoT, and industrial applications.

SparkLAN’s multi-country certifications accelerate time-to-market for connected products in regulated markets worldwide.

10/07/2025

Next-Gen Connectivity Unleashed

WiFi 7 Module Power AI PC & Embedded System

SparkLAN’s WNFQ-293BE(BT) and WNSQ-293BE(BT) redefine embedded systems can expect from WiFi 7 connectivity. Built for fast-moving edge environments, the Wi-Fi 7 modules combine high-speed tri-band performance with robust industrial reliability—all in compact, flexible form factors.

Offered in both socketed and solder-down module types, WNFQ-293BE(BT) and WNSQ-293BE(BT) ensure easy integration across x86 and ARM platforms. With Linux driver support and flexible hardware interfaces including PCIe (Wi-Fi) and USB/UART (Bluetooth), developers can seamlessly embed wireless connectivity into a wide range of industrial and AIoT systems.

Designed with next-generation devices, WNFQ-293BE(BT) and WNSQ-293BE(BT) support advanced wireless features such as Multi-Link Operation (MLO), 160 MHz bandwidth, and 4096-QAM modulation, enabling smooth, low-latency communication even in congested or mission-critical environments. Whether deployed in AI-powered controllers, rugged gateways, or smart mobility platforms, the modules provide the speed, reliability, and scalability required for intelligent edge connectivity. WNFQ-293BE(BT) and WNSQ-293BE(BT) series deliver the wireless foundation to power the future of connected systems.

14/05/2025

How to Avoid a Costly PTCRB Test Failure and Build Smaller Cellular IoT Products with Inpai antenna

PTCRB certification is a critical step for any cellular device destined for the U.S. and Canadian markets. Failing these tests - particularly those required by AT&T, Verizon and T-Mobile can delay product launches and drive up costs with repeat certification attempts. One of the most common causes of failure can come from the antenna integration.

That’s where Inpai (P/N SR4L099), Antenova’s newly developed SMD antenna, changes the game - meeting PTCRB requirements with ease and enabling engineers to create smaller, more compact cellular devices without compromise.

More than just another 4G/LTE antenna, Inpai is a purpose-built solution that delivers sufficient performance to pass PTCRB certification even on reduced 100mm/110mm length ground planes giving a 20% size reduction compared to typically 120mm or more for standard cellular antennas.

SR4L099
Inpai is intended for use for 4G applications. This antenna is placed on the short edge of the host PCB and operates in the 4G bands worldwide. It is designed to meet the TRP requirements for all the networks in North America on a 100mm ground plane.

Type: 4G
Frequency : 698-2700MHz
Efficiency : 49%/61.5%/69%/55%
Dimensions : 35 x 8 x 3.3 mm

21/11/2024

Advanced Wi-Fi 7 Modules for AI PC and High-Performance IoT

SparkLAN introduces the WNFQ-290BE and WNSQ-290BE modules, designed to deliver high-performance wireless connectivity ideal for AI PC connectivity and advanced IoT applications. Powered by the Qualcomm QCC2073 chipset and equipped with Wi-Fi 7 (802.11be) technology, these modules provide fast, stable, and low-latency connectivity for data-intensive environments.

The WNFQ-290BE comes in an M.2 2230 E Key form factor, offering flexibility for platforms needing easy integration and space-saving design. Meanwhile, the WNSQ-290BE features a solder-down M.2 LGA 1620 form factor, making it well-suited for embedded systems where stability is key. These design options make both modules a great choice for AI-enabled PCs and other high-performance computing setups.

Both modules support 2x2 MU-MIMO and Multi-Link Operation (MLO) for efficient data transfer across 2.4GHz, 5GHz, and 6GHz bands. With 160MHz channel bandwidth and 4096-QAM modulation, they are optimized for high-throughput tasks, ensuring reliable communication in complex AI and IoT environments. The addition of Bluetooth 5.4 further enhances their versatility, supporting seamless short-range connectivity within IoT ecosystems.

29/08/2024

New Era - WiFi 7 Solution

SparkLAN introduces a groundbreaking lineup of Qualcomm-based WiFi 7 modules, redefining wireless connectivity with exceptional speed and reliability. The lineup includes the WNFQ-290BE Commercial Grade, WNFQ-291BEI Industrial-Grade, and
WNSQ-290BE LGA Type M.2 module, esigned for diverse tech environments, these modules ensure optimal high-speed data transmission and robust connectivity for future digital demands.

SparkLAN's WiFi 7 modules elevate high-speed digital communication with Tri-band capabilities (2.4GHz, 5GHz, 6GHz) and a 160MHz channel bandwidth, ensuring superior data transmission and full IEEE802.11 be/ax/ac/a/b/g/n protocol support. These modules, designed for diverse applications, feature cutting-edge Multi-link Operation (MLO), 16x16 MU-MIMO technology, and up to 4096 QAM modulation, offering unmatched flexibility and performance for both commercial and industrial needs.

11/07/2024

SparkLAN Advanced Wireless SiP Modules
- Compact, High-Performance WiFi 6/6E and Bluetooth SiP Solution

SparkLAN introduces three advanced wireless modules: AP5811SA, AP5875SA, and AP6611S. Both AP5811SA and AP5875SA feature a compact WLBGA package (Minimum size 7.9 x 7.3 x 1.0mm) with Internal X'tal and silver-plated RF shielding.

The AP5811SA is a WiFi 6E and Bluetooth 5.3 combo module, supports 2.4/5/6GHz bands, ensuring seamless roaming, enhanced security, and high-performance connectivity, ideal for tablets, OTT boxes, and mobile devices. The AP5875SA, featuring WiFi 6 and Bluetooth 5.1,offers robust performance with OFDMA, 1024QAM, TWT, and MU-MIMO technologies, making it perfect for dense environments.The AP6611S is a WiFi 6E and Bluetooth 5.3 module, supports 2.4/5/6GHz bands, ensuring versatile connectivity for various portable devices.

All three modules support Linux and Android drivers, providing flexibility and ease of integration across different platforms and are designed for wide temperature ranges -30°C ~85°C, ensuring reliability in diverse applications.

20/03/2024

Special Promotion- QCNFA364A WiFi 5 Module -

Enhance your connectivity with the SparkLAN QCNFA364A, a cutting-edge 802.11ac/a/b/g/n Dual-Band WiFi M.2 card. Powered by the Qualcomm Atheros QCA6174A-5 chipset, it offers fast download speeds up to 867Mbps on AC networks and 300Mbps on N networks. Ideal for high throughput enterprise networking, it supports advanced security standards like WEP, WPA, WPA2, WPA3, and more, ensuring your network is safeguarded against threats.

This QCNFA364A is perfect for a wide range of applications, from industrial PC to in-vehicle routers and beyond.The module offers connectivity for a broad spectrum of tech applications.

QCNFA364A
802.11ac/a/b/g/n WiFi Combo M.2 2230 (A-E KEY) Module (WiFi 5), Qualcomm Atheros QCA6174A-5, 2T2R

Chipset: Qualcomm Atheros QCA6174A-5
Antenna: 2 x IPEX MHF4 connectors, 2T2R
Interface: PCIe: WLAN
Support:Windows/Linux (Open Source)

15/11/2023

SparkLAN's Wi-Fi 6 & BLE SiP Module with TI Tech

SparkLAN has launched WL62031XI SiP (System-in-Package) module, which is a low cost, compact, and highly integrated product that combines TI SimpleLink™ WiFi 6 and Bluetooth® Low Energy companion ICs to enable the coexistence of WiFi and BLE with TI power-saving technologies, providing excellent performance, and it is beneficial for simplifying the design.

☑️ Affordable and Flexible Connectivity Solution

The WL62031XI module supports WiFi 6 2.4G and Bluetooth 5.3 Low Energy. It connects to the host processor via SDIO for WiFi and UART for Bluetooth. With Linux drivers available, seamless integration with application processors is ensured. Ideal for cost sensitive embedded systems, particularly those operating on Linux or RTOS hosts with TCP/IP support.

☑️ Efficient Wireless Data Module

The module with MAC addresses, baseband, and RF transceivers, offering speeds up to 50 Mbps. It supports various roles, like STA and AP, allowing direct connections to WiFi devices on different RF channels. With dimensions of 15 x 13 mm and an operating temperature range of -40 to +85°C, it's adaptable to different environments, providing exceptional performance and flexibility.

☑️ Multi-Field Connectivity: WL62031XI for IoT & IIoT

The highly integrated WL62031XI module can be widely applied in various fields, including home automation, healthcare, industrial sports and fitness, and grid infrastructure, meeting the diverse requirements of the emerging Internet of Things (IoT & IIoT). To accommodate the needs of different host processors, the host interface design is robust and provides rich array of configuration options.

22/08/2023

WiFi 7 – New Generation

Explore SparkLAN Wi-Fi 7 Solution

SparkLAN's upcoming the next stage solution WiFi 7 series products are poised to deliver exceptional wireless connectivity performance and a diverse range of options, catering to various application scenarios.

12/01/2023

Antenova introduces three high efficiency antennas for small Wi-Fi6 and Wi-Fi6E devices

Antenova Ltd, the UK-based manufacturer of antennas and RF antenna modules for IoT and M2M, is announcing three antennas for Wi-Fi6 and Wi-fi6E. They are a surface mounted antenna, a flexible antenna and an external antenna for Wi-Fi6 and Wi-Fi6E. All three antennas use the 2.4GHz, 5GHz and 6GHz bands and support IEEE standards 802.11a/b/g/j/n/ac/ax.

The SMD antenna, named Billi, part number SR43W078, measures 15 mm x 6 mm x 1mm and requires only 1 mm of clearance on the PCB. This makes it an exceptionally low profile antenna solution for slim devices with a small space for the antenna. In tests this antenna showed very high efficiency across all three bands. It is suitable for pick-and-place manufacturing processes.

The FPC antenna, named Lotti, part number SRF3W077 is a flexible antenna measuring 30.0 x 8.0 x 0.15mm. It has a self-adhesive mounting for easy integration into small designs. This antenna does not require a ground plane on the PCB and also showed very high efficiency in tests.

The third new antenna is Nitida, part number SRE3W084, an antenna for external mounting. It is supplied with an SMA connector and offering a waterproof variant. This antenna is simple to add to a design because it does not require a matching network.

Wi-Fi6E brings faster networks with greater capacity that will deliver better online experiences and support simultaneous communications to many endpoints with increased security. Wi-Fi6E will make wireless networks in the office and smart home feel as fast as Ethernet.

Wi-Fi6E adds the additional channels of the less congested 6GHz radio band to carry even more data. It provides the speeds required to support 4K and 8K video, networked gaming, smart TV and video calling, and can support many connected IoT devices at large scale. Wi-Fi6E will complement 5G cellular services and is expected to become the standard in health, education, sports and entertainment markets where networks have large numbers of simultaneous users.

Michael Castle, Product Marketing Manager with Antenova explains: “These antennas will be good for high performing wireless devices that combine mobility with high throughput, for example routers and USB dongles for Wi-Fi6 and Wi-Fi6E, games consoles, set-top boxes, surveillance cameras, networked IoT devices and MIMO systems. The Lotti and Nitida antennas connect directly to a PCB which makes for an easier integration and a shorter design cycle.”

The emerging Wi-Fi7 standard will also utilise the 6GHz band, so manufacturers choosing one of these antennas now will be positioned to deliver lightning-fast Wi-Fi7 speeds in future.

12/01/2023

Powerful WiFi 6/6E Tri-band Combo Sip Module | SparkLAN

Wi-Fi 6E Solutions in Sip Package

SparkLAN AP5881 is based on Synaptic s latest Wi-Fi 6E Sip solution, combined with Bluetooth 5.2 technology, using WLBGA ( wafer level ball grid array ) chip packaging design, it is an industrial-grade BGA SIP module with a tiny size of only 8.5x8.5x1mm, excellent performance, better high-speed performance, low power consumption and covering a variety of interfaces - PCIe, SDIO and USB is a big advantage.It is therefore ideal for size-constrained applications.For low power and continue powered applications, such as wearables, smart portable device.

AP5881 sip module WLBGA package design enables seamless upgrades between old and new communication standards, reducing development costs and accelerating product development cycles.AP5881 adds support for Zigbee wireless communication protocol, can fully enjoys the seamless interactive application of smart home, support industrial grade operating temperature range -30-85°C, and will be globally certified.

新盛光電子InnoVictor Co., Ltd.

29/01/2026

23/07/2025

10/07/2025

14/05/2025

21/11/2024

29/08/2024

11/07/2024

20/03/2024

15/11/2023

22/08/2023

12/01/2023

12/01/2023

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Monday	09:00 - 17:00
Tuesday	09:00 - 17:00
Wednesday	09:00 - 17:00
Thursday	09:00 - 17:00
Friday	09:00 - 17:00