22/05/2026
🎉🎉🎉誠摯邀請您蒞臨 COMPUTEX 2026🎉🎉🎉
見證能源效率的未來,探索先進散熱技術的無限可能
盈聯通 (Vitalcore Technology Co., LTD.) 誠摯邀請您參加COMPUTEX 2026,與我們共同探索高效能散熱技術與先進材料應用的嶄新篇章。作為全球指標性的科技盛會,本次展覽將聚焦AI伺服器、HPC高效能運算等極致應用場景,呈現盈聯通在能源效率領域的深厚積累與突破性創新。
我們將首次公開展示多項劃時代產品,包括三款規格全新的CDU散熱分配裝置、Sidecar模組設計,鑽石銅等先進材料的實際應用成果,歡迎親臨現場與技術專家深度交流。
👉展覽資訊👈
📅日期:2026.6.2~6.5
📍地點:台北南港展覽館一館4樓
🔊展位:M1129a
\本次展出亮點產品/
▍200kW CDU
適用中型 AI 伺服器叢集,提供高密度液冷散熱解決方案
▍300kW CDU
專為高效能運算設計,兼顧效能與能源使用效率
▍2000kW CDU
超大規模資料中心專用,引領下世代液冷基礎設施規格
▍Sidecar 模組
靈活部署的旁掛式散熱模組,適應多元伺服器架構需求
▍鑽石銅材料
突破性導熱材料應用,大幅提升散熱組件效能與耐用性
期待在COMPUTEX 2026與您相見
共同開創能源效率的新紀元
🎉🎉🎉We cordially invite you to COMPUTEX 2026🎉🎉🎉
Witness the future of energy efficiency and explore the infinite possibilities of advanced heat dissipation technology.
Vitalcore Technology Co., LTD. cordially invites you to COMPUTEX 2026 to explore a new chapter in high-efficiency heat dissipation technology and advanced material applications. As a leading global technology event, this exhibition will focus on extreme application scenarios such as AI servers and HPC high-performance computing, showcasing Vitalcore's profound expertise and groundbreaking innovations in the field of energy efficiency .
We will be showcasing several groundbreaking products for the first time, including three new Coolant distribution units and a Sidecar. We welcome you to visit our site and have in-depth discussions with our technical experts regarding module design and the practical application of Diamond Copper materials for AI applications.
👉 Exhibition Information 👈
📅 Dates:June 2 (Tue) to June 5 (Fri), 2026
📍 Location:Taipei Nangang Exhibition Center, Hall 1, 4th Floor
🔊 Booth:M1129a
▍200kW CDU
Suitable for medium-sized AI server clusters, providing high-density liquid cooling solutions.
▍300kW CDU
Designed specifically for high-performance computing, balancing performance and energy efficiency.
▍2000kW CDU
Dedicated to hyperscale data centers, leading the next generation of liquid cooling infrastructure specifications
▍Sidecar Module
Flexible deployment of side-mounted cooling modules to adapt to diverse server architecture requirements.
▍Diamond Copper materials for AI applications
Breakthrough application of thermally conductive materials significantly improves the performance and durability of heat dissipation components.
We look forward to seeing you at COMPUTEX 2026 and ushering in a new era of energy efficiency together.
Vitalcore Technology Co., LTD. cordially invites you to join us.
Distribution Units (CDU)
://vitalcore.com.tw/