Etron Tech 鈺創科技

Etron Tech 鈺創科技 鈺創科技股份有限公司,為世界級無晶圓廠商(Fabless)及異質性整合(Heterogeneou

Thank you to everyone who visited Etron Technology Group Booth at CES 2026.We truly appreciate the great conversations a...
12/01/2026

Thank you to everyone who visited Etron Technology Group Booth at CES 2026.

We truly appreciate the great conversations and strong interest in our latest innovations across Etron, eYs3D, and DeCloak, including AI memory solutions, 3D vision, and privacy-enhancing technologies.

Your support and engagement made CES 2026 a great success.

We look forward to continuing our collaboration and shaping the future together.

See you at CES2027!


🚀 CES 2026 Day 3 | AI Memory Innovation in ActionAt CES 2026, Etron Technology showcases its cutting-edge MemorAiLink® A...
09/01/2026

🚀 CES 2026 Day 3 | AI Memory Innovation in Action

At CES 2026, Etron Technology showcases its cutting-edge MemorAiLink® AI memory platform and the award-winning RPC® inside G120 subsystem, recently honored with the Taiwan Hsinchu Science Park 2025 Innovative Product Award.

MemorAiLink® integrates software and hardware architectures, combining homogeneous and heterogeneous systems, specialized DRAM, memory control IP, and packaging technologies. It enables optimized memory integration, high-performance AI SoC solutions, and reduced system complexity, helping customers accelerate time-to-market and gain a competitive edge.

The RPC® inside G120 subsystem incorporates Etron’s innovative RPC DRAM®, delivering x16 DDR3 bandwidth in a compact KGD or FI-WLCSP package, simplifying wire bonding and packaging, while reducing overall system costs. By integrating RPC DRAM and Controller with 3D depth-sensing chips from subsidiary eYs3D, this subsystem provides a miniaturized, low-power AI edge platform for specialized ASIC applications.

From Wi-Fi 5 to Wi-Fi 7 and beyond, Etron’s memory solutions, supported by deep supply chain alliances and Longevity Support programs, ensure reliable, long-term performance for AI and edge applications.

📍 Visit Etron at CES 2026 to experience how MemorAiLink® and RPC® inside G120 are driving next-generation AI memory innovation.

EdgeAI eYs3D InnovationAward SemiconductorInnovationBooth No.14841(LVCC)

🚀 CES 2026 Day 2 | Privacy-First AI in ActionAt CES 2026, DeCloak Intelligences Co. is showcasing its latest privacy-enh...
08/01/2026

🚀 CES 2026 Day 2 | Privacy-First AI in Action

At CES 2026, DeCloak Intelligences Co. is showcasing its latest privacy-enhanced AI innovations, led by the award-winning DeCloakBrain™ Privacy-Intelligent AI Robotic Decision System, a CES 2026 Innovation Awards Honoree.

Built on DeCloak’s proprietary Privacy-Intelligent Computing architecture, DeCloakBrain™ delivers real-time, irreversible de-identification while enabling Super-Visual Synthesis, Multimodal Spatial Reasoning, and Robot-to-Robot Collaborative Intelligence. Whether in healthcare, industrial, or public environments, it ensures autonomous decision-making and coordinated mission ex*****on without exposing any personal data—fully compliant with EU AI Act, HIPAA, and other global regulations.

At the core of its rivacy-Intelligent Autonomous Ecosystem:
🔹 DeCloakVision™ – privacy-preserving perception for fall detection, safety analytics, and behavior understanding
🔹 DeCloakFace™ – privacy-enhanced identity verification through obfuscated deep-learning models
🔹 DeCloakBrain™ – autonomous decision-making and coordination

Together, these technologies form a cross-domain, privacy-secure AI network, powering smart hospitals, factories, cities, and multi-robot systems.

With three consecutive CES Innovation Awards—DeCloakFace™, DeCloakVision™, and DeCloakBrain™—DeCloak continues to lead the global movement toward privacy-first AI.

SmartRobotics InnovationAwardsDeCloak Booth No.14841(LVCC)

🚀 CES 2026 Day 1 | Physical AI in MotionIC design house Etron Technology (TPEx: 5351), along with its subsidiary eYs3D s...
07/01/2026

🚀 CES 2026 Day 1 | Physical AI in Motion

IC design house Etron Technology (TPEx: 5351), along with its subsidiary eYs3D specializing in stereo vision and Physical AI, has partnered with optical leader Asia Optical (TPEx: 3019) to showcase an AMR subsystem at CES.

AI is no longer confined to screens. It now lives inside machines, moves through the world, and reacts in real time.

At CES 2026, eYs3D unveils a new vision of Physical AI — built on years of expertise in stereo vision and 3D sensing, and delivered through a modular, silicon-centric platform.

🔹 G100+, G62 & R77 stereo cameras enabling SLAM, obstacle avoidance, detection, and tracking
🔹 XINK NANO Edge AI & XINK AI Controller, combining Cortex-A55, Cortex-M4, and a 4 TOPS NPU for low-power, on-device autonomy
🔹 Sense & React solutions for AMR, drones, and smart parking — turning chips and cameras into ready-to-deploy building blocks

Beyond the device, our Hybrid AI architecture tightly integrates edge inference with cloud-native services, enabling scalable model deployment, device management, and fleet intelligence.

📍 Visit Etron & eYs3D at CES 2026 and experience how AI comes into motion — powering autonomous machines for factories, cities, and everyday life.

AutonomousMachines Etron eYs3D Booth No.14841(LVCC)

22/12/2025

Etron@CES2026 Preview

📍 Meet Etron at CES 2026, booth 14841(LVCC)
📅 Las Vegas • Jan. 6–9, 2026
We look forward to connecting with you.





No.14841

Empowering the Next Era of AI Memory, Edge Intelligence & Privacy ComputingEtron Tech Group continues to innovate across...
22/12/2025

Empowering the Next Era of AI Memory, Edge Intelligence & Privacy Computing

Etron Tech Group continues to innovate across memory, sensing, and AI system integration. At CES 2026, we present comprehensive technology platforms that enhance performance, reduce design complexity, and accelerate the deployment of intelligent and autonomous applications — from edge devices to cloud-connected robotics.

Highlights on Display
• MemorAiLink® AI Memory Platform – One-stop memory + IP + packaging integration for superior AI SoC efficiency
• RPC® inside G120 Subsystem– Hsinchu Science Park award-winning AI edge solution featuring compact, low-power RPC DRAM®
• eYs3D Physical AI– Stereo vision & edge computing platforms enabling autonomy in robots, drones & smart infrastructure
• DeCloak Privacy-Intelligent AI – Real-time de-identification with CES Innovation Awards honoree technologies
• eEver USB PD3.2 Solutions – Certified USB Type-C power delivery controllers for next-generation devices

📍 Meet Etron at CES 2026, booth 14841(LVCC)
📅 Las Vegas • Jan. 6–9, 2026
We look forward to connecting with you.




At 2026 CES, Etron will showcase the RPC® inside G120 subsystem, which recently won the Taiwan Hsinchu Science Park 2025...
22/12/2025

At 2026 CES, Etron will showcase the RPC® inside G120 subsystem, which recently won the Taiwan Hsinchu Science Park 2025 Innovative Product Award. This solution incorporates Etron’s innovative RPC DRAM®, which delivers x16 DDR3 data bandwidth in a compact Known-Good-Die or FI-WLCSP package. Compared to standard DDR3, this approach simplifies wire bonding and packaging design, helping to reduce overall system costs. By integrating the RPC DRAM and Controller with 3D depth-sensing chips from our subsidiary, eYs3D, the subsystem offers an effective AI edge platform for miniaturized, low-power, and specific ASIC applications.



Etron’s complete memory solutions can fully satisfy customer needs ranging from Wi-Fi 5, Wi-Fi 6/6E, Wi-Fi 7, and beyond. Additionally, Etron’s deep strategic alliances with supply chain partners enable us to provide customers with a long-term and reliable supply of DDR4 & LPDDR4/4X products.


As the semiconductor market evolves, Etron Technology remains focused on customer requirements. Through our commitment to innovation and robust Longevity Support programs, we consistently refine our technology and services, positioning ourselves as your trusted memory partner dedicated to meeting long-term industry demands.


No.14841

DeCloak Intelligences Co. will showcase its latest privacy-enhanced AI innovations at CES 2026, led by its award-winning...
22/12/2025

DeCloak Intelligences Co. will showcase its latest privacy-enhanced AI innovations at CES 2026, led by its award-winning DeCloakBrain™ Privacy-Intelligent AI Robotic Decision System, recognized as a CES 2026 Innovation Awards Honoree.
DeCloakBrain™ is built on DeCloak’s proprietary Privacy-Intelligent Computing architecture, performing real-time, irreversible de-identification at the perception layer while enabling Super-Visual Synthesis, Multimodal Spatial Reasoning, and Robot-to-Robot Collaborative Intelligence. Whether deployed in healthcare, industrial, or public environments, DeCloakBrain™ delivers global perception, autonomous decision-making, and coordinated mission ex*****on—all without exposing any identifiable personal data. The system fully complies with the EU AI Act, HIPAA, and other stringent global regulations.
With DeCloakBrain™ at the core, DeCloak has developed a comprehensive Privacy-Intelligent Autonomous Ecosystem, integrating perception, identity, and decision intelligence into a unified framework:

DeCloakVision™ serves as the privacy-preserving perception layer, performing instant de-identification at the moment of capture while retaining essential features such as posture, behavior, and trajectories. It powers fall detection, safety analytics, behavior understanding, and smart inspection across hospitals, factories, and sensitive environments.

DeCloakFace™ provides the ecosystem’s privacy-enhanced identity layer, enabling high-trust authentication through an obfuscated deep-learning model that verifies identity without exposing original facial imagery.

Together, the three technologies operate through differential privacy, federated learning, and privacy-secure channels, forming a cross-domain autonomous network that supports safe, compliant AI deployment in medical facilities, industrial sites, smart cities, and multi-robot systems.

With three consecutive CES Innovation Awards—DeCloakFace™, DeCloakVision™, and DeCloakBrain™—DeCloak continues to lead the global movement toward privacy-first AI.


No.14841

The eEver EJ732 family USB Power Delivery (PD) Controller has officially received USB-IF PD3.2 certification as of Octob...
22/12/2025

The eEver EJ732 family USB Power Delivery (PD) Controller has officially received USB-IF PD3.2 certification as of October 9, 2024 (TID: 11771). With this certification, the EJ732 family aligns with the USB Power Delivery 3.2 (PD3.2) standard, supporting efficient power negotiation through a single USB Type-C connection, making it ideal for modern, high-power devices.

Covering host, device, and cable control, EJ732 stands as the industry’s most comprehensive PD 3.2 platform, enabling seamless cross-device interaction. This one-stop solution empowers brands to simplify sourcing, reduce design complexity, and launch products to market faster than ever. Make a reservation with us today to see our privacy-centric solutions at CES 2026!


No.14841

At CES 2026, eYs3D presents a new vision of Physical AI – AI that does not stay on screens, but lives inside machines, m...
22/12/2025

At CES 2026, eYs3D presents a new vision of Physical AI – AI that does not stay on screens, but lives inside machines, moves through the world, and makes decisions at the chip level.



Building on years of experience in stereo vision and 3D sensing, we now offer a modular Physical AI platform for machines. Our G100+, G62 and R77 stereo cameras deliver SLAM, obstacle avoidance, detection and tracking capabilities for robots, drones, and smart infrastructure. These sensors feed into our XINK NANO Edge AI and XINK AI Controller platforms, combining Cortex-A55 and Cortex-M4 processors with a 4 TOPS NPU to provide local autonomy with low power and small form factor.



On top of sensing and silicon, we introduce Sense & React AMR barebones, drone and smart-parking solutions that turn our chips and cameras into ready-to-deploy building blocks for real applications: mobile robots, logistics automation, retail analytics, and more.



To extend intelligence beyond the device, eYs3D embraces Hybrid AI – edge inference tightly integrated with cloud-native services. Models can be trained and managed in the cloud, then deployed, updated, and orchestrated across fleets of devices, enabling robot intelligence, distributed compute, model deployment, and device management at scale.


As a silicon-centric, Physical AI company, eYs3D is enabling a new generation of autonomous machines that can sense, understand, and react to the physical world – bringing AI in motion to factories, cities, and everyday life.


No.14841

Cordially invite you to join the2025 Taiwan Innotech Expoon October 16-18, 2025at Etron Booth IC03, Innovation economy p...
14/10/2025

Cordially invite you to join the
2025 Taiwan Innotech Expo
on October 16-18, 2025
at Etron Booth IC03,
Innovation economy pavilion, TWTC Hall 1.

MemorAiLink 是一個 AI 記憶體平台,整合了軟硬體架構,結合同質與異質系統、HI+AI+專用 DRAM、記憶體控制 IP 與封裝技術,為不同系統間的記憶體與封裝技術整合提供解決方案。該平台針對 AI SoC 提供創新的記憶體產品、最佳化的異質整合封裝技術以及記憶體介面 IP 服務,滿足容量與頻寬需求,提升 SoC 整體性能並降低成本。MemorAiLink 的一站式 IP 服務確保 SoC 與記憶體間的高效溝通,縮短上市時間,幫助客戶在 AI 領域取得競爭優勢。

XINK NANO 是 eYs3D 推出的邊緣 AI 感測運算平台,搭載 eCV4 晶片與 ARM Cortex-A55 處理器,支援多種 AI 模型與 3D/ToF 感測器整合。具備低功耗、高即時性與資料安全特性,適用於機器人、無人機、智慧監控及智慧交通等應用,實現高效的視覺 AI 邊緣運算。







NANO

Cortex-A55

Address

No. 6, Technology Road 5, Hsinchu Science Park, Hsinchu, Taiwan, R. O. C
Hsinchu
30078

Opening Hours

Monday 08:00 - 18:00
Tuesday 08:00 - 18:00
Wednesday 08:00 - 18:00
Thursday 08:00 - 18:00
Friday 08:00 - 18:00

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