28/08/2026
🔍 𝐇𝐨𝐰 𝐝𝐢𝐝 𝐒𝐓𝐌𝐢𝐜𝐫𝐨𝐞𝐥𝐞𝐜𝐭𝐫𝐨𝐧𝐢𝐜𝐬 𝐬𝐨𝐥𝐯𝐞 𝐯𝐨𝐢𝐝 𝐢𝐬𝐬𝐮𝐞𝐬 𝐢𝐧 𝐜𝐡𝐢𝐩 𝐞𝐧𝐜𝐚𝐩𝐬𝐮𝐥𝐚𝐭𝐢𝐨𝐧?
Unbalanced resin flow can lead to air entrapment, weld lines, and voids—challenging defects in IC packaging.
With simulation, STMicroelectronics identified the root cause and optimized the lead frame design before physical prototyping.
💡 The result? Reduced flow imbalance, minimized void-related defects, and improved package reliability.
👉 Read the full customer success story and see how simulation made the difference!
https://www.moldex3d.com/blog/customer_success/stmicroelectronics-used-moldex3d-to-solve-void-issues-during-chip-encapsulation-process/