Cadence Design Systems Singapore

24/09/2026

CadenceCONNECT Photonics is back, and this year, we're marking a decade of transformation in the photonic IC industry. Join Cadence and industry leaders on October 14 and 15, 2026.

Ten years ago, photonic ICs were a promising idea sitting on the edge of the possible. Immature design flows. Limited manufacturing. An unproven business case. Today? The tooling is there. The PDKs are there. The foundry capacity is there. Photonics has moved from feasibility to scale—and it's now woven into the AI infrastructure.

This year's CadenceCONNECT Photonics theme celebrates exactly that journey: from an early glimmer of potential, to proven application, to global impact at scale.

Before the industry looks ahead to the next decade, we want to ground the conversation in how we actually got here—and what that means for what comes next.

📅14 Oct 2026 - 15 Oct 2026
📍San Jose, CA, USA

Learn More: https://events.cadence.com/event/98a76b4c-012e-4c45-af77-f4b91812731a/MainEventSummary?environment=P2&RefId=eventspage

23/09/2026

The Provider confirms that the 10% disbursement charge fully covers all out-of-pocket costs and expenses incurred by the Provider in the performance of the Work, as well as any administrative fees or similar charges in connection with the Work. The Provider shall not charge or seek reimbursement from, or otherwise request that Cadence pay any additional amounts for such costs, expenses, or fees.
Press release: https://www.cadence.com/en_US/home/company/newsroom/press-releases/pr/2026/cadence-expands-chipstack-ai-super-agent-with-a-new-agent-for.html
Webpage:
https://www.cadence.com/en_US/home/tools/system-design-and-verification/chipstack-ai-superagent.html

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10/09/2026

Designing advanced chips requires more compute, more flexibility, and more efficiency than ever before.
Cadence has qualified its full EDA flow to run natively on AWS Graviton, allowing design teams to leverage Arm-based cloud infrastructure across the entire design process.
See how Cadence, Arm, and Amazon Web Services are helping accelerate the future of semiconductor innovation.
Read more:

Cadence has qualified its full EDA flow on Arm-based AWS Graviton CPUs, and Annapurna Labs is already using the digital implementation and signoff portion in production. The semiconductor industry is entering a new phase, defined by AI-scale comple...

25/08/2026

AI performance has long been measured by compute.
As AI factories scale, however, moving data efficiently has become just as important as processing it. Memory bandwidth, interconnect performance, and synchronization all play a role in determining how much of that compute can actually be used.
Our latest blog explores why AI performance is increasingly a system-level challenge. https://community.cadence.com/cadence_blogs_8/b/ip/posts/data-movement-shapes-ai-system-performance?utm_source=FB&utm_medium=social-media&utm_campaign=DIP&utm_content=blog-image-organic

17/08/2026

The real differentiator in agentic AI isn't the model—it's the feedback loop.
Our latest blog explores how deep integration with EDA tools helps AI agents continuously learn, improve, and deliver higher-quality engineering outcomes across chip design and verification workflows. Read more:

Every verification and design team I talk to is building agents right now. The demos are genuinely impressive: point an LLM at some RTL, ask it to write assertions or close coverage or root-cause a failure, and it produces something that looks right....

12/08/2026

How can AI help your RF design team move faster and deliver better products?
A new Microwave Journal article explores how Cadence Agentic AI is helping engineers accelerate RF development by reducing repetitive design work while keeping decisions grounded in trusted workflows, simulation, and physics-based analysis. Agentic AI helps extend engineering expertise across teams so designers can spend more time innovating.
It's another example of how Cadence is advancing Design for AI and AI for Design.
Read more: https://www.microwavejournal.com/articles/45941-how-cadence-agentic-ai-will-transform-rf-design-productivity

03/08/2026

🔈Registration is now open for Custom IC Design Tuesday TECHTALKs 2026!
Join our 6-part online webinar series to explore practical approaches to custom IC design, analog verification, advanced simulation, power integrity signoff, and parasitic extraction across Cadence platforms.
Each session will feature Cadence technology experts sharing practical workflows and real project use cases, covering topics such as AI-driven custom design, analog virtual prototyping, AMS multi-chip simulation, Voltus-XFi signoff, and Quantus extraction flows.
📅Webinar dates: Aug 18, Aug 25, Sep 8, Sep 15, Sep 22, and Sep 29.
👇Register now and join us every Tuesday for Custom IC Design Tuesday TECHTALKs 2026: https://cadencedesign.registration.goldcast.io/series/a997dad2-9b36-4804-9804-633d9ee5e324

29/07/2026

Fresh from HPE Discover 2026, where Cadence and HPE announced their partnership to advance digital twins for AI data centers, comes a compelling real-world success story from Era4, a company that is building the sovereign AI infrastructure for the UK's next industrial era, focusing on resilient, lower-carbon, and high-performance AI capabilities.
In this video, Sherman Ikemoto, Group Director at Cadence, and Nick Hume, CTO of Era4, discuss how Era4 is leveraging Cadence Reality Digital Twin and HPE AI Mod POD with NVIDIA accelerated computing to model, validate, and optimize AI infrastructure before a single rack is powered on.
A powerful example of how sovereign AI infrastructure can be designed and deployed with greater confidence, lower risk, and faster time to value with optimized tokens-per-watt performance.
Learn more:https://community.cadence.com/cadence_blogs_8/b/data-center/posts/cadence-accelerates-digital-twin-driven-data-center-ai-modernization-with-hpe?utm_source=FB&utm_medium=social-media&utm_campaign=HPE-Discover-2026&utm_content=blog-organic

23/07/2026

Cadence completes the industry’s first silicon-to-system agentic AI stack.
Introducing the AuraStack AI Super Agent on Allegro AI Studio—the world’s first agentic AI platform for PCB and advanced packaging design.
By extending agentic AI across the full electronic system design flow, AuraStack AI Super Agent enables engineering teams to move faster from system planning to manufacturing-ready designs in a single AI-native environment.
- Up to 2X faster time to market
- Up to 15X productivity improvement
- Unified multiphysics-driven optimization
Accelerated by NVIDIA Blackwell and NVIDIA CUDA-X, AuraStack AI Super Agent combines AI orchestration with trusted system design and analysis technologies to help engineers tackle increasing design complexity while accelerating innovation.https://newsroom.cadence.com/press-releases/press-release-details/2026/Cadence-Introduces-AuraStack-AI-Super-Agent-the-Worlds-First-Agentic-AI-Platform-for-PCB-and-Advanced-Packaging/default.aspx

Cadence completes the industry’s first silicon-to-system agentic AI stack.

Introducing the AuraStack AI Super Agent on Allegro AI Studio—the world’s first agentic AI platform for PCB and advanced packaging design.

By extending agentic AI across the full electronic system design flow, AuraStack AI Super Agent enables engineering teams to move faster from system planning to manufacturing-ready designs in a single AI-native environment.

- Up to 2X faster time to market

- Up to 15X productivity improvement

- Unified multiphysics-driven optimization

Accelerated by NVIDIA Blackwell and NVIDIA CUDA-X, AuraStack AI Super Agent combines AI orchestration with trusted system design and analysis technologies to help engineers tackle increasing design complexity while accelerating innovation.

https://ow.ly/aefG50Zo1Qu

22/07/2026

AI is forcing a fundamental rethink of data center architecture.
As models scale, performance depends not only on compute, but on how efficiently data moves across the system.
Explore the technologies and architectural shifts driving the rise of AI factories in our latest white paper.https://www.cadence.com/content/dam/cadence-www/global/en_US/documents/tools/silicon-solutions/building-ai-factories-with-ip-solutions-wp.pdf?utm_source=FB&utm_medium=social-media&utm_campaign=AI-Factories&utm_term=DIP&utm_content=whitepaper-organic