Nile

02/11/2025

27/10/2025

17/09/2025

TSMC's 2nm research has concluded, and it's now time for chipset giants to jump in and add their own flavor. The first one to adopt it is MediaTek.

17/09/2025

MediaTek is set to unveil the Dimensity 9500 on September 22, 2025, built on TSMC’s advanced N3P 3nm process. Featuring a 1+3+4 CPU cluster with brand-new Arm cores, a Mali-G1 Ultra GPU with ray tracing, and an NPU delivering up to 100 TOPS, this flagship chip is designed to rival Qualcomm and Samsung’s best. With LPDDR5X RAM, UFS 4.1 storage, Wi-Fi 7, Bluetooth 6.0, and enhanced ISP for photography, the 9500 promises faster performance, smarter AI, and smoother gaming for next-gen smartphones.

13/09/2025

The future of AI is here and it’s running right on your devices!
Explore the Google AI Edge Gallery: a collection of models that bring AI closer to you faster, smarter, and offline-ready. From vision to speech, the power of AI is now at the edge.

Implied Tech

13/09/2025

The Dimensity 8400 is MediaTek’s premium 5G SoC (System on Chip), aimed at high-end smartphones. It packs in newer architectures, improved caching, and a focus on generative AI, imaging, and efficient power draw.