Zara Tech Semiconductors

13/02/2026

Wafer Batch ID Reader System – WID200T

Highlights:

- Designed for 200mm Wafer

- 1x Open Cassettes Station (Based on Sample Cassette Provided)

- 2x IOSS WID120 OCR Reader

- Cassette Orientation Sensors (Detect Reverse Placement of Cassette), Cassette Presence and Cassette Tilt Sensors

- In-Cassette Wafer Slot Mapping Function

- Wafer Orientation Notch and Flat Alignment Mechanism Integrated

- Programmable Wafer Rotation for Various Wafer ID Locations Recipe Controlled Mapping, Alignment & Wafer ID Reading.

For more information, contact:

Email: [email protected]

Phone/Whatsapp: +91 94420 60679

https://zaratech.biz/product/wafer-batch-id-reader-system-wid200t/

09/02/2026

Kulicke and Soffa - UltraLux

It is the latest generation ball bonder utilizing the latest technologies and materials that will save LED manufacturers up to 10% capital cost.

Features:
- Higher UPH
- Advanced Close-Loop Servo with Lower Mass Higher Stiffness XYZ enhanced design
- Robust compact Optics design with Smaller Crosshair Offset maximizes Look ahead PRS Alignment Scheme.

Contact us for more information & Business Enquiries,
Email: [email protected]
Phone/WhatsApp: +91 94420 60679

06/02/2026

Post Die Attach Vision Inspection System – PDA1000

Highlights:
- Auto Vision Inspection Tool for Dual Side Cooling (DSC) Package Handling
- Multiple Magazine Loader
- Dual Track Mechanism for DSC-1D & DSC-2D/3D Respectively
- Smooth Conveyor Track Mechanism for Multiple Devices Loading In for Minimal Waiting Time
- DSC-1D Track Consists of 21MP Camera (Top View), Height Sensor, and Inker Reject Module
- DSC-2D/3D Track Consists of 6MP Cameras with 6-Sided Views
- Reject Bin for DSC-2D/3D Defected Units
- User Friendly Software GUI under Windows 10 Professional Operating System

For more information, contact:
Email: [email protected]
Phone/Whatsapp: +91 94420 60679
https://zaratech.biz/product/post-die-attach-vision-inspection-system-pda1000-2/

The automated vision inspection system, PDA1000 is designed for handling new power switches based on SiC and GaN material such as IGBT and MOSFET device

20/01/2026

NST - NX-1032XS

Highlights:
- Input / Output X-Y pitch open/close hand realizes Max UPH 20,000
- Throughput: 20,000 units/hour
- Number of Parallelism : Maximum 32 Sites
- Temperature Range : Ambient to 155 deg C.

For business enquiry, contact:
Email: [email protected]
Phone/Whatsapp: +91 95435 37321
https://zaratech.biz/product/flagship-model-nx-1032xs/

09/01/2026

QES - 4th Optical Inspection System – MPI3000

- MPI3000 is designed to handle molded strip optical inspection systems.
- The system comes with a programmable 2-input magazine elevator module and a 2-output magazine elevator module for higher yield management.
- The package is handled by a motorized lead frame picker arm which is using the vacuum suction method during the loading and unloading process.
- Moreover, with the capability of flipping the mechanism, the system can inspect not only the top of the lead frame but even the bottom.
- MPI3000 comes with smart and user-friendly inspection software for easy operation and fast recipe setup with a user-friendly GUI.

For product enquiries, contact:
Email: [email protected]
Phone/Whatsapp: +91 95435 37321
https://zaratech.biz/product/4th-optical-inspection-system-mpi3000/

MPI3000 is designed to handle molded strip optical inspection systems. The system comes with a programmable 2-input magazine elevator module and a

08/01/2026

Post Wire Bond Inspection System – PWB500V

- PWB1500V is designed to inspect and quality check on lead frame and substrate after the die attach and wire bond process.
- The system comes with a high-speed camera with a global shutter with 2D vision inspection platform.
- It equipped with a stroboscopic controller that synchronizes with an encoder and camera.
- It is using the on-the-fly scanning method with stroboscopic control that able to eliminate the waiting time of the inspection process.

https://zaratech.biz/product/post-wire-bond-inspection-system-pwb500v-2/

For product enquiries, contact:
Email: [email protected]
Phone/Whatsapp: +91 95435 37321

PWB1500V is designed to inspect and quality check on lead frame and substrate after the die attach and wire bond process. The system comes with a

31/12/2025

Kulicke Soffa - IConn PLUS

is the new State-of-the-Art in Fully Automatic Wire Bonding. With its upgraded and enhanced subsystems, it is engineered to deliver all the capability you will need — for Wire Bonding today, PLUS tomorrow.

Key focus areas:
▪ Process Robustness
▪ Production Portability
▪ Ease of Use
▪ Robust Hardware Performance
▪ Upgradeability

For product enquiries, contact:
Email: [email protected]
Phone/Whatsapp: +91 95435 37321

30/12/2025

SCI Plasma - AEON

Aeon is a high-performance, standalone batch plasma cleaning system meticulously engineered to meet your precision surface treatment needs.

Features:
- Reliable Operation
- Precision Performance
- Customizable Configurations
- Increased Efficiency
- User-Friendly Interface

For business enquiry, contact:
Email: [email protected]
Phone/Whatsapp: +91 95435 37321

29/12/2025

Blue M - DCL 336

The Blue M Inert Gas Mechanical Convection Oven, which we pressure-test at
normal operating levels, is ideal for industrial oven applications that involve
processing materials in a controlled atmosphere environment, as well as dry
packaging of electronic components.

Inert Gas Oven Features:
• Temperature range: 15°C above ambient to 316°C (600°F)
• Uniformity: +/-1% of setpoint
• Control Accuracy: +0.5°C
• Resolution: +/-0.1°C
• Performance data (typical): Run-up to 300°C 60 min. (or less)
• Safety air flow switch on single-phase models

For business enquiries, contact:
Email: [email protected]
Phone/WhatsApp: +91 95435 37321

15/12/2025

Kulicke andsoffa - iStack W+

Building on the successful iStack platform, the iStack Series machines are engineered with new capabilities and enhanced features to meet the challenges and redefine the way of die bonding.

With an emerging trend in attaching thinner die and substrates, the iStackTM W+ offers a solution for wafer level die attach.

iStack W+ Features & Options
• High Accuracy kit (5 μm)
• Thin Substrate handling kit (< 100 μm)
• Mapping Functions
(Substrate / Wafer)
• Wafer / Substrate contamination removal kit

For business enquiries, Please contact:
Email: [email protected]
Phone/WhatsApp: +91 95435 37321