28/04/2026
🚀 **A landmark week for Yelo at PIC International 2026!**
Last week, the Yelo team made their **exhibition debut** at the 11th PIC International Conference in Brussels — and it did not disappoint.
PIC International is the premier gathering for the photonic integrated circuits community, bringing together industry leaders, academics, fab engineers, investors, and innovators to explore the future of PIC technology. Co-located with Compound Semiconductor International, Power Electronics International, and Advanced Packaging International as part of AngelTech, it created a truly comprehensive three-day platform for networking and knowledge exchange.
This year's expert speakers presented across four key themes: foundations of PIC design, connectivity and scalability for secure high-speed data networks, emerging photonics applications in sensing and imaging, and future computing — including PICs for quantum and neural networks.
As a company specialising in **accelerated ageing and stress testing for PICs**, the timing couldn't be better. With photonic integrated circuits moving into ever more demanding applications — from AI-driven data networks to autonomous vehicles and quantum systems — **reliability and device qualification have never been more critical.** It was incredibly encouraging to see just how much appetite there is in the market for what we do.
Our first time on the exhibition floor, and already we're leaving with a wealth of new connections, conversations, and opportunities. A huge thank you to everyone who visited the Yelo stand — it was a pleasure meeting so many talented people from across the global photonics supply chain.
