27/04/2021
Wir freuen uns, diesen Use-Cases mit BASF Forward AM umgesetzt zu haben, um für unsere Kunden den nächsten Schritt im Additive Manufacturing zu gehen.
Vielen Dank an Inga Sieck, welche das Projekt von unserer Seite aus betreut hat!
Electronic boards contain delicate components, like plug sockets, which must be protected from liquids at any time during the manufacturing process. Since conventional plastic caps would not resist higher heat levels, Schorisch Gruppe found a new solution and took the next step into Manufacturing. They successfully designed and 3D printed a cover cap using our Forward AM metal filament Ultrafuse® 316L. The outstanding high-temperature resistance and the ability to print hollow parts make Ultrafuse® 316L the perfect material for corrosion and heat resistant production tool applications.
Interested to learn more? Discover our latest use case now: https://hubs.ly/H0LXhTs0.
