23/06/2026
Quantasoft's core team had the privilege of visiting the HPE at the Foxconn in Kutná Hora facility where the next generation of AI supercomputers is being built.
A few things stuck with me:
The scale of AI infrastructure is no longer abstract — it's racks, cabling, and serious engineering on a factory floor. Seeing HPE Cray systems come together, with direct liquid (water) cooling running straight to the chips, makes the energy and density challenges of modern AI very tangible. Air cooling simply can't keep up with today's accelerator power, and watching that thermal engineering up close was a real highlight.
This visit is especially meaningful for us as we're actively working on the HPE OEM Program — building on HPE's supercomputing heritage from Cray and Foxconn's manufacturing precision to bring this technology into our own solutions.
Walking away with a much clearer picture of what it actually takes to power the AI everyone talks about.
