Longsys

Name: Longsys
Address: Floor 20, 22, 23, B Tower, Horoy Qianhai Finance Centre Phase II, No. 5059, Tinghai Avenue, Qianhai, Shenzhen, 518057, CN
Telephone: +8675586168848
Price range: Not applicable

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Longsys

Established in 1999, Longsys (301308.SZ) is a branded semiconductor memory enterprise.

Longsys is engaged in the R&D, design, and sales of Flash memory and dynamic random access memory (DRAM). With its primary focus being on storage products and applications, the company has formed core competitiveness, such as firmware algorithm development, storage chip testing, integrated package design, and storage product customization. It provides consumer, industrial, and automotive storage p

roducts along with software and hardware application solutions for industrial storage. Longsys has formed four product lines: embedded storage, solid-state drive (SSD), mobile storage, and memory module, and also owns the industrial storage brand FORESEE and international high-end consumer storage brand Lexar. Longsys storage products are widely used in smartphones, smart TVs, tablets, computers, communication devices, wearable devices, Internet of Things (IoT), security monitoring, industrial control, automotive electronics, and personal mobile storage.

07/08/2026

✨ Highlights | Recap of an Inspiring Week
What an incredible experience at FMS 2026! From AI Agent Hosts and AI PCs to AI Mobile devices, Longsys showcased how innovative memory and storage solutions are enabling smarter, more efficient edge AI experiences. Through live demonstrations of our Edge AI Storage Fusion solutions and insightful conversations with industry partners, we were excited to connect with innovators from around the world and explore the future of memory and storage together.
Thank you to everyone who visited our booth, joined our keynote session, and shared valuable ideas with us throughout the event.
See you next year! 🚀

06/08/2026

🎤A great moment on the keynote stage!
At hashtag , Jian Chen, Chief Scientific Officer of Longsys, delivered a keynote speech on “Intelligence at the Edge: Powered by the Storage Foundry Model.”
During the session, Jian shared deep insights into Longsys’ Storage Foundry Model and how full-stack customization capabilities are accelerating edge AI innovation. He introduced three tailored solutions — HLCache™, iSA™ + AISSD™, and AIDIMM™ — designed for AI Mobile, AI PC, and AI BOX applications, addressing key challenges such as DRAM cost, capacity limitations, and bandwidth constraints to enable more efficient edge intelligence.
Thank you to FMS2026 and everyone who joined us for the insightful discussions and valuable exchanges!

05/08/2026

Day 1 at FMS: Future of Memory and Storage is in full swing! 🎉
The energy on the show floor is electric as Longsys showcases “Edge AI Storage Fusion” — bringing together industry partners, engineers, and innovators to explore the future of AI-powered storage.
From live demonstrations featuring AMD collaboration to hands-on experiences with our latest AI PC and AI Mobile solutions, Longsys is demonstrating how advanced memory and storage technologies are pushing the boundaries of Edge AI.
A huge thank you to everyone who stopped by our booth for inspiring conversations and valuable connections. More exciting moments are ahead as FMS 2026 continues! 👇

03/08/2026

Future of Memory and Storage 2026 kicks off soon! 🚀
We're excited to be at . Don't miss our keynote on August 5
Intelligence at the Edge: Powered by the Storage Foundry Model

Join us as we explore how Longsys is enabling the next generation of Edge AI through the Storage Foundry Model.
📅 Wednesday, August 5
🕝 2:20 PM
📍 Mission City Ballroom

Looking forward to connecting with industry partners, customers, and innovators throughout the event. While you're at FMS, stop by Booth 215 to meet our team and explore the latest intelligent storage solutions.

27/07/2026

🚀 Longsys is heading to FMS: Future of Memory and Storage 2026!
Join us in California, August 4–6, as we unveil "Edge AI Storage Fusion" — our vision for how storage and edge AI are converging to power the next generation of intelligent devices.
📍At booth 215, Hall A, we'll showcase integrated storage solutions across three key edge AI scenarios:
🔹 AI Box intelligent agent hosts
🔹 AI PC terminals
🔹 AI Mobile embedded devices
Plus, don't miss our Chief Scientist Dr. Chen Jian as he takes the stage to share insights on "Intelligence at the Edge: Powered by the Storage Foundry Model."
See you at FMS 2026!

08/06/2026

✨What an amazing journey at COMPUTEX TAIPEI 2026!

It’s been an incredible few days connecting with industry peers, partners and visitors from around the globe. At our booth, Longsys, together with our high-end consumer storage brand Lexar, fully showcased our full-stack edge AI storage portfolio. We’ve shared our latest innovations, and exchanged insights on edge AI development.

Check out our recap video for the show highlights. Great to connect with you all — see you next time! 🙌

05/06/2026

🚀 Meet AILPBGA™: High-bandwidth memory for compact edge AI inference.
As AI moves to the edge, space and power are at a premium. Longsys introduces AILPBGA™ – a purpose-built memory chip that balances performance, cost, and efficiency.
🔹 256‑bit native bus | up to 307GB/s bandwidth
🔹 24GB–64GB configurable capacity | Full LPDDR interface compatibility
🔹 22×22mm compact package – fits seamlessly into embedded terminals
Ideal for AI inference, lightweight to mid‑sized LLM deployment, and space‑constrained edge devices.
Watch the video to see how AILPBGA™ empowers edge AI. 👇

03/06/2026

We’re thrilled to unveil AIDIMM™ at COMPUTEX TAIPEI 2026!

Dedicated memory purpose-built & optimized for edge AI inference, designed to resolve core pain points plaguing today’s AI agent hosts: insufficient memory capacity, LLM runtime lag and thermal throttling.
Quick product highlights:
✅ Up to 128GB capacity | 256-bit ultra-wide bus | 307.2GB/s single-channel bandwidth; single-module support for seamless 70B+ edge LLM running
✅ Optimized 4-chip LPDDR5x same-side layout enables seamless motherboard integration with minimal hardware retrofits, cutting customers’ upgrade costs
✅ Built-in FDVFS intelligent power regulation delivers dynamic voltage tuning (0.9V~1.05V), balancing top-tier performance & low power draw for AI PC & dense AI agent deployment

Catch our launch video to explore AIDIMM™’s edge AI advantages.

02/06/2026

⚡️Live from COMPUTEX TAIPEI 2026 | Edge AI Storage Debut

Our Computex opening kicks off with the global debut of two brand-new edge AI-focused memory innovations, targeting critical memory bottlenecks:
✅AIDIMM™ + AILPBGA™ | dedicated AI memory unveiled at the show
• AIDIMM™: One module enables stable 70B+ LLM deployment
• AILPBGA™: Cost-effective, compact & low-power solution for embedded AI inference scenarios
✅ Proprietary SPU+HLC+iSA suite curbs terminal DRAM footprint and hardware costs for edge AI agent deployments
✅ Complete PCIe Gen4/Gen5 high-speed mSSD lineup for long-running intensive AI computing
✅ Lexar Highlights: Full AI-Grade storage portfolio + limited Argentina co-branded releases

👉Stop by Booth R1006 for a live demo. See you there.

19/05/2026

📢 Join at COMPUTEX TAIPEI 2026!
This year, we’re bringing a full spectrum of storage solutions built to empower AI applications, featuring our comprehensive technical capabilities, diversified product portfolio, and cutting-edge technologies tailored for the edge AI era.
Stop by to explore our innovative storage portfolio, cutting-edge AI-powered solutions, and discuss how we can power your next-generation applications.

🗓️ Date: June 2–5, 2026
📍 Booth: R1006
📍 Address: 4F, Hall 2, Nangang Exhibition Center, Taipei

Address

Floor 20, 22, 23, B Tower, Horoy Qianhai Finance Centre Phase II, No. 5059, Tinghai Avenue, Qianhai
Shenzhen
518057

Telephone

+8675586168848

Website

http://www.longsys.com/

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