06/07/2026
Our company recently wrapped up participation in Shanghai Electronica, showcasing our core power semiconductor lineup: advanced thermal surface-mount packaging solutions, SCR thyristors, silicon carbide (SiC) devices, TVS protection components, and integrated power modules.
Against current industry headwinds of surging raw material costs and prolonged component lead times, we held extensive technical exchanges with global buyers. The booming AI server infrastructure sector stood out as a key growth driver, pushing higher demand for high-efficiency, high-reliability power and thermal management products.
Our differentiated SiC portfolio and optimized heat dissipation packaging drew strong customer interest, as clients seek cost-effective, supply-stable alternatives to ease supply chain pressure. We secured multiple potential cooperation leads covering data center, industrial control and new energy segments.
Moving forward, we will accelerate production capacity layout and thermal technology iteration to address tight delivery cycles, while rolling out customized power device solutions tailored for AI server high-power supply systems to capture emerging market opportunities.
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