Shenzhen Bicheng Electronics Technology Co., Ltd, Shenzhen (2026)

28/09/2026

RT/duroid 6202 PCB 20mil ENIG - Low Loss PTFE Laminate for Phased Array Antennas & Radar Systems--

https://www.highfrequencypcb.com/Rogers-PCBs/Rogers-RT-duroid-6202-PCB-20mil-ENIG-Low-Loss-PTFE-Laminate-for-Phased-Array-Antennas-Radar-Systems26-8(9).html

(Note: Printed Circuit Boards are custom-made products. Images and parameters are for reference only.)

1. Introduction to RT/duroid 6202 High Frequency PCB

Rogers RT/duroid 6202 high frequency circuit materials are low loss and low dielectric constant laminates with limited woven glass reinforcement. It offers electrical and mechanical properties essential in designing complex microwave structures that are mechanically reliable and electrically stable. Excellent dimensional stability (0.05 to 0.07 mils/inch) is achieved by the addition of limited woven glass reinforcement. This often eliminates double etching to achieve tight positional tolerances.

Applications particularly suited to the unique properties of RT/duroid 6202 material include flat and non-planar structures such as antennas and complex multilayer circuits with interlayer components.

This 2-layer rigid PCB is constructed with RT/duroid 6202 as the core material at 20mil (0.508mm) thickness, with ENIG surface finish, green top solder mask, white top silkscreen, and 1oz copper on both sides. Its DK of 2.94 offers excellent high-frequency performance with low loss, making it ideal for demanding applications such as phased array antennas, ground based and airborne radar systems, GPS antennas, power backplanes, and beam forming networks.

RT/duroid 6202 PCB

2. Key Features of RT/duroid 6202 PCB

Dielectric Constant (Dk): 2.94 ± 0.04 (≥0.020" laminates) at 10GHz/23°C

DK of 0.005" laminates: 3.06 ± 0.04

DK of 0.010" and 0.015" laminates: 3.02 ± 0.04

Dissipation Factor (Df): 0.0015 at 10GHz/23°C

Low Thermal Coefficient of Dk: 5 ppm/°C at 10GHz (-50°C to +150°C)

CTE (-55 to 288°C): X-axis 15 ppm/°C, Y-axis 15 ppm/°C, Z-axis 30 ppm/°C

Td: 500°C TGA

Thermal Conductivity: 0.68 W/(M·K)

Moisture Absorption: 0.04%

UL 94-V0 Flammability Rating

Excellent dimensional stability (0.05 to 0.07 mils/inch)

Limited woven glass reinforcement

3. Benefits of RT/duroid 6202 PCB

Low Loss — Excellent high frequency performance with minimal signal loss

In-plane Expansion Coefficient Matched to Copper — Reliable plated through holes

Excellent Electrical and Mechanical Properties — Mechanically reliable and electrically stable

Very Low Etch Shrinkage — Tight positional tolerances, often eliminating double etching

Excellent Dimensional Stability (0.05 to 0.07 mils/inch) — Consistent performance

Low Thermal Coefficient of Dk (5 ppm/°C) — Stable electrical performance over temperature

Low Moisture Absorption (0.04%) — Stable performance in humid environments

ENIG Finish — Excellent solderability, corrosion resistance, and wire bondability

4. PCB Construction Details

Click to collapse the table
Item Specification
Base material Rogers RT/duroid 6202 (PTFE + Limited Woven Glass Reinforcement)
Layer count 2-layer rigid PCB
Board dimensions 42.36mm x 21.9mm = 1 PCS
Minimum Trace/Space 4/7 mils
Minimum Hole Size 0.4mm
Blind vias No
Finished board thickness 0.6mm
Finished Cu weight 1 oz (35 μm / 1.4 mils) outer layers
Via plating thickness 20 μm
Surface finish ENIG
Top Silkscreen White
Bottom Silkscreen No
Top Solder Mask Green
Bottom Solder Mask No
100% Electrical test Used prior to shipment

5. PCB Stackup (2-Layer Rigid Structure)

Layer: Copper_layer_1 (Top), Material: Copper, Thickness: 35 μm (1 oz)

Layer: Dielectric, Material: Rogers RT/duroid 6202 Substrate, Thickness: 0.508 mm (20mil)

Layer: Copper_layer_2 (Bottom), Material: Copper, Thickness: 35 μm (1 oz)

6. PCB Statistics

Components: 13
Total Pads: 20
Thru Hole Pads: 11
Top SMT Pads: 9
Bottom SMT Pads: 0
Vias: 6
Nets: 2

7. Rogers RT/duroid 6202 Material – Product Introduction

RT/duroid 6202 high frequency circuit material is a low loss and low dielectric constant laminate offering superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable.

Excellent dimensional stability (0.05 to 0.07 mils/inch) is achieved by the addition of limited woven glass reinforcement. This often eliminates double etching to achieve tight positional tolerances.

½ oz. to 2 oz./ft.² electrodeposited and rolled copper foil may be specified as cladding on dielectric thicknesses from 0.005" to 0.060" (0.127 to 1.524 mm).

Applications particularly suited to the unique properties of RT/duroid 6202 material include flat and non-planar structures such as antennas and complex multilayer circuits with interlayer components.

RT/duroid 6202 Material

8. Features and Benefits Summary

Feature Benefit
DK 2.94 ± 0.04 @ 10GHz (≥0.020") Stable dielectric constant for consistent impedance control
Df 0.0015 @ 10GHz Low loss for high-frequency RF and microwave designs
TCDK: 5 ppm/°C Extremely low thermal coefficient of dielectric constant
CTE: 15/15/30 ppm/°C In-plane expansion coefficient matched to copper
Td: 500°C TGA High thermal stability for demanding environments
Thermal Conductivity 0.68 W/m/K Efficient heat removal
Moisture Absorption 0.04% Excellent stability in humid conditions
UL 94 V-0 Flame retardant for safety compliance
Excellent dimensional stability Very low etch shrinkage, tight positional tolerances
ENIG finish Excellent solderability, corrosion resistance, wire bondability

9. RT/duroid 6202 Typical Properties (Data Sheet)

Click to collapse the table
Property Typical Value Condition Unit Test Method
Electrical Properties
Dielectric Constant (DK) 2.94 ± 0.04 ≥0.020" laminates, 10 GHz / 23°C — IPC-TM-650 2.5.5.5
Dielectric Constant (DK) 3.02 ± 0.04 0.010" and 0.015" laminates, 10 GHz / 23°C — IPC-TM-650 2.5.5.5
Dielectric Constant (DK) 3.06 ± 0.04 0.005" laminates, 10 GHz / 23°C — IPC-TM-650 2.5.5.5
Dissipation Factor (Df) 0.0015 10 GHz / 23°C — IPC-TM-650 2.5.5.5
Thermal Coefficient of DK 5 10 GHz, -50°C to +150°C ppm/°C —
Thermal Properties
CTE (X-axis) 15 -55 to 288°C ppm/°C IPC-TM-650 2.4.41
CTE (Y-axis) 15 -55 to 288°C ppm/°C IPC-TM-650 2.4.41
CTE (Z-axis) 30 -55 to 288°C ppm/°C IPC-TM-650 2.4.41
Decomposition Temperature (Td) 500 TGA °C —
Thermal Conductivity 0.68 — W/(M·K) —
Mechanical & Physical Properties
Moisture Absorption 0.04 — % —
Flammability Rating V-0 UL-94 — UL 94
Material Composition
Composition PTFE with limited woven glass reinforcement
Copper Foil ½ oz. to 2 oz./ft.² electrodeposited and rolled copper foil; dielectric thicknesses from 0.005" to 0.060" (0.127 to 1.524 mm)

10. Primary Application Areas

Phased Array Antennas

Ground Based and Airborne Radar Systems

Global Positioning System Antennas

Power Backplanes

Commercial Airline Collision Avoidance

Beam Forming Networks

High Reliability Complex Multilayer Circuits

11. Quality Assurance

Type of artwork supplied: Ge**er RS-274-X

Accepted standard: IPC-Class-2

Availability: Worldwide

100% Electrical test prior to shipment

12. Standard Thickness, Panel Sizes & Claddings

Parameter Options
Dielectric Thickness Range 0.005" to 0.060" (0.127mm to 1.524mm)
Standard Copper Cladding ½ oz. to 2 oz./ft.² electrodeposited and rolled copper foil
Special Options Contact Rogers Corporation for additional thicknesses, other sizes & any other type of cladding

22/09/2026

F4BTME350 High Frequency PCB PTFE RF Circuit Board with Immersion Gold
https://www.highfrequencypcb.com/PTFE-PCBs/F4BTME350-High-Frequency-PCB-PTFE-RF-Circuit-Board-with-Immersion-Gold26-8(7).html

(Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.)

1. Introduction to F4BTME350 High Frequency PCB

The F4BTME series laminates are manufactured through a meticulous process that involves the scientific formulation of glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin.

These substrates are built upon the F4BM dielectric layer and incorporate high dielectric constant and low loss nano-ceramics. This integration results in enhanced dielectric constant, superior heat resistance, reduced thermal expansion coefficient, increased insulation resistance, and improved thermal conductivity, all while maintaining low loss characteristics.

Furthermore, F4BTME laminates are specifically paired with reverse-treated RTF copper foil, providing exceptional performance in terms of PIM, precise line control, and minimized conductor loss.

This 2-layer rigid PCB is constructed entirely with F4BTME350 as the core material at 10mil (0.254mm) thickness, with immersion gold surface finish, black top solder mask, white top silkscreen, and 1oz RTF copper on both sides. Its DK of 3.5 offers excellent high-frequency performance, making it ideal for demanding applications such as 4G/5G base station antennas, LNAs, LNBs/LNCs, phased array antennas, satellite communications, and radar systems.

F4BTME350 PCB

2. Key Features of F4BTME350 PCB

Dielectric Constant (DK): 3.5 ± 0.07 at 10GHz

Dissipation Factor (Df): 0.0025 at 10GHz / 0.0035 at 20GHz

TCDK: -60 ppm/°C (-55°C to 150°C)

CTE: X-axis 10 ppm/°C, Y-axis 12 ppm/°C, Z-axis 51 ppm/°C (-55°C to 288°C)

Thermal Conductivity: 0.54 W/(M·K)

Moisture Absorption: ≤0.05%

PIM Value: ≤ -160 dBc (F4BTME only)

Peel Strength (1oz F4BTME): >1.4 N/mm

Volume Resistivity: ≥1×10⁷ MΩ·cm

Surface Resistivity: ≥1×10⁶ MΩ

Electrical Strength (Z direction): >32 KV/mm

Breakdown Voltage (XY direction): >40 KV

Density: 2.20 g/cm³

Long-term Operating Temperature: -55°C to +260°C

UL 94 V-0 Flammability Rating

Radiation resistance and low outgassing

3. Benefits of F4BTME350 PCB

Stable DK (3.5±0.07) — Consistent impedance control for high-frequency designs

Low Df (0.0025 @ 10GHz) — Excellent signal integrity with minimal insertion loss

Excellent PIM Performance (≤ -160 dBc) — Critical for low intermodulation distortion systems

Low CTE (10/12/51 ppm/°C) — Exceptional dimensional stability, matched to copper

High Thermal Conductivity (0.54 W/mK) — Superior heat dissipation for high-power applications

Nano-Ceramic Filled PTFE — Enhanced dielectric constant, reduced thermal expansion

RTF Copper Foil — Reduced conductor loss, excellent peel strength, precise line control

Radiation Resistance & Low Outgassing — Suitable for aerospace applications

Immersion Gold Finish — Excellent solderability, corrosion resistance, and wire bondability

4. PCB Construction Details

Click to collapse the table
Item Specification
Base material Wangling F4BTME350 (PTFE + Nano-Ceramic + Glass Fiber + RTF Copper)
Layer count 2 layers
Board dimensions 89.77mm x 45.16mm = 1 PCS, ±0.15mm
Minimum Trace/Space 6/8 mils
Minimum Hole Size 0.25mm
Blind vias No
Finished board thickness 0.3mm
Finished Cu weight 1 oz (35 μm / 1.4 mils) all layers
Via plating thickness 20 μm
Surface finish Immersion Gold
Top Silkscreen White
Bottom Silkscreen No
Top Solder Mask Black
Bottom Solder Mask No
100% Electrical test Used prior to shipment

5. PCB Stackup (2-Layer Rigid Structure)

Layer: Copper_layer_1 (Top), Material: Copper (RTF), Thickness: 35 μm (1 oz)

Layer: Dielectric, Material: F4BTME350 Core, Thickness: 0.254 mm (10mil)

Layer: Copper_layer_2 (Bottom), Material: Copper (RTF), Thickness: 35 μm (1 oz)

6. PCB Statistics

Components: 12
Total Pads: 38
Thru Hole Pads: 17
Top SMT Pads: 21
Bottom SMT Pads: 0
Vias: 9
Nets: 2

7. Wangling F4BTME350 Material – Product Introduction

The F4BTME series laminates are manufactured through a meticulous process that involves the scientific formulation of glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin.

These substrates are built upon the F4BM dielectric layer and incorporate high dielectric constant and low loss nano-ceramics. This integration results in enhanced dielectric constant, superior heat resistance, reduced thermal expansion coefficient, increased insulation resistance, and improved thermal conductivity, all while maintaining low loss characteristics.

Furthermore, F4BTME laminates are specifically paired with reverse-treated RTF copper foil, providing exceptional performance in terms of PIM, precise line control, and minimized conductor loss.

F4BTME350 features a dielectric constant of 3.5±0.07 at 10GHz, dissipation factor of 0.0025 at 10GHz and 0.0035 at 20GHz, along with excellent thermal stability. The material operates reliably across a wide temperature range from -55°C to +260°C and is suitable for high-reliability RF and microwave applications.

8. Features and Benefits Summary

Feature Benefit
DK 3.5 ± 0.07 @ 10GHz Stable dielectric constant for consistent impedance control
Df 0.0025 @ 10GHz Low loss for high-frequency RF and microwave designs
Excellent PIM (≤ -160 dBc) Ideal for low intermodulation distortion systems
TCDK: -60 ppm/°C Stable electrical performance over temperature
CTE: 10/12/51 ppm/°C Excellent dimensional stability and reliable plated through holes
Thermal conductivity 0.54 W/m/K Efficient heat removal for high-power applications
Nano-ceramic filled PTFE Enhanced dielectric constant and reduced thermal expansion
RTF copper foil Reduced conductor loss, precise line control
Radiation resistance & low outgassing Ideal for aerospace, satellite, and defense applications
Immersion Gold finish Excellent solderability, corrosion resistance, wire bondability

9. F4BTME350 Typical Properties (Data Sheet)

Click to collapse the table
Property Typical Value Condition Unit Test Method
Electrical Properties
Dielectric Constant (Typical) 3.5 ± 0.07 10 GHz — GB/T 12636-1990 / IPC-TM-650 2.5.5.5 Stripline
Dissipation Factor 0.0025 10 GHz — GB/T 12636-1990
Dissipation Factor 0.0035 20 GHz — GB/T 12636-1990
TCDK -60 -55°C ~ 150°C ppm/°C —
Volume Resistivity ≥1×10⁷ Normal State MΩ·cm IPC-TM-650
Surface Resistivity ≥1×10⁶ Normal State MΩ IPC-TM-650
Electrical Strength (Z direction) >32 5KW, 500V/s KV/mm IPC-TM-650 2.5.6.2
Breakdown Voltage (XY direction) >40 5KW, 500V/s KV IPC-TM-650
PIM Value ≤ -160 F4BTME only dBc —
Thermal Properties
CTE (X-axis) 10 -55°C ~ 288°C ppm/°C IPC-TM-650 2.4.41
CTE (Y-axis) 12 -55°C ~ 288°C ppm/°C IPC-TM-650 2.4.41
CTE (Z-axis) 51 -55°C ~ 288°C ppm/°C IPC-TM-650 2.4.41
Thermal Stress No Delamination 260°C, 10s, 3 times — IPC-TM-650
Thermal Conductivity 0.54 Z direction W/(M·K) —
Long-Term Operating Temp -55 ~ +260 — °C —
Mechanical & Physical Properties
Peel Strength (1oz F4BTME) >1.4 RTF Copper Foil N/mm IPC-TM-650 2.4.8
Water Absorption ≤0.05 20±2°C, 24 hours % ASTM D570
Density 2.20 Room Temperature g/cm³ —
Flammability V-0 UL-94 Grade UL 94
Material Composition
Composition PTFE + Glass Fiber + Nano-Ceramic (RTF Copper)

10. Primary Application Areas

Base station antennas for 4G/5G communications

Low Noise Amplifiers (LNAs), Low Noise Block downconverters (LNBs/LNCs)

Phased array antennas, phase-sensitive antennas

Satellite communications, aerospace and cabin equipment

Microwave and RF modules, radar systems (including automotive radar)

High-power amplifiers, passive components (e.g., power dividers, couplers, combiners)

PCS/PCN large-format antennas, feed networks

11. Quality Assurance

Type of artwork supplied: Ge**er RS-274-X

Accepted standard: IPC-Class-2

Availability: Worldwide

100% Electrical test prior to shipment

12. Standard Thickness, Panel Sizes & Claddings

Note: F4BTME350 minimum thickness is 0.254mm. The following thicknesses are available as either total thickness including copper or dielectric thickness. Please specify when ordering.

Parameter Options
Standard Dielectric Thicknesses (mm) 0.254 (min), 0.508, 0.762, 0.8, 1.0, 1.016, 1.27, 1.524, 2.0, 3.0, 4.0, 5.0, 6.0, 8.0, 10.0, 12.0
Thickness Tolerances (mm) 0.254: ±0.02, 0.508: ±0.04, 0.762: ±0.05, 0.8: ±0.05, 1.0: ±0.05, 1.016: ±0.05, 1.27: +0.06, 1.524: ±0.06, 2.0: ±0.075, 3.0: ±0.09, 4.0: ±0.1, 5.0: ±0.1, 6.0: ±0.12, 8.0: ±0.15, 10.0: ±0.18, 12.0: ±0.2
Standard Panel Sizes 460×610mm, 600×500mm, 914×1220mm (Note: thickness ≥4.0mm cannot provide 914×1220mm)
Standard Claddings (F4BTME) Reverse-treated RTF Copper: 0.5oz (18μm), 1oz (35μm)
Standard Claddings (F4BTM) ED Copper: 0.5oz (18μm), 1oz (35μm), 1.5oz (50μm), 2oz (70μm)
DK Options (F4BTME Series) 2.98, 3.0, 3.2, 3.5
Metal Base Options F4BTM(E)***-AL (Aluminum base), F4BTM(E)***-CU (Copper base) for shielding/heat dissipation

13. F4BTM & F4BTME Series Aluminum/Copper Base Option

The F4BTM and F4BTME series can also be provided with an aluminum or copper base, where one side of the dielectric layer is covered with copper foil and the other side is laminated with copper or aluminum for shielding or heat dissipation purposes. Model designation: F4BTM***-AL, F4BTME***-AL, F4BTM***-CU, or F4BTME***-CU.

Model Metal Base Specific Gravity Thermal Conductivity Available Metal Thickness Thickness Tolerance Available Sizes
F4BTM(E)-2-A***-CU Copper (Purple/Brass) 8.9 380 W/(M·K) 0.48, 0.98, 1.48, 1.98, 2.98, 3.98mm (other thicknesses available upon request) +0.02, -0.05 460×610mm, 460×305mm
F4BTM(E)-2-A***-AL Aluminum 2.7 180 W/(M·K) 0.48, 0.98, 1.48, 1.98, 2.98, 3.98mm (other thicknesses available upon request) +0.02, -0.05 460×610mm, 460×305mm
Example: F4BTM300-AL represents F4BTM300 with aluminum base. F4BTME350-CU represents F4BTME350 with copper base.

14. Data Source Notes

Dielectric Constant (Typical) is tested in the Z-direction of the material using GB/T 12636-1990 or IPC-TM-650 2.5.5.5 Stripline method.

Other properties are tested using or referencing IPC-TM-650 or GBT4722-2017 standard test methods.

All test data are typical measurement values intended to assist customers in material selection. They do not constitute any express or implied warranty and do not guarantee performance in specific applications. Customers are responsible for verifying the suitability of Wangling materials for each application.

21/09/2026

Wangling F4BTMS220 2-Layer 10mil Immersion Gold High Frequency PCB for Aerospace & Radar Applications--

https://www.highfrequencypcb.com/PTFE-PCBs/Wangling-F4BTMS220-2-Layer-10mil-Immersion-Gold-High-Frequency-PCB-for-Aerospace-Radar-Applications26-8(6).html

(Note: Printed Circuit Boards are custom-made products. Images and parameters are for reference only.)

1. Introduction to F4BTMS220 High Frequency PCB

The F4BTMS series is an upgraded version of the F4BTM series. It has achieved a technological breakthrough in material formulation and manufacturing processes. The material has been enriched with a significant amount of ceramics and reinforced with ultra-thin and ultra-fine glass fiber cloth, resulting in substantial improvements in material performance and a broader range of dielectric constants. It is a high-reliability material suitable for aerospace applications and can replace similar foreign products.

By incorporating a small amount of ultra-thin and ultra-fine glass fiber cloth and a large amount of uniformly distributed special nano-ceramics mixed with polytetrafluoroethylene resin, the negative effects of glass fiber on electromagnetic wave propagation are minimized. This reduces dielectric loss, enhances dimensional stability, and decreases the X/Y/Z anisotropy of the material. It also increases the usable frequency range, improves electrical strength, and enhances thermal conductivity. Additionally, the material exhibits excellent low thermal expansion coefficient and stable dielectric temperature characteristics.

The F4BTMS series comes with RTF low roughness copper foil as a standard feature, which reduces conductor loss and provides excellent peel strength. It can be used with either copper or aluminum bases.

This 2-layer rigid PCB is constructed entirely with F4BTMS220 as the core material at 10mil (0.254mm) thickness, with immersion gold surface finish and 1oz RTF copper on both sides. Its DK of 2.2 offers excellent high-frequency performance, making it ideal for demanding applications such as aerospace equipment, microwave, RF, radar, military radar, phased array antennas, and satellite communications.

F4BTMS220 PCB

2. Key Features of F4BTMS220 PCB

Dielectric Constant (DK): 2.2 at 10GHz

Dissipation Factor (Df): 0.0009 at 10GHz / 0.0010 at 20GHz / 0.0013 at 40GHz

TCDK: -130 ppm/°C (-55°C to 150°C)

CTE: X-axis 40 ppm/°C, Y-axis 50 ppm/°C, Z-axis 290 ppm/°C (-55°C to 288°C)

Thermal Conductivity: 0.26 W/(M·K)

Low Moisture Absorption: 0.02%

Peel Strength (1oz RTF): >2.4 N/mm

Volume Resistivity: ≥1×10⁸ MΩ·cm

Surface Resistivity: ≥1×10⁸ MΩ

Electrical Strength (Z direction): >26 KV/mm

Breakdown Voltage (XY direction): >35 KV

Density: 2.18 g/cm³

Long-term Operating Temperature: -55°C to +260°C

UL 94 V-0 Flammability Rating

Excellent radiation resistance — stable dielectric and physical properties after irradiation

Low outgassing — meets aerospace vacuum outgassing requirements

Excellent dimensional stability

Low dielectric constant tolerance and excellent batch-to-batch consistency

3. Benefits of F4BTMS220 PCB

Stable DK (2.2) — Consistent impedance control for high-frequency designs

Ultra-Low Df (0.0009 @ 10GHz) — Excellent signal integrity with minimal insertion loss

Low CTE (40/50/290 ppm/°C) — Good dimensional stability

Thermal Conductivity (0.26 W/mK) — Suitable for various RF applications

Ultra-Thin Glass Fiber Reinforcement — Minimized glass fiber effect, reduced dielectric loss

RTF Copper Foil — Reduced conductor loss, excellent peel strength

Excellent Radiation Resistance & Low Outgassing — Aerospace-grade for space applications

Frequency Stability up to 40GHz — Stable DK and low loss across wide frequency range

Immersion Gold Finish — Excellent solderability, corrosion resistance, and wire bondability

4. PCB Construction Details

Click to collapse the table
Item Specification
Base material Wangling F4BTMS220 (PTFE + Nano-Ceramic + Ultra-Thin Glass + RTF Copper)
Layer count 2-layer rigid PCB
Board dimensions 36.4mm x 88.76mm = 1 PCS, ±0.15mm
Minimum Trace/Space 6/7 mils
Minimum Hole Size 0.4mm
Blind vias No
Finished board thickness 0.3mm
Finished Cu weight 1 oz (35 μm / 1.4 mils) all layers
Via plating thickness 20 μm
Surface finish Immersion Gold
Top Silkscreen No
Bottom Silkscreen No
Top Solder Mask No
Bottom Solder Mask No
100% Electrical test Used prior to shipment

5. PCB Stackup (2-Layer Rigid Structure)

Layer: Copper_layer_1 (Top), Material: Copper (RTF), Thickness: 35 μm (1 oz)

Layer: Dielectric, Material: F4BTMS220 Core, Thickness: 0.254 mm (10mil)

Layer: Copper_layer_2 (Bottom), Material: Copper (RTF), Thickness: 35 μm (1 oz)

6. PCB Statistics

Components: 14
Total Pads: 32
Thru Hole Pads: 19
Top SMT Pads: 13
Bottom SMT Pads: 0
Vias: 11
Nets: 2

7. Wangling F4BTMS220 Material – Product Introduction

The F4BTMS series is an upgraded version of the F4BTM series. It has achieved a technological breakthrough in material formulation and manufacturing processes. The material has been enriched with a significant amount of ceramics and reinforced with ultra-thin and ultra-fine glass fiber cloth, resulting in substantial improvements in material performance and a broader range of dielectric constants. It is a high-reliability material suitable for aerospace applications and can replace similar foreign products.

By incorporating a small amount of ultra-thin and ultra-fine glass fiber cloth and a large amount of uniformly distributed special nano-ceramics mixed with polytetrafluoroethylene resin, the negative effects of glass fiber on electromagnetic wave propagation are minimized. This reduces dielectric loss, enhances dimensional stability, and decreases the X/Y/Z anisotropy of the material. It also increases the usable frequency range, improves electrical strength, and enhances thermal conductivity. Additionally, the material exhibits excellent low thermal expansion coefficient and stable dielectric temperature characteristics.

The F4BTMS series comes with RTF low roughness copper foil as a standard feature, which reduces conductor loss and provides excellent peel strength. It can be used with either copper or aluminum bases. F4BTMS294 can be paired with embedded 50Ω resistor copper foil to form resistor film boards.

PCB processing can follow standard PTFE board process technology. The material's excellent mechanical and physical properties make it suitable for multilayer, high-multilayer, and backplane processing. It also demonstrates excellent processability in dense hole and fine line applications.

F4BTMS220 features a dielectric constant of 2.2 at 10GHz, ultra-low dissipation factor of 0.0009 at 10GHz, 0.0010 at 20GHz, and 0.0013 at 40GHz, along with excellent thermal stability. The material operates reliably across a wide temperature range from -55°C to +260°C and is suitable for high-reliability aerospace applications.

F4BTMS220 Material

8. Features and Benefits Summary

Feature Benefit
Low DK tolerance and excellent batch-to-batch consistency Consistent electrical performance across production batches
Ultra-low dielectric loss Superior signal integrity for high-frequency designs
Stable DK and low loss up to 40GHz Meets phase-sensitive application requirements
Excellent frequency and phase stability from -55°C to 150°C Reliable performance across temperature extremes
Excellent radiation resistance Stable dielectric and physical properties after irradiation
Low outgassing Meets aerospace vacuum outgassing requirements
Low CTE (40/50/290 ppm/°C) Good dimensional stability and reliable plated through holes
Thermal conductivity (0.26 W/mK) Suitable for various RF applications
Excellent dimensional stability Consistent performance across varying conditions
Low moisture absorption (0.02%) Stable performance in humid environments
Immersion Gold finish Excellent solderability, corrosion resistance, wire bondability

9. F4BTMS220 Typical Properties (Data Sheet)

Click to collapse the table
Property Typical Value Condition Unit Test Method
Electrical Properties
Dielectric Constant (Typical) 2.2 10 GHz — GB/T 12636-1990 / IPC-TM-650 2.5.5.5 Stripline
Dielectric Constant (Design) 2.2 10 GHz — 50Ω Microstrip Line
DK Tolerance ±0.02 — — —
Dissipation Factor 0.0009 10 GHz — GB/T 12636-1990
Dissipation Factor 0.0010 20 GHz — GB/T 12636-1990
Dissipation Factor 0.0013 40 GHz — GB/T 12636-1990
TCDK -130 -55°C ~ 150°C ppm/°C —
Volume Resistivity ≥1×10⁸ Normal State MΩ·cm IPC-TM-650
Surface Resistivity ≥1×10⁸ Normal State MΩ IPC-TM-650
Electrical Strength (Z direction) >26 5KW, 500V/s KV/mm IPC-TM-650 2.5.6.2
Breakdown Voltage (XY direction) >35 5KW, 500V/s KV IPC-TM-650
Thermal Properties
CTE (X-axis) 40 -55°C ~ 288°C ppm/°C IPC-TM-650 2.4.41
CTE (Y-axis) 50 -55°C ~ 288°C ppm/°C IPC-TM-650 2.4.41
CTE (Z-axis) 290 -55°C ~ 288°C ppm/°C IPC-TM-650 2.4.41
Thermal Stress No Delamination 260°C, 10s, 3 times — IPC-TM-650
Thermal Conductivity 0.26 Z direction W/(M·K) —
Long-Term Operating Temp -55 ~ +260 — °C —
Mechanical & Physical Properties
Peel Strength (1oz RTF) >2.4 RTF Copper Foil N/mm IPC-TM-650 2.4.8
Water Absorption 0.02 20±2°C, 24 hours % ASTM D570
Density 2.18 Room Temperature g/cm³ —
Flammability V-0 UL-94 Grade UL 94
Material Composition
Composition PTFE + Ultra-Thin Ultra-Fine Glass Fiber + Nano-Ceramic (RTF Copper)

10. F4BTMS220 Electrical Performance Characteristics

Excellent Frequency Stability: The material maintains a stable dielectric constant and low loss values across the 0.5～40GHz frequency range, meeting design requirements across different frequencies.

Excellent Temperature Stability: TCDK is approximately -130 ppm/°C over the -55～150°C range, with minimal variation. The actual usable temperature of the material far exceeds this range.

11. Primary Application Areas

Aerospace equipment, space and cabin equipment

Microwave and RF applications

Radar and military radar systems

Feed networks

Phase-sensitive antennas and phased array antennas

Satellite communications

High-reliability aerospace and defense applications

12. Quality Assurance

Type of artwork supplied: Ge**er RS-274-X

Accepted standard: IPC-Class-2

Availability: Worldwide

100% Electrical test prior to shipment

13. Standard Thickness, Panel Sizes & Claddings

Note: F4BTMS220 minimum thickness is 0.09mm. Multiples of 0.09mm or 0.127mm thickness are available.

Parameter Options
Standard Dielectric Thicknesses (mm/mil) 0.090mm (3.5mil), 0.127mm (5.0mil), 0.254mm (10mil), 0.508mm (20mil), 0.635mm (25mil), 0.762mm (30mil), 0.787mm (30.1mil), 1.016mm (40mil), 1.270mm (50mil), 1.50mm (59mil), 1.524mm (60mil), 1.575mm (62mil), 2.03mm (80mil), 2.54mm (100mil), 3.175mm (125mil), 4.06mm (160mil), 5.08mm (200mil), 6.35mm (250mil)
Thickness Tolerances (mm) 0.090mm: ±0.010, 0.127mm: ±0.0127, 0.254mm: ±0.02, 0.508mm: ±0.03, 0.635mm: ±0.04, 0.762mm: ±0.04, 0.787mm: ±0.04, 1.016mm: ±0.05, 1.270mm: ±0.05, 1.50mm: ±0.06, 1.524mm: ±0.06, 1.575mm: ±0.06, 2.03mm: ±0.08, 2.54mm: ±0.10, 3.175mm: ±0.13, 4.06mm: ±0.18, 5.08mm: ±0.20, 6.35mm: ±0.25
Standard Panel Sizes 305×460mm (12×18"), 460×610mm (18×24"), 610×920mm (24×36")
Standard Claddings RTF Low-Profile Copper: 0.5oz (18μm), 1oz (35μm); Embedded 50Ω resistor copper foil available
Metal Base Options F4BTMS***-AL (Aluminum base), F4BTMS***-CU (Copper base) for shielding/heat dissipation

14. F4BTMS Series Aluminum/Copper Base Option

The F4BTMS series can also be provided with an aluminum or copper base, where one side of the dielectric layer is covered with copper foil and the other side is laminated with copper or aluminum for shielding or heat dissipation purposes. Model designation: F4BTMS***-AL or F4BTMS***-CU.

Model Metal Base Specific Gravity Thermal Conductivity CTE Available Metal Thickness Thickness Tolerance Available Sizes
F4BTMS***-CU Copper (Purple/Brass) 8.9 380 W/(M·K) 17 ppm/°C 0.48, 0.98, 1.48, 1.98, 2.98, 3.98mm (other thicknesses available upon request) +0.02, -0.05 460×610mm, 460×305mm
F4BTMS***-AL Aluminum 2.7 180 W/(M·K) 24 ppm/°C 0.48, 0.98, 1.48, 1.98, 2.98, 3.98mm (other thicknesses available upon request) +0.02, -0.05 460×610mm, 460×305mm
Example: F4BTMS220-AL represents F4BTMS220 with aluminum base. F4BTMS220-CU represents F4BTMS220 with copper base.

15. Data Source Notes

Dielectric Constant (Typical) is tested in the Z-direction of the material using GB/T 12636-1990 or IPC-TM-650 2.5.5.5 Stripline method.

Dielectric Constant (Design) is tested using the 50Ω Microstrip Line method, also in the Z-direction.

Other properties are tested using or referencing IPC-TM-650 or GBT4722-2017 standard test methods.

All test data are typical measurement values intended to assist customers in material selection. They do not constitute any express or implied warranty and do not guarantee performance in specific applications. Customers are responsible for verifying the suitability of Wangling materials for each application.

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28/09/2026

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