Shenzhen Bicheng Electronics Technology Co., Ltd, Shenzhen (2026)

20/05/2026

👏Rogers RO4533 2-Layer 0.6mm Immersion Gold PCB – Antenna Grade Applications

https://www.highfrequencypcb.com/NEWLY%20SHIPPED%20PCB/Rogers-RO4533-2-Layer-0.6mm-Immersion-Gold-PCB%E2%80%93Antenna-Grade-Applications26-4(6).html

Rogers RO4533 2-Layer 0.6mm Immersion Gold PCB – Antenna Grade Applications

1. Introduction to Rogers RO4533 PCB

Rogers RO4533 laminates are ceramic-filled, glass-reinforced hydrocarbon based material set, providing the controlled dielectric constant, low loss performance and excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.

RO4533 laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing. These laminates do not require special treatment needed on traditional PTFE-based laminates for plated through-hole preparation. It is an affordable alternative to more conventional PTFE antenna technologies, thus allowing designers to optimize the price and performance of their antennas. Moreover, RO4533 laminates are available halogen-free to meet the most stringent "green" standards.

The resin systems of RO4533 dielectric materials are designed to provide the necessary properties for ideal antenna performance. The coefficients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper. The good CTE match reduces stresses in the printed circuit board antenna. The typical glass transition temperature of RO4533 materials exceeds 280°C (536°F), leading to a low z-axis CTE and excellent plated through-hole reliability.

This 2-layer rigid PCB is constructed entirely with Rogers RO4533 as the core material, making it ideal for cellular infrastructure base station antennas and WiMAX antenna networks.

RO4533 PCB 20mil 2-layer Immersion gold

2. Key Features of Rogers RO4533 PCB

Dielectric constant of 3.3 at 10 GHz (±0.08)

Dissipation factor of 0.0020 at 2.5 GHz and 0.0025 at 10 GHz

X-axis CTE of 13 ppm/°C, Y-axis CTE of 11 ppm/°C, Z-axis CTE of 37 ppm/°C

Tg > 280°C

Low moisture absorption of 0.02%

Thermal conductivity of 0.6 W/(m·K)

Low PIM performance better than -157 dBc (typical)

Halogen-free available

3. Benefits of Rogers RO4533 PCB

Low loss, low Dk and low PIM response for wide range of application use

Thermoset resin system compatible with standard PCB fabrication (FR-4 processes)

Excellent dimensional stability for greater yield on larger panel sizes

Uniform mechanical properties for maintaining mechanical form during handling

High thermal conductivity for improved power handling

Good CTE match with copper reduces stresses in PCB antenna

Low z-axis CTE and excellent plated through-hole reliability

No special via preparation required (no sodium etch)

Affordable alternative to PTFE antenna technologies

4. Rogers RO4533 PCB Construction Details

Item Specification
Base material Rogers RO4533
Layer count 2 layers
Board dimensions 123.5mm x 46mm = 1 PCS, +/- 0.15mm
Minimum Trace/Space 4/5 mils
Minimum Hole Size 0.25mm
Blind vias No
Finished board thickness 0.6mm
Finished Cu weight 1 oz (1.4 mils) outer layers
Via plating thickness 20 μm
Surface finish Immersion Gold
Top Silkscreen White
Bottom Silkscreen No
Top Solder Mask Green
Bottom Solder Mask No
100% Electrical test Used prior to shipment

5. PCB Stackup (2-Layer Rigid Structure)

Copper_layer_1 - 35 μm (1 oz)

Rogers RO4533 Core - 0.508 mm (20 mil)

Copper_layer_2 - 35 μm (1 oz)

6. PCB Statistics

Components: 36

Total Pads: 28

Thru Hole Pads: 18

Top SMT Pads: 10

Bottom SMT Pads: 0

Vias: 17

Nets: 2

7. Primary Application Areas

Cellular infrastructure base station antennas

WiMAX antenna networks

Mobile infrastructure microstrip antenna applications

8.Quality Assurance

Type of artwork supplied: Ge**er RS-274-X

Accepted standard: IPC-Class-3

Availability: Worldwide

9. Rogers RO4533 Antenna Grade Laminate – Product Introduction

RO4500 Series High Frequency Laminates are cost/performance materials from Rogers Corporation, specifically engineered and manufactured to meet the specific demands of the antenna markets. RO4533 laminates extend the capabilities of the successful RO4000 product series into antenna applications. This ceramic-filled, glass-reinforced hydrocarbon based material set provides the controlled dielectric constant, low loss performance and excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.

As with all RO4000 high frequency laminates, RO4500 laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing. These laminates do not require special treatment needed on traditional PTFE-based laminates for plated through-hole preparation. This product series is an affordable alternative to more conventional PTFE antenna technologies, thus allowing designers to optimize the price and performance of their antennas. Moreover, RO4533 laminates are available halogen-free to meet the most stringent "green" standards.

The resin systems of RO4500 dielectric materials are designed to provide the necessary properties for ideal antenna performance. The coefficients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper. The good CTE match reduces stresses in the printed circuit board antenna. The typical glass transition temperature of RO4500 materials exceeds 280°C (536°F), leading to a low z-axis CTE and excellent plated through-hole reliability. These properties, in combination with a dimensional stability value of less than 0.05%, make RO4500 laminates an excellent candidate for printed circuit antenna applications. RO4500 materials also provide increased thermal conductivity over equivalent PTFE/woven glass materials, allowing for design of antennas with increased power handling capability.

In addition to these excellent thermo-mechanical properties, RO4500 laminates embody electrical characteristics that antenna designers need. The laminates have a dielectric constant (Dk) ranging from 3.3 to 3.5 (±0.08) and a loss tangent (Df) of 0.0020 to 0.0037 measured at 2.5 GHz. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Materials are available with demonstrated low PIM performance, with values better than -155 dBc using two 43 dBm swept tones at 1900 MHz.

CCL 76 RO4533

10. Features and Benefits Summary

Feature Benefit
Dk of 3.3 at 10 GHz (±0.08) Controlled dielectric constant for consistent antenna performance
Df of 0.0020 at 2.5 GHz, 0.0025 at 10 GHz Low loss for high gain and minimal signal loss
Low PIM (< -157 dBc typical) Excellent PIM response for base station antennas
CTE similar to copper (X:13, Y:11 ppm/°C) Reduced stresses in PCB antenna
Tg > 280°C, low Z-axis CTE (37 ppm/°C) Excellent plated through-hole reliability
Thermal conductivity of 0.6 W/(m·K) Improved power handling capability
Moisture absorption of 0.02% Stable performance in humid environments
Halogen-free available Meets stringent "green" standards
FR-4 compatible processing Lower manufacturing cost, no special via preparation
Dimensional stability 500 Z V/mil 0.51 mm IPC-TM-650 2.5.6.2
Dimensional Stability 280 - °C TMA A IPC-TM-650 2.4.24.3
Density 1.8 - g/cm³ - ASTM D792
Copper Peel Strength 6.9 (1.2) - lbs/in (N/mm) 1 oz EDC, post solder float IPC-TM-650 2.4.8
Flammability NON FR - - - UL 94
Lead-Free Process Compatible Yes - - - -
12. Some Typical Applications

Cellular infrastructure base station antennas

WiMAX antenna networks

Mobile infrastructure microstrip antenna applications

13. Standard Thicknesses, Panel Sizes & Claddings

Standard Thicknesses (RO4533)

Thickness Tolerance
0.020" (0.508 mm) +/- 0.0015"
0.030" (0.762 mm) +/- 0.0015"
0.060" (1.524 mm) +/- 0.0040"

Standard Panel Sizes

24" x 18" (610 x 457 mm)

24" x 21" (610 x 533 mm)

24" x 36" (610 x 915 mm)

48" x 36" (1219 x 915 mm)

Note: Additional panel sizes available.

Standard Claddings

Electrodeposited Copper Foil: ½ oz (18 μm), 1 oz (35 μm)

16/05/2026

🥳 Wangling F4BME217 2-Layer 1.3mm Bare Copper PCB – Microwave & RF Applications

https://www.highfrequencypcb.com/NEWLY%20SHIPPED%20PCB/Wangling-F4BME217-2-Layer-1.3mm-Bare-Copper-PCB%E2%80%93Microwave-RF-Applications26-4(3).html

1. Introduction to Wangling F4BME217 PCB

Wangling's F4BME217 is a high-performance PTFE composite laminate engineered for demanding RF and microwave applications. Precision-formulated from woven fiberglass cloth, PTFE resin, and film, it delivers superior, consistent electrical properties.

This next-generation material significantly outperforms its predecessor, F4B220, offering lower dielectric loss, higher insulation resistance, and enhanced stability. It serves as a reliable, high-performance domestic substitute for comparable imported laminates.

F4BME217 is clad with Reverse-Treated Foil (RTF) copper. This configuration provides superior low-PIM performance, enables more precise etching for fine-line circuits, and reduces conductor loss, making it ideal for high-precision designs.

This 2-layer rigid PCB is constructed entirely with Wangling F4BME217 as the core material, making it ideal for demanding microwave, RF, radar, and satellite communication applications.

F4BME217 PCB 1mm thick 2L bare copper

2. Key Features of Wangling F4BME217 PCB

Dielectric constant of 2.17 at 10 GHz (Dk range 2.17 to 3.0 available, customizable)

Low dissipation factor of 0.001 at 10 GHz and 0.0014 at 20 GHz

Low PIM value of ≤ -159 dBc (F4BME with RTF copper)

High electrical strength of >23 KV/mm (Z direction)

Low moisture absorption of ≤0.08%

Flammability rating: UL 94 V-0

Anti-radiation and low outgassing properties

Wide operating temperature range: -55°C to +260°C

3. Benefits of Wangling F4BME217 PCB

Low dielectric loss for high-frequency performance

High insulation resistance and enhanced stability

Superior low-PIM performance with RTF copper

More precise etching for fine-line circuits

Reduced conductor loss

Excellent dimensional stability

Low thermal expansion coefficient and reduced temperature drift

Cost-effective domestic substitute for imported laminates

4.Wangling F4BME217 PCB Construction Details

Item Specification
Base material Wangling F4BME217 (PTFE + woven fiberglass)
Copper foil type Reverse-Treated Foil (RTF)
Layer count Double sided
Board dimensions 102mm x 83mm = 1 PCS, +/- 0.15mm
Minimum Trace/Space 5/6 mils
Minimum Hole Size 0.25mm
Blind vias No
Finished board thickness 1.3mm
Finished Cu weight 1 oz (1.4 mils) outer layers
Via plating thickness 20 μm
Surface finish Bare copper
Top Silkscreen No
Bottom Silkscreen No
Top Solder Mask No
Bottom Solder Mask No
100% Electrical test Used prior to shipment

5. PCB Stackup (2-Layer Rigid Structure)

Copper_layer_1 - 35 μm (1 oz)

F4BME217 Core - 1.0 mm (39.37 mil)

Copper_layer_2 - 35 μm (1 oz)

6. PCB Statistics

Components: 15

Total Pads: 42

Thru Hole Pads: 17

Top SMT Pads: 25

Bottom SMT Pads: 0

Vias: 28

Nets: 7

7. Primary Application Areas

Microwave, RF, and radar

Phase shifters and passive components

Power dividers, couplers, and combiners

Feed networks and phased array antennas

Satellite communication and base station antennas

8.Quality Assurance

Type of artwork supplied: Ge**er RS-274-X

Accepted standard: IPC-Class-3

Availability: Worldwide

9. Wangling F4BME217 Low-Loss PTFE Composite – Product Introduction

F4BME217 is a high-performance PTFE composite laminate engineered for demanding RF and microwave applications. Precision-formulated from woven fiberglass cloth, PTFE resin, and film, it delivers superior, consistent electrical properties. This next-generation material significantly outperforms its predecessor, F4B220, offering lower dielectric loss, higher insulation resistance, and enhanced stability. It serves as a reliable, high-performance domestic substitute for comparable imported laminates.

The electrical and mechanical properties of F4BME217 are precisely tuned by adjusting the ratio of PTFE to fiberglass cloth within the composite. This allows for controlled dielectric constants while maintaining low loss characteristics and enhanced dimensional stability. A higher dielectric constant is achieved by increasing the fiberglass content, which improves dimensional stability, lowers the thermal expansion coefficient, and reduces temperature drift. This adjustment involves a balanced trade-off, as a higher fiberglass ratio may result in a marginal increase in dielectric loss.

F4BME217 is clad with Reverse-Treated Foil (RTF) copper. This configuration provides superior low-PIM performance, enables more precise etching for fine-line circuits, and reduces conductor loss, making it ideal for high-precision designs.

CCL (3) F4BME217

10. Features and Benefits Summary

Feature Benefit
Dk 2.17 at 10 GHz (range 2.17-3.0, customizable) Flexible design options for various RF applications
Low dissipation factor (0.001 at 10 GHz, 0.0014 at 20 GHz) Low dielectric loss for high-frequency performance
RTF copper foil (F4BME) Superior low-PIM performance (≤ -159 dBc)
RTF copper foil (F4BME) More precise etching for fine-line circuits
RTF copper foil (F4BME) Reduced conductor loss
High fiberglass content option Improved dimensional stability
High fiberglass content option Lower CTE and reduced temperature drift
Anti-radiation and low outgassing Suitable for aerospace and satellite applications
UL 94 V-0 flammability rating Safe for commercial applications
Cost-effective domestic substitute Reliable alternative to imported laminates

11. Wangling F4BME217 Data Sheet

Property Test Condition Unit F4BME217 Typical Value
Dielectric Constant (typical) 10 GHz - 2.17
Dielectric Constant Tolerance - - ±0.04
Dissipation Factor (typical) 10 GHz - 0.001
Dissipation Factor (typical) 20 GHz - 0.0014
Temperature Coefficient of Dk -55°C to 150°C ppm/°C -150
Peel Strength (1 oz F4BME) - N/mm >1.6
Volume Resistivity Normal state MΩ·cm ≥6 × 10⁶
Surface Resistivity Normal state MΩ ≥1 × 10⁶
Electrical Strength (Z direction) 5KV, 500V/s KV/mm >23
Breakdown Voltage (XY direction) 5KV, 500V/s KV >30
CTE (XY direction) -55°C to 288°C ppm/°C 25-34
CTE (Z direction) -55°C to 288°C ppm/°C 240
Thermal Stress 260°C, 10s, 3 cycles - No delamination
Moisture Absorption 20±2°C, 24 hours % ≤0.08
Density Room temperature g/cm³ 2.17
Operating Temperature Range - °C -55 to +260
Thermal Conductivity (Z direction) - W/(m·K) 0.24
PIM Value (F4BME only) - dBc ≤ -159
Flammability - UL-94 V-0
Material Composition - - PTFE + woven fiberglass
Copper Foil (F4BME) - - Reverse-Treated Foil (RTF)

12. Some Typical Applications

Microwave, RF, and radar

Phase shifters and passive components

Power dividers, couplers, and combiners

Feed networks and phased array antennas

Satellite communication and base station antennas

13. Standard Thicknesses, Panel Sizes & Claddings

Standard Thicknesses (Dielectric thickness or total thickness with copper, customer must specify)

Thickness (mm) Tolerance (mm) Thickness (mm) Tolerance (mm)
0.1 (dielectric) ±0.01 0.8 ±0.05
0.127 (dielectric) ±0.01 1.0 ±0.05
0.2 ±0.02 1.5 ±0.06
0.25 ±0.02 1.524 ±0.06
0.5 ±0.04 1.575 ±0.06
0.508 ±0.04 2.0 ±0.08
0.762 ±0.05 2.5 ±0.08
3.0 ±0.09 6.0 ±0.12
4.0 ±0.10 8.0 ±0.15
5.0 ±0.10 10.0 ±0.18
- - 12.0 ±0.20

Available Copper Foils

F4BME (RTF copper): 0.5 oz (0.018 mm), 1 oz (0.035 mm)

Standard Panel Sizes

460 x 610 mm

500 x 600 mm

850 x 1200 mm

914 x 1220 mm

1000 x 1200 mm

Custom Panel Sizes (contact factory)

300 x 250 mm, 350 x 380 mm, 500 x 500 mm, 840 x 840 mm, 1000 x 1500 mm

Note: For thickness ≥4.0mm or ≤0.2mm, panel size cannot exceed 500 x 610mm.

Metal-Backed Options (Aluminum or Copper Base)

Models: F4BME217-AL (aluminum base), F4BME217-CU (copper base)

12/05/2026

💥AGC RF-10 2-Layer 0.5mm ENEPIG PCB – Microstrip Patch & GPS Antenna--

https://www.highfrequencypcb.com/NEWLY%20SHIPPED%20PCB/AGC-RF-10-2-Layer-0.5mm-ENEPIG-PCB%E2%80%93Microstrip-Patch-GPS-Antenna26-4(1).html

1. Introduction to AGC RF-10 PCB

AGC RF-10 copper clad laminates are composites of ceramic-filled PTFE and woven fiberglass, engineered for high-power RF applications. RF-10 offers the advantage of a high dielectric constant (Dk) and low dissipation factor, enabling significant size reduction in RF circuits. The thin woven fiberglass reinforcement provides both low dielectric loss and improved rigidity, facilitating ease of handling and enhanced dimensional stability for multilayer circuits.

AGC RF-10 laminates are designed to provide a cost-effective substrate with industry-acceptable delivery times. They bond well to smooth, low-profile copper, and the combination of low dissipation factor and very smooth copper results in optimal insertion losses at higher frequencies where skin effect losses are substantial.

This 2-layer rigid PCB is constructed entirely with AGC RF-10 as the core material, making it ideal for demanding RF antenna and passive component applications.

2L RF-10 PCB 10mil ENEPIG

2. Key Features of AGC RF-10 PCB

High dielectric constant (Dk = 10.2 ± 0.3 at 10 GHz)

Low dissipation factor (Df = 0.0025 at 10 GHz)

High thermal conductivity (0.85 W/m·K, unclad)

Low moisture absorption (0.08%)

X-axis CTE: 16 ppm/°C, Y-axis CTE: 20 ppm/°C, Z-axis CTE: 25 ppm/°C

Flammability rating: UL 94 V-0

3. Benefits of AGC RF-10 PCB

High Dk enables RF circuit size reduction

Excellent dimensional stability

Tight Dk tolerance (±0.3)

High thermal conductivity for enhanced thermal management

Excellent adhesion to smooth copper foils

Low X, Y, Z expansion for plated through-hole reliability

Excellent price/performance ratio

4.AGC RF-10 PCB Construction Details

Item Specification
Base material AGC RF-10
Layer count Double sided
Board dimensions 143.6mm x 109.8mm = 2 Types = 2 PCS, ±0.15mm
Minimum Trace / Space 5 / 7 mils
Minimum Hole Size 0.4mm
Blind vias No
Finished board thickness 0.5mm
Finished Cu weight 1 oz (1.4 mils) outer layers
Via plating thickness 20 μm
Surface finish ENEPIG
Top Silkscreen No
Bottom Silkscreen No
Top Solder Mask No
Bottom Solder Mask No
100% Electrical test Used prior to shipment

5. PCB Stackup (2-Layer Rigid Structure)

Copper_layer_1 - 35μm (1oz)

RF-10 Core - 10mil (0.254mm)

Copper_layer_2 - 35μm (1oz)

6. PCB Statistics

Components: 24

Total Pads: 51

Thru Hole Pads: 34

Top SMT Pads: 17

Bottom SMT Pads: 0

Vias: 29

Nets: 2

7. Primary Application Areas

Microstrip patch antennas

GPS antennas

Passive components (filters, couplers, power dividers)

Aircraft collision avoidance systems

Satellite components

8.Quality Assurance

Type of artwork supplied: Ge**er RS-274-X (typical)
Accepted standard: IPC-Class-3
Availability: Worldwide

9. AGC RF-10 Low-Loss Ceramic-Filled PTFE – Product Introduction

AGC RF-10 laminates are ceramic-filled PTFE composites reinforced with woven fiberglass. They are optimized for high-frequency, high-power RF applications requiring high dielectric constant and low signal loss. The thin woven glass reinforcement ensures mechanical rigidity and dimensional stability, while the ceramic filler provides a stable Dk and low dissipation factor.

AGC RF-10 can be sheared, drilled, milled, and plated using standard PTFE circuit board processing techniques. Its low Z-axis expansion enhances plated through-hole reliability and reduces scaling factors for artwork compensation.

CCL 133 RF-10

10.Features and Benefits Summary

Key Features Benefits
Dk = 10.2 ± 0.3 @ 10 GHz RF circuit size reduction
Df = 0.0025 @ 10 GHz Low insertion loss at high frequencies
Thermal conductivity = 0.85 W/m·K Enhanced thermal management
CTE: X=16, Y=20, Z=25 ppm/°C Excellent dimensional & PTH reliability
Moisture absorption = 0.08% Stable performance in humid environments
UL 94 V-0 Flame retardant

11.AGC RF-10 Data Sheet

Property Test Method Unit AGC RF-10 Typical Value
Dielectric Constant (10 GHz) IPC-650 2.5.5.5.1 Mod. – 10.2 ± 0.3
Dissipation Factor (10 GHz) IPC-650 2.5.5.5.1 Mod. – 0.0025
Surface Resistivity IPC-650 2.5.17.1 Mohms 1.0 × 10⁸
Volume Resistivity IPC-650 2.5.17.1 Mohms·cm 6.0 × 10⁷
Thermal Conductivity (Unclad) IPC-650 2.4.50 W/m·K 0.85
CTE (X, RT–150°C) IPC-650 2.4.41 ppm/°C 16
CTE (Y, RT–150°C) IPC-650 2.4.41 ppm/°C 20
CTE (Z, RT–150°C) IPC-650 2.4.41 ppm/°C 25
TcK (–55 to 150°C) IPC-650 2.5.5.6 ppm/°C –370
Flexural Strength (MD) IPC-650 2.4.4 N/mm² (psi) 96.53 (14,000)
Flexural Strength (CD) IPC-650 2.4.4 N/mm² (psi) 68.95 (10,000)
Tensile Strength (MD) IPC-650 2.4.19 N/mm² (psi) 62.57 (8,900)
Tensile Strength (CD) IPC-650 2.4.19 N/mm² (psi) 37.26 (5,300)
Moisture Absorption IPC-650 2.6.2.1 % 0.08
Peel Strength (1 oz Cu) IPC-650 2.4.8 N/mm 1.7
Density IPC-650 2.3.5 g/cm³ 2.77
Specific Heat IPC-650 2.4.50 J/g·°C 0.90
Flammability Rating Internal / UL 94 Class V-0

12.Some Typical Applications

Microstrip patch antennas
GPS antennas
Passive components (filters, couplers, power dividers)
Aircraft collision avoidance systems
Satellite components

13. Standard Thicknesses, Panel Sizes & Claddings

Standard Thicknesses (Available)

Inches mm
0.010 0.25
0.020 0.51
0.025 0.64
0.060 1.52
0.100 2.54
0.125 3.18

Available Sheet Sizes

Inches mm
12 x 18 305 x 457
16 x 18 406 x 457
18 x 24 457 x 610
36 x 48 914 x 1,220

29/04/2026

👍Double Sided RF PCB built on 3.0mm F4BM233

www.highfrequencypcb.com

Welcome to Episode 17 of our PCB series! Today, we’re diving into the world of high-performance RF PCBs with the F4BM233 RF PCB, a 2-layer board with a 3.0mm thickness and an ENIG (Electroless Nickel Immersion Gold) finish.

This is a cutting-edge solution designed for precision, durability, and exceptional performance in microwave, radar, and satellite communication systems. Stick with me as we explore its construction, specifications, and real-world applications!

拿起PCB讲：
This is a 2-layer rigid PCB measuring 70mm x 70mm with a tolerance of ±0.15mm, featuring a finished thickness of 3.1mm supported by a robust 3.0mm F4BM233 core.

Shot 2: SPCS
The board utilizes 1oz (1.4 mils) copper weight on both outer layers for excellent conductivity, with a minimum hole size of 1.0mm and a via plating thickness of 20μm for enhanced durability.

It is finished with ENIG surface treatment for improved corrosion resistance and solderability, and comes without solder mask or silkscreen for a clean, optimized design suited for specialized applications.

Each unit undergoes 100% electrical testing to ensure full reliability.

Shot 3: STACKUP
The F4BM233 RF PCB adopts a simple yet robust 2-layer design, structured as follows:

Copper Layer 1: 35μm thick, enabling efficient signal transmission.

Core Layer: 3.0mm F4BM233 material, composed of fiberglass cloth, PTFE resin, and PTFE film.

Copper Layer 2: Also 35μm thick, providing excellent thermal stability, minimal signal loss, and superior dimensional accuracy.

Shot 4:
So, where does the F4BM233 RF PCB shine?
Its advanced features and materials make it perfect for applications like: Microwave and RF systems, Phase-sensitive antennas, Power dividers, couplers, and combiners, Satellite communications and base station antennas.

With a dielectric constant of 2.33 and a dissipation factor of just 0.0011, the F4BM233 delivers exceptional signal integrity and low loss, even in high-power RF environments.

That’s it for Episode 17, where we introduced the F4BM233 RF PCB. Stay tuned for our next episode, where we’ll explore a 2-layer PCB with DiClad 527 material and an immersion gold finish.

Thanks for watching, and don’t forget to like, subscribe, and leave your questions in the comments below. See you next time!

27/04/2026

Resin Price Hikes Begin, Upstream Materials for PCB Continue to Inflate

https://www.highfrequencypcb.com/NEWS/Resin-Price-Hikes-Begin-Upstream-Materials-for-PCB-Continue-to-Inflate26-4(1).html

On April 3, 2026, Kingboard issued a letter announcing a 10% price increase on laminates and prepregs (PP), effective immediately, citing a sharp rise in chemical prices and tight supply. The primary driver is the Middle East conflict, which has caused prices of epoxy resin, natural gas, and TBBA to surge. As of April 3, liquid E-51 epoxy resin (East China benchmark) rose to RMB 18,300–19,500/ton, up ~40% since the conflict escalated.

FR-4 CCL now has further room for price increases. High industry concentration gives CCL manufacturers strong pricing power. Tight supply expectations for copper foil, resin, and electronic fabric continue to intensify. Copper prices may remain high due to a tight supply-demand balance. AI-grade glass fabric is crowding out capacity for standard fabric, sustaining upward price pressure on ordinary fabric. Electronic fabric has seen concentrated price hikes in early January, early February, early March, and late March.
PPO resin price hikes are driven by both cost push and supply-demand gaps. Total PPO supply in 2026 is around 6,000 tons before year end, but demand from M8–M9 grade CCL could reach 7,000–8,000 tons, widening the gap. On the cost side, phenol (a key PPO raw material) rose 34.55% month-on-month in March, giving PPO suppliers strong incentive to raise prices.
Resin is becoming a key differentiator for CCL. While copper foil and electronic fabric approach their performance limits, resin offers room for formulation optimization. CCL's core know-how lies in resin system formulation (resin, silica powder, additives). Upgrading to M9–M10 requires CCL makers to guide upstream resin formulation. Looking ahead, resin will play a definitive role in M10 upgrades.
Domestic chip sales (e.g., Loongson 950) may exceed expectations, accelerating earnings for the domestic PCB, CCL, and upstream materials chain in 2H26. Shengyi and other local CCL makers are not only breaking into the NVIDIA supply chain but also benefiting from domestic AI chip demand. Shengguan Group, a key resin supplier, stands to gain significantly, with earnings potentially accelerating from 2H26.
Key takeaway: This round of price hikes reflects cost pass-through from upstream raw materials. Supply constraints, not just demand, are the core driver. Upstream electronic-grade material suppliers (resin, additives) now enjoy stronger bargaining power due to high technical barriers and long certification cycles. Kingboard's price hike confirms cost pressure and sets a benchmark for the entire CCL industry.

24/04/2026

😄Rogers RT/duroid 5870 2-Layer 0.3mm ENIG PCB – Microstrip & Radar Applications--

https://www.highfrequencypcb.com/NEWLY%20SHIPPED%20PCB/Rogers-RT-duroid-5870-2-Layer-0.3mm-ENIG-PCB%20%E2%80%93%20Microstrip-Radar-Applications26-3(8).html

1. Introduction to RT/duroid 5870 PCB

Rogers RT/duroid 5870 high frequency laminates are PTFE composites reinforced with glass microfibers, designed for exacting stripline and microstrip circuit applications. The randomly oriented microfibers result in exceptional dielectric constant uniformity.

The dielectric constant of RT/duroid 5870 laminates is uniform from panel to panel and is constant over a wide frequency range. Its low dissipation factor extends the usefulness of RT/duroid 5870 laminates to Ku-band and above.

RT/duroid 5870 laminates are easily cut, sheared and machined to shape. They are resistant to all solvents and reagents, hot or cold, normally used in etching printed circuits or in plating edges and holes.

This 2-layer rigid PCB is constructed entirely with RT/duroid 5870 as the core material, providing exceptional signal integrity, dielectric constant uniformity, and low-loss performance for demanding RF, microwave, and millimeter wave applications.

2. Key Features of RT/duroid 5870

Dielectric constant of 2.33 with tight tolerance ±0.02 at 10 GHz

Dissipation factor of 0.0012 at 10GHz

Temperature coefficient of dielectric constant (TCDk) of -115 ppm/°C

Low Moisture Absorption of 0.02%

CTE in X-axis of 22 ppm/°C, Y-axis of 28 ppm/°C and Z-axis of 173 ppm/°C

Isotropic

3.Benefits of RT/duroid 5870 PCB

Uniform electrical properties over wide frequency range

Easily cut, sheared and machined to shape

Resistant to solvents and reagents used in etching or plating edges and holes

Ideal for high moisture environments

Well-established material

Lowest electrical loss for reinforced PTFE material

4.RT/duroid 5870 PCB Construction Details

Item Specification
Base material RT/duroid 5870
Layer count 2 layers
Board dimensions 85mm x 36mm = 1PCS, +/- 0.15mm
Minimum Trace/Space 5/6 mils
Minimum Hole Size 0.4mm
Blind vias No
Finished board thickness 0.3mm
Finished Cu weight 1 oz (1.4 mils) outer layers
Via plating thickness 20 μm
Surface finish Electroless Nickel Immersion Gold (ENIG)
Top Silkscreen No
Bottom Silkscreen No
Top Solder Mask No
Bottom Solder Mask No
100% Electrical test Used prior to shipment

RT duroid 5870 PCB 10mil Thick

5.PCB Stackup (2-Layer Rigid Structure)

Copper_layer_1 – 35 μm
RT/duroid 5870 – 0.254 mm (10 mil)
Copper_layer_2 – 35 μm

6.PCB Statistics

Components: 36
Total Pads: 56
Thru Hole Pads: 32
Top SMT Pads: 24
Bottom SMT Pads: 0
Vias: 28
Nets: 2

7.Primary Application Areas

Commercial Airline Broadband Antennas

Microstrip and Stripline Circuits

Millimeter Wave Applications

Radar Systems

Guidance Systems

Point to Point Digital Radio Antennas

8.Quality Assurance

Artwork supplied: Ge**er RS-274-X
Accepted standard: IPC-Class-2
Availability: Worldwide

CCL (15) RTduroid 5870

9.RT/duroid 5870 High Frequency Laminates – Product Introduction

RT/duroid® 5870 glass microfiber reinforced PTFE composites are designed for exacting stripline and microstrip circuit applications.

The randomly oriented microfibers result in exceptional dielectric constant uniformity.

The dielectric constant of RT/duroid 5870 laminates is uniform from panel to panel and is constant over a wide frequency range.

Its low dissipation factor extends the usefulness of RT/duroid 5870 laminates to Ku-band and above.

RT/duroid 5870 laminates are easily cut, sheared and machined to shape. They are resistant to all solvents and reagents, hot or cold, normally used in etching printed circuits or in plating edges and holes.

Normally supplied as a laminate with electrodeposited copper of ½ to 2 ounces/ft² (8 to 70μm) or reverse treated EDC on both sides, RT/duroid 5870 composites can also be clad with rolled copper foil for more critical electrical applications. Cladding with aluminum, copper or brass plate may also be specified.

When ordering RT/duroid 5870 laminates, it is important to specify dielectric thickness, tolerance, rolled, electrodeposited or reverse treated copper foil, and weight of copper foil required.

10.Features and Benefits

Key Features

Dielectric constant of 2.33 with tight tolerance ±0.02 at 10 GHz

Dissipation factor of 0.0012 at 10GHz

Temperature coefficient of dielectric constant (TCDk) of -115 ppm/°C

Low Moisture Absorption of 0.02%

CTE in X-axis of 22 ppm/°C, Y-axis of 28 ppm/°C and Z-axis of 173 ppm/°C

Isotropic

Td of 500°C TGA

Thermal Conductivity of 0.22 W/m/K

UL 94 V-0 flammability rating

Lead-free process compatible

Benefits

Uniform electrical properties over wide frequency range

Easily cut, sheared and machined to shape

Resistant to solvents and reagents used in etching or plating edges and holes

Ideal for high moisture environments

Well-established material

Lowest electrical loss for reinforced PTFE material

11.RT/duroid 5870 Data Sheet

Property Typical Value Direction Units Conditions Test Method
Dielectric Constant, εr (Process) 2.33 ± 0.02 Z – 10 GHz / 23°C IPC-TM-650 2.5.5.5
Dielectric Constant, εr (Design) 2.33 Z – 8 GHz – 40 GHz Differential Phase Length Method
Dissipation Factor, tan δ 0.0012 Z – 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of εr -115 Z ppm/°C -50 to 150°C IPC-TM-650 2.5.5.5
Volume Resistivity 2 × 10⁷ Z Mohm·cm C96/35/90 ASTM D257
Surface Resistivity 2 × 10⁷ Z Mohm C96/35/90 ASTM D257
Specific Heat 0.96 (0.23) – J/g/K (cal/g/°C) – Calculated
Moisture Absorption 0.02 – % 0.062" (1.6mm), D48/50 ASTM D570
Thermal Conductivity 0.22 Z W/m/K 80°C ASTM C518
Coefficient of Thermal Expansion (0-100°C) 22 X ppm/°C – IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion (0-100°C) 28 Y ppm/°C – IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion (0-100°C) 173 Z ppm/°C – IPC-TM-650, 2.4.41
Td 500 – °C TGA – ASTM D3850
Density 2.2 – g/cm³ – ASTM D792
Copper Peel Strength 27.2 (4.8) – pli (N/mm) 1 oz (35μm) EDC foil after solder float IPC-TM-650 2.4.8
Flammability V-0 – Class – UL94
Lead-Free Process Compatible Yes – – – –

12.Some Typical Applications

Commercial Airline Broadband Antennas

Microstrip and Stripline Circuits

Millimeter Wave Applications

Radar Systems

Guidance Systems

Point to Point Digital Radio Antennas

13.Standard Thicknesses, Panel Sizes & Claddings

Standard Thicknesses

Thickness (inch) Thickness (mm) Tolerance
0.005" 0.127 mm ±0.0005"
0.010" 0.252 mm ±0.0007"
0.020" 0.508 mm ±0.0015"
0.031" 0.787 mm ±0.0020"
0.062" 1.575 mm ±0.0030"

Standard Panel Sizes

18" × 12" (457 mm × 305 mm)

18" × 24" (457 mm × 610 mm)

Additional panel sizes available

Standard Claddings (Electrodeposited Copper Foil)

Electrodeposited Copper Foil:

½ oz. (18 µm) HH/HH

1 oz. (35 µm) H1/H1

Rolled Copper Foil:

½ oz. (18 µm) 5R/5R

1 oz. (35 µm) 1R/1R

Additional claddings such as heavy metal, resistive foil and unclad are available

Shenzhen Bicheng Electronics Technology Co., Ltd

20/05/2026

16/05/2026

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29/04/2026

27/04/2026

24/04/2026

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