05/06/2026
Package Production
💪 According to packaging technology and shape classification, it can be divided into BGA - Ball Grid Array, CSP - Chip Scale Package and SiP - System in Package.
💪 According to the stacking method classification, it can be divided into 2D Planar and 3D Stacking. From wire bonding to TSV, the density is enhanced by taking up additional space upwards.