31/05/2026
Hybrid Nanoscale Transistor Revolution
In a groundbreaking study published in Science Advances, researchers at Peking University have unveiled a hybrid 1-nanometer transistor that represents far more than a simple record-breaking achievement.
Developed at a time when conventional silicon technology is approaching its physical limits-where quantum phenomena such as electron tunneling cause unacceptable energy leakage-the new device marks a significant leap forward.
The team replaced silicon with advanced nanomaterials, employing a single-atom-thick layer of molybdenum disulfide (MoS₂) as the active channel for superior electrostatic control.
They further integrated single-walled carbon nanotubes (SWCNTs) as surrounding gate electrodes, successfully shrinking the gate length to just 1 nanometer-smaller than the width of a DNA molecule-while reducing the operating voltage to a remarkably low 0.6 volts.
What makes this innovation truly profound is not merely its size, but its functionality.
By incorporating ferroelectric materials, the transistor can simultaneously serve as both a logic gate and a memory unit.
This architecture mimics biological synapses by merging computation and memory in the same location, enabling true in-memory computing.
As a result, it effectively overcomes the longstanding “von Neumann bottleneck,” which wastes enormous amounts of energy moving data between the processor and memory in traditional systems.
Although the device’s response time of 1.6 nanoseconds may not surpass the raw speed of cutting-edge silicon chips, its exceptional energy efficiency makes it highly promising for large-scale artificial intelligence applications and data centers.
This breakthrough also carries clear strategic significance. Facing Western technological restrictions, China is shifting the competition by moving away from the costly race to produce advanced silicon chips.
Instead, Beijing is betting on two-dimensional materials and novel architectures to lead the next generation of energy-efficient AI processors-bypassing many limitations of extreme ultraviolet lithography.
Nevertheless, substantial challenges remain before this technology can move from laboratory to mass production, particularly in achieving uniform nanotube properties and ensuring long-term thermal and electrical stability.
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