08/06/2026
Most PCB defects don’t happen at reflow.
They’re already built in — during solder paste printing.
Miss this step, and everything downstream is compromised:
• Inconsistent paste volume
• Misalignment issues
• Weak or unreliable solder joints
And the impact is real — up to 60–70% of assembly defects can originate right here.
This isn’t just another step.
It’s the control point for your entire SMT process.
At On-Track Technology, we engineer precision where it matters most — at the very start.
👉 If yield is slipping, the answer is upstream.
They’re already built in during solder paste printing.yEngineering