27/02/2026
Two-Layer SMD Assembly — Engineering a Compact IoT Bio-Tracker.
One of the most critical stages in developing our IoT Bio-Health Tracker at Embedded TechLab was the PCB assembly process. The design utilizes a two-layer board architecture to balance precision sensing and compact integration. On the first layer, we placed the core sensing components, the infrared sensor for BPM measurement, the accelerometer IC, and the gyroscope, alongside other critical SMD parts. These were assembled using a controlled reflow process to ensure proper thermal profiling, alignment accuracy, and reliable solder joints for signal integrity.
The second layer houses the microcontroller, power management circuitry, and supporting telemetry components, carefully hand-soldered to maintain placement control and structural stability. This layered approach allowed us to constrain the overall board size while preserving functionality, enabling a compact form factor suitable for handheld and wearable applications. The final assembly integrates seamlessly into its custom casing, completing a build focused on size efficiency, reliability, and practical usability.
Current efforts are focused on iterative refinement of signal conditioning, noise reduction, motion-artifact compensation, and power optimization. Future development will explore expanded data logging, enhanced validation studies, and broader integration models to strengthen the system’s applicability in continuous physiological monitoring research.
