26/03/2026
đ I Just Wrapped Up My Internship at NXP Semiconductors!
đââď¸ Darrell Chan from the Assembly process innovation team
I recently completed my internship at NXP Semiconductors, and it was an eyeâopening journey into the world of wire bonding and semiconductor packaging!
Most of my time was spent running DOEs to search for the ideal âprocess recipeââadjusting power, force, and ultrasonics to make each bond reliable. Itâs one thing to see a design on paper, but itâs completely different when youâre the one fineâtuning the parameters that keep a highâvolume production line running smoothly.
This hands-on experience gave me a much deeper interest in semiconductor packaging and a clearer picture of what real manufacturing looks like. Iâm walking away inspired, more curious than ever, and ready for the next challenge ahead. âĄď¸
Huge thanks to the NXP team for all the guidance, support, and patience throughout my internship. Couldnât have asked for a better learning environment! đ