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ASMPT SMT Solutions

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ASMPT SMT Solutions

Are smartphones, TVs, computers and the internet part of your daily life? Do you travel by car, train, or airplane? None of them would exist without electronics.

Welcome to the official page of ASMPT SMT Solutions the world’s leading provider of first-class equipment and the technology process partner for the electronics industry. At ASMPT, we make all this progress possible. Based on our vision of “Enabling the Digital World”, we help to make the world safer, more functional and more sustainable with complete, connected and highly integrated hardware and software solutions and as a component partner for building integrated smart factories. Our Open Automation concept forms the basis for modular, flexible, non-proprietary and therefore economically feasible automation in SMT production. At ASMPT, everyone pursues the same goal of improving the workflows of our customers and putting new technologies to use to advance the industry’s process integration and make electronics even better and more efficient.

12/10/2026

How flexible does your SMT line need to be today?

Electronics manufacturing facilities face a range of challenges, from small to large PCBs and components to complex assembly requirements. All lines must maintain top quality, flexibility, and cost-effectiveness as product portfolios grow and production cycles shorten.

Flexibility isn’t an option anymore – it’s a requirement.

The SIPLACE V platform adapts to changing products, formats, and production demands while maintaining consistent performance.

Whether it’s high speed, mixed placement, or special components, the SIPLACE V platform is designed to meet a wide range of production requirements – from ultra-small 016008M components to large odd-shaped components and BGAs. Its flexible machine configuration allows for single or double gantry versions, single or dual conveyor setups, optional 3D Koplan modules, and additional cameras, enabling production to adapt to different board sizes and requirements.

This helps electronics factories stay prepared for changing production demands.

🎥 In this short video, Jetulla Avdili, Senior Product Manager at ASMPT SMT Solutions, explains how the SIPLACE V platform delivers the flexibility needed in modern SMT production.

👉 Learn more about SIPLACE V on our website.

07/10/2026

When does an invention become an innovation?

Not when it works once in the lab. But when it can be turned into a stable production process – and deliver the same quality hundreds of thousands or even millions of times.

That was one of the key points Sven Buchholz, VP Product & Portfolio Management at ASMPT SMT Solutions, made at the FIRST Conference in Berlin in his keynote “From Prototype to Competitive Production.”

His focus: How can we get promising technologies out of the lab and into competitive industrial production faster?

A few thoughts from his presentation:

▪️ Industrialization starts much earlier than many people think. Decisions about machine architecture, interfaces and automation made during development can determine how well a technology can later be scaled.

▪️ Speed and long-term development are not contradictions. Industrial platforms have to perform reliably for many years. At the same time, manufacturers need to respond quickly to new products and applications. The key is to design platforms that can evolve.

▪️ Software needs the same long-term thinking. New requirements have to be implemented quickly without adding uncontrolled complexity. Continuous refactoring helps keep software platforms stable and scalable while making room for new functions.

▪️ And it takes close cooperation. Research, machine builders and manufacturers need to work together early if a promising idea is to become a robust and economically viable production process.

At ASMPT, there are some very tangible examples. The SIPLACE CA2 brings together capabilities from SMT manufacturing and semiconductor backend processes. And the basic architecture of the SIPLACE SX dates back to 2009 – yet today the platform is used to produce highly complex AI-server boards.

Or, as Sven summed it up: “The better we develop for the long term, the faster we can respond to new requirements and bring innovations into industrial production.”

06/10/2026

Process excellence is built into every single placement

With the SIPLACE V platform, each component is controlled individually throughout the entire process, from pickup to placement, in a true closed-loop system.

That’s how consistent quality, maximum accuracy and reliable processes become the standard – today and in the future.

👉 Learn more about the SIPLACE V platform on our website.

05/10/2026

Why dedicate a separate unit just for support pins?

Support pins are essential for stable PCB processing. Traditionally, they are handled by a dedicated pin-picker unit integrated in the placement machine.

With Smart Pin Support on the new SIPLACE V platform, the placement heads handle this task directly. Support pins are picked and placed as part of the normal placement process.

What this changes in the machine:
✔️ No dedicated pin-picker unit required
✔️ Support pins handled directly by the placement heads
✔️ Simplified machine architecture
✔️ Reduced system complexity
✔️ More flexibility for demanding PCB designs

A small change in machine architecture with a noticeable impact on process efficiency.

👉 Learn more about SIPLACE V on our website.

30/09/2026

What does reliable quality assurance look like when server BGAs exceed 50,000 solder balls?

As AI server processors become increasingly complex, BGAs with more than 50,000 solder balls are becoming a standard challenge in SMT production. With very small ball diameters and narrow pitches, reliable inspection of the component geometry and critical features is essential before placement.

SIPLACE high-resolution component cameras provide comprehensive visual inspection directly within the placement process. Six illumination angles combined with feature-based image processing algorithms enable reliable and repeatable detection of critical BGA features.

Key inspection capabilities:
✔ Vision inspection of 50,000+ solder balls
✔ Detection of missing or defective connections
✔ Verification of solder ball position
✔ Inspection of landside capacitors
✔ Barcode and Data Matrix code reading
✔ Verification of orientation marks
✔ Measurement data and camera images available for analysis

For high-density AI server assemblies, reliable vision inspection provides the data you need to verify critical features before the component enters the final placement process and ensures highly accurate placement.

29/09/2026

What will SMT manufacturing look like in the future?

At EFX 2026, we're excited to showcase the new extension of the powerful SIPLACE V platform which marks the beginning of a new era in terms of space efficiency, quality, flexibility, and investment protection.
Together with the DEK TQ L, the new SIPLACE V L demonstrates how cutting-edge printing and placement technologies can create a highly efficient, future-ready SMT production environment.

NEW SIPLACE V L which extends the powerful SIPLACE V platform
✅ Up to 30% more real-performance, combining the highest precision with maximum flexibility
✅ Placement accuracy of 25 µm @ 3σ and intelligent component handling ensure consistently stable quality
✅ Capability to process components up to 55 mm height
✅ 120 feeder slots and full compatibility with existing changeover tables

DEK TQ L
✅ Maximum throughput with core cycle time of just 6.5 seconds
✅ Exceptional precision with high wet-print accuracy of > 2.0 Cpk @ ±17 µm (±6 sigma)
✅ Non-stop carefree production up to 8 hours
✅ NEW automated setup changeover reduces manual operator time during changeover to 30 seconds

WORKS Software Suite integrates seamlessly with the SIPLACE V platform and DEK TQ L. It is the ideal shop floor management system enabling transparency, efficiency, and the path toward the intelligent factory.

Visit us at EFX 2026 and experience our latest innovations firsthand.

📍 EFX Messe Stuttgart | Hall 9 | Booth 9D52 | opposite the EFX Café
📅 6.-8. October 2026

Let´s discuss the technologies and opportunities that will drive the future of electronics manufacturing.

Find the code for your free ticket here 👉 https://lnkd.in/egVjTRj3

28/09/2026

How can you keep AI server production reliable and cost-efficient as board complexity continues to grow?

AI server and HPC boards are pushing SMT production to new limits. Larger and more expensive processor BGAs, highly miniaturized components, and increasingly complex PCB designs leave little room for error. At the same time, you must maintain high quality, throughput, and cost efficiency.

In our Expert Talk, we share practical approaches from real manufacturing environments, covering topics such as reliable placement of large BGAs and miniature components, intelligent component feeding and automated PCB handling, integrated quality control, and scalable production concepts.

The recording is now available on demand. Discover proven strategies for mastering today's AI server manufacturing challenges and unlocking new growth opportunities in this rapidly evolving market.

You will find the link on our website.

23/09/2026

What defines a truly flexible placement head in SMT production?

In intelligent SMT manufacturing, placement heads must handle far more than just high volumes. Increasing component diversity requires systems that can process everything from tiny passives to larger and more complex components.

With the optimized placement head CPP of the new SIPLACE V platform, ASMPT engineered a solution designed for maximum flexibility in SMT placement.

What the placement head CPP delivers:
✔️ Placement speed of up to 28,000 components per hour
✔️ Component spectrum from 01005 to 50 × 40 × 15.5 mm
✔️ Placement accuracy of 25 µm @ 3σ
✔️ Placement force of up to 15 N
✔️ Collect & Place, Pick & Place and Mixed Mode placement operation

The placement head CPP automatically switches between these placement modes via software, enabling flexible processing of different component types within the same placement platform. Making the placement head CPP a true all-rounder for intelligent SMT manufacturing.

👉 Learn more about the new SIPLACE V platform on our website.

22/09/2026

How can you build increasingly complex AI server boards without compromising process reliability or cost efficiency?

AI and High-Performance Computing continue to evolve and you as SMT manufacturers face a new level of complexity. Processor BGAs are becoming larger, heavier, and more expensive. At the same time, component sizes are shrinking to 016008M, while PCB designs grow more sophisticated.
The result? Less room for error and greater pressure to maintain high yields and cost-effective production.

Join our upcoming webinar to learn how manufacturers are successfully tackling these challenges and scaling production with confidence.

📅 Thursday, September 24 | 09:00 CEST | Zoom
🎙️ Speakers: Johannes Lettenbauer and Christoph Öckl

Topics include:
🔹 Key SMT challenges in AI server and HPC manufacturing
🔹 Reliable placement of large BGAs and miniature components
🔹 Intelligent component feeding and automated PCB handling
🔹 Machine-integrated quality control, from spacer inspection to 3D coplanarity measurement
🔹 End-to-end manufacturing concepts for quality, cost-effectiveness, and scalability

Discover practical approaches that are already proving successful in production environments and learn how you can benefit from the opportunities in this dynamically growing market.

Register now via the link on our website.

21/09/2026

A new era of placement technology has arrived in South Asia. We are happy to have officially launched the SIPLACE V in South Asia for the first time at productronica India 2026.

Newly designed from the ground up, the SIPLACE V delivers up to 30% more real performance under real production conditions.

Visit us at Booth H4.E11, Bangalore International Exhibition Centre, from 16-18 September, and see how we can help solve your production challenges:

SIPLACE V: Our new placement platform, setting new benchmarks in speed and space productivity, from high-mix, low-volume to high-speed production.

SIPLACE SX: Built for high-mix electronics production. Add or remove gantries to scale capacity on demand.

DEK TQ: Our next-generation stencil printer, fast, precise and a real space-saver.

WORKS Software Suite: The foundation of the intelligent factory, optimizing workflows to get the most from your production lines.

Come speak with our ASMPT experts onsite about your manufacturing needs and growth plans!

Adresse

Munich

Website

https://smt.asmpt.com/

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