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ASMPT SMT Solutions

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ASMPT SMT Solutions

Are smartphones, TVs, computers and the internet part of your daily life? Do you travel by car, train, or airplane? None of them would exist without electronics.

Welcome to the official page of ASMPT SMT Solutions the world’s leading provider of first-class equipment and the technology process partner for the electronics industry. At ASMPT, we make all this progress possible. Based on our vision of “Enabling the Digital World”, we help to make the world safer, more functional and more sustainable with complete, connected and highly integrated hard

ware and software solutions and as a component partner for building integrated smart factories. Our Open Automation concept forms the basis for modular, flexible, non-proprietary and therefore economically feasible automation in SMT production. At ASMPT, everyone pursues the same goal of improving the workflows of our customers and putting new technologies to use to advance the industry’s process integration and make electronics even better and more efficient.

26/08/2026

Reliable BGA placement starts with verified spacer positioning. Large server BGAs are commonly assembled with non-collapsing spacers positioned underneath the package. During reflow, these spacers maintain a defined stand-off height, preventing warped corners from compressing the solder paste and creating solder bridges or short circuits.

For this reason, the presence and placement accuracy of every spacer must be verified before mounting high-value BGAs.

placement machines perform this verification directly in the placement machine using the integrated PCB camera. Spacer presence and position are inspected immediately after placement, and BGA assembly is only enabled after successful verification. This closed-loop inspection eliminates the need for an additional inspection step while ensuring that the assembly process continues only under verified conditions.

Key capabilities:
✔ In-machine inspection of spacer presence and placement accuracy
✔ Verification immediately after spacer placement and before BGA assembly
✔ Detection of misplaced or missing spacers before processing high-value BGAs
✔ Prevention of solder bridging caused by BGA warpage during reflow
✔ Increased process stability for AI server assemblies

As BGA packages continue to grow in size and value, verifying the correct placement of support components becomes an essential part of a controlled, zero-defect placement process.

25/08/2026

What does it take to achieve tier-one quality standards in high-mix, low-volume electronics manufacturing?

Components for premium car brands, Formula 1 racing cars, MotoGP motorcycles: Since the 1980s, System Electronics, Modena, has been producing cutting-edge technology for the most demanding customers. Making this high-mix, low-volume production economical is a major challenge.

The solution: production equipment from ASMPT. The state-of-the-art factory uses two lines with DEK NeoHorizon solder paste . The results are checked directly with the SPI Process Lens HD system and automatically corrected if necessary. Each line includes three SIPLACE SX machines.

With this highly flexible configuration, System Electronics achieves impressive results:
📌 230,000 SMT components per hour
📌 < 1 percent total defect rate
📌 Component flexibility from 0.4 x 0.2 mm to 200 x 100 mm
📌 PCB processing up to 15 layers

"The SIPLACE SX placement systems perfectly reflect our core competencies of flexibility and quality," says Gozzi, General Manager at System Electronics, confirming this success story.

A success story that shows how process stability, flexibility and quality can go hand in hand, even in the most demanding manufacturing environments.

24/08/2026

What does it take to combine advanced packaging and SMT production?

As advanced packaging becomes the key enabler for high-performance electronics – from smartphone to AI and HPC computing, 5G infrastructure, autonomous driving and IoT platforms – manufacturers need solutions that seamlessly bridge the gap between semiconductor and SMT production.

The solution: The hybrid SIPLACE CA2 placement system from ASMPT, which can process SMDs from tapes and dies directly from the sawn wafer, integrates the demanding die bonding process into the SMT line, making expensive special machines and additional process efforts superfluous. Taking dies directly off the wafer also eliminates the expensive die taping process and significantly cutting material waste.

Your benefits:
✅ Direct die handling off the wafer – no taping required
✅ Up to 800 km less tape waste per year in 24/7 SiP production
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20/08/2026

How can you increase flexibility without sacrificing placement throughput?

AI server boards combine thousands of miniature passive components with larger ICs, connectors, shielding components, and other odd-shaped devices. Efficiently placing this wide component mix requires more than a high-speed placement head, it requires the flexibility to adapt the placement strategy to each component.

The automatically switches between three placement modes: Collect-and-Place, Pick-and-Place, and Mixed Mode, based on the programmed process requirements. This enables high hashtag while covering a broad component spectrum with a single placement head.

Key capabilities:
✔ Automatic switching between Collect-and-Place, Pick-and-Place, and Mixed Mode
✔ Placement of components up to 27 × 27 mm in Collect-and-Place mode
✔ Placement of components up to 40 × 50 mm in Pick-and-Place mode
✔ High-speed processing across a wide component range
✔ Improved line balancing and bottleneck elimination
✔ Greater flexibility for mixed-technology AI server assemblies

As server designs continue to evolve, production lines must handle an increasingly diverse component portfolio without sacrificing throughput. The Placement Head CPP combines high-speed placement with the needed to optimize line balancing and maintain process efficiency across a wide range of component types.

19/08/2026

Thomas Bliem, VP R&D ASMPT SMT Solutions, on the newly developed SIPLACE V platform

In this video Thomas Bliem shares his perspective on the newly developed SIPLACE V platform and how it is designed to redefine performance, flexibility and process excellence in real production environments.

With up to 30% more real performance in key industries, SIPLACE V combines high productivity with a platform concept designed for automation, data-driven manufacturing and long-term scalability.

Developed from the ground up, SIPLACE V marks the beginning of a new era in electronics manufacturing.

👉 Learn more about SIPLACE V on our website.

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17/08/2026

How can you turn the growth of AI infrastructure into a competitive advantage?

The global expansion of AI data centers increases the demand for powerful hashtag servers and hashtag systems. But producing their complex PCBs requires more than high-performance equipment.

📅Thursday, September 24 | 09:00 CEST | Zoom

Join our webinar to learn how integrated hardware, software, and manufacturing processes can help you:
🔹 Place ultra-large BGAs and 016008M components reliably
🔹 Enable intelligent component feeding and automate PCB handling
🔹 Integrate advanced quality control into the placement process
🔹 Improve quality, cost-effectiveness, and scalability

Our hashtag experts Johannes Lettenbauer and Christoph Öckl will share practical insights based on real-world manufacturing examples.

Register now! You will find the link on our website and in the comments.

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13/08/2026

How does precise process control ensure stable placement on warped PCBs?

Large AI server PCBs are more prone to due to their size, thickness, and component density. During placement, even small deviations in board flatness can influence placement accuracy and increase the risk of soldering defects.

SIPLACE placement machines continuously monitor the Z-axis movement during placement to compensate for warpage in real time. Combined with software-controlled placement force, this ensures that every component is placed under controlled conditions, even at high placement speeds.

The process is further supported by automated PCB support and spacer verification, ensuring that large, high-value BGAs are assembled on a stable foundation before placement.

Key capabilities:
✔ Real-time Z-axis monitoring for PCB warpage compensation
✔ Software-controlled placement force for repeatable assembly quality
✔ Stable placement of densely populated AI server boards at high throughput
✔ Automated verification of support conditions before critical placement
✔ High process stability for large-format, high-value assemblies

Learn more about stable placement on warped PCBs and the required precise process control in our upcoming webinar. Visit our website to register.

12/08/2026

How do you combine real performance, quality and flexibility in high-volume consumer electronics manufacturing?

High production volumes, short cycle times and maximum line utilization define electronics manufacturing in the consumer segment. First introduced at productronica 2025, the SIPLACE V platform has received outstanding market feedback and has already proven its capabilities in customer field trials – delivering stable real-world performance where speed and efficiency matter most.

Developed completely from scratch, SIPLACE V sets new benchmarks in real performance, quality and flexibility while remaining fully compatible with ASMPT’s existing hardware and software. It covers the entire component spectrum, reaches deep into the high-speed segment and maintains consistently outstanding process quality.

Thanks to its flexibility and intelligent component handling, SIPLACE V efficiently supports classic high-volume products as well as devices with complex bills of materials. Even high-mix / high-volume production can be realized on a single line – with high overall equipment effectiveness and low total cost of ownership.

Your advantages at a glance:
✔️ Up to 30% higher real performance
✔️ Maximum flexibility even at high speeds
✔️ Component range from 016008M chips to large-format OSCs
✔️ Footprint of only 1.1 × 2.4 meters
✔️ 45 free feeder slots per location, independent of installed options
✔️ Full compatibility with ASMPT hardware and software
✔️ Gigabit Ethernet for seamless M2M communication, efficient big-data management and AI integration
✔️ Performance reserves for further automation steps and future AI integration

👉 Experience the future firsthand and learn more about SIPLACE V

10/08/2026

Why is the SIPLACE SX leading the way in software and integration?

We recognized the value of comprehensive data usage and implemented it consistently – with our intelligent factory concept!

Only with the right tools can you get the maximum yield from your equipment.

With the SIPLACE SX, we are the technology leader, in software optimization and compatibility:
✅ Seamless Integration: SIPLACE software can be seamlessly integrated into any manufacturing environment with third-party solutions.
✅ Flexibility: A flexible software interface guarantees dynamic access to data and functions.
✅ Upgradeable: Upgrades are possible at any time – with minimal costs and production interruptions.
✅ High Integration Capability: Standardized interfaces and an open software architecture make the SIPLACE SX an enrichment to any production environment.

The SIPLACE SX is a leader in flexibility, and so is its software.

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06/08/2026

SIPLACE V: Setting new benchmarks in performance, quality and flexibility

Developed completely from scratch, the platform sets new benchmarks in real performance, quality and flexibility. At the same time it remains fully compatible with ASMPT’s existing hardware and software. SIPLACE V provides maximum freedom across the entire component spectrum, reaching deep into the high-speed segment while maintaining consistently outstanding process quality.

Its forward-looking architecture gives manufacturers the technological capacity they need to increase automation, implement advanced data strategies and prepare their production lines for future AI-driven concepts.

Your advantages at a glance:
✔️ Up to 30 % higher real performance in key industries
✔️ Maximum flexibility even at high speeds
✔️ Component range from 016008M chips to large-format OSCs
✔️ Footprint of only 1.1 × 2.4 meters
✔️ 45 free feeder slots per location, independent of installed options
✔️ Full compatibility with ASMPT’s existing hardware and software
✔️ Gigabit Ethernet for seamless M2M communication and efficient big-data management
✔️ Performance reserves for further automation steps and future AI integration

👉 Experience the future firsthand and learn more about SIPLACE V

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Munich

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https://smt.asmpt.com/

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