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ASMPT SMT Solutions

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ASMPT SMT Solutions

Are smartphones, TVs, computers and the internet part of your daily life? Do you travel by car, train, or airplane? None of them would exist without electronics.

Welcome to the official page of ASMPT SMT Solutions the world’s leading provider of first-class equipment and the technology process partner for the electronics industry. At ASMPT, we make all this progress possible. Based on our vision of “Enabling the Digital World”, we help to make the world safer, more functional and more sustainable with complete, connected and highly integrated hard

ware and software solutions and as a component partner for building integrated smart factories. Our Open Automation concept forms the basis for modular, flexible, non-proprietary and therefore economically feasible automation in SMT production. At ASMPT, everyone pursues the same goal of improving the workflows of our customers and putting new technologies to use to advance the industry’s process integration and make electronics even better and more efficient.

18/06/2026

30% more performance. A completely new platform.

We're excited to introduce the SIPLACE V in Thailand for the very first time at NEPCON Thailand 2026.

Designed from the ground up, SIPLACE V sets new benchmarks for SMT manufacturing:
⚙️ 30% more real performance
⚙️ 100% process excellence
⚙️ Unlimited flexibility
⚙️ Future-ready automation and AI integration

Beyond placement, visitors can also discover our intelligent factory solutions:
WORKS Software Suite for real-time monitoring and process optimization, SMT Analytics for AI-powered production insights, Closed-Loop Nozzle Management, Digital Services and Customer Portal, AI-powered Virtual Assist,
live SIPLACE V demonstrations daily at 12:00 and 15:00.

📍 NEPCON Thailand 2026
June 17–20, 2026
BITEC Bangkok
Booth 0D11, Hall 100

We look forward to meeting customers, partners and industry professionals.

17/06/2026

30% more performance – where it really matters: in production.

The new SIPLACE V placement platform delivers up to 30% higher performance across key industries such as automotive, industrial electronics, consumer electronics, and IT & network infrastructure.

And the best part: these gains are achieved under real production conditions – not just in benchmark tests.

With SIPLACE V, manufacturers benefit from:
✔️ Up to 30% higher throughput
✔️ High flexibility for demanding applications
✔️ Consistently strong process quality
✔️ Stable yields in real-world production environments

Because performance only counts when it delivers results on the factory floor.

👉 Discover more about SIPLACE V on our website.

15/06/2026

How do you achieve up to 30% more real performance in daily production?

Real performance is measured in production, not in benchmarks.
With SIPLACE V, manufacturers can achieve up to 30% higher performance under real production conditions across key industries such as automotive & industrial, consumer electronics, smartphones, and IT & network infrastructure.

What makes this possible?
✔️ A completely newly developed machine base enabling significantly higher accelerations
✔️ Highly efficient linear drives and high-resolution measuring systems for more precise motion control
✔️ Advanced high-resolution camera systems with individual component inspection
✔️ Extensively revised placement heads for greater dynamic stability, faster movements and consistently high placement accuracy

The result: measurable performance gains at line level, where it matters most in everyday electronics manufacturing.

Manufacturers can increase capacity or maintain output with fewer machines, depending on their production strategy.

👉 Learn more about SIPLACE V and its performance advantages in real production.

11/06/2026

Meet us at the launch of EFX – Expo for Electronics Manufacturing in Stuttgart, Germany

From October 6 - 8, 2026, EFX will showcase the entire electronics manufacturing value chain - from components and printed circuit boards to assembly and connection technology, automation, digitalisation and sustainable manufacturing solutions.

We are proud to be part of this new innovative business event combining exhibition, innovation and networking.

📍 Messe Stuttgart, Germany
📅 October 6 - 8, 2026
🏢 Hall 9, Booth 9D52

Connect with us at EFX to discuss your current challenges and explore our innovations for the intelligent factory. Learn how our solutions help maximize yield, productivity, quality and resilience throughout the entire SMT production process.

Let's meet at EFX 2026!

Get the free ticket code on our website.
https://smt.asmpt.com/en/lp/efx-2026/

10/06/2026

Why does the SIPLACE SX achieve the same high level of quality for all components on the market?

Because we emphasized maximum flexibility and accuracy in all areas of the machine.

This also applies to coplanarity measurement, which is crucial for consistent placement quality: all connection pins or balls must be on the same level to ensure reliable contact with the solder paste.

With our new 3D Coplanarity Module, we can measure and process odd-shaped components (OSC) even more precisely, reliably, and quickly – for every existing component on the market.

Key features:
🔹 New stationary camera with even higher resolution
🔹 Measuring accuracy in Z-direction: 15 µm @ 3 Sigma
🔹 Minimum ball diameter: 200 µm
🔹 Minimum ball pitch: 400 µm
🔹 Minimum lead width: 100 µm
🔹 Minimum lead pitch: 300 µm

Ensuring quality, even with very unusual components: The SIPLACE SX sets standards in OSC processing.

📖 Find out more on our website

ASMPT Ltd

08/06/2026

How can you achieve zero DPMO across the complete SMT line?

As an inline expert system, the WORKS Optimization application in our WORKS Software Suite optimizes the processes along the entire SMT line with an ambitious goal: achieve zero DPMO (defects per million opportunities).

Your benefits with WORKS Optimization at a glance:
📌 Automated print optimization
📌 Placement process monitoring and optimization
📌 Fast new product introductions
📌 Optimization prior to the first print
📌 Integration of third-party equipment (SPI and AOI)
📌 Increase of productivity and reduction of manufacturing costs

Watch our expert talk about hashtag and learn how to increase the yield of your SMT lines!

05/06/2026

Electronics on the Road 2026 – wir kommen nach Salzburg!

Starten Sie am 24. Juni mit unserer After-Work-Lounge in den Abend und treffen Sie bereits hier auf Branchenkollegen und Fachexperten in entspannter Atmosphäre. Freuen Sie sich dabei auf unseren beliebten Science Slam!

Am 25. Juni erwartet Sie tiefgreifendes Praxiswissen rund um die Elektronikfertigung. Der persönliche Austausch, fundierte Fachvorträge und konkrete Lösungsansätze stehen klar im Mittelpunkt.

Die Highlights der letzten Stationen:

✅ Praxisnahe Vorträge:
🔹Elektronikfertigung unter Spannung – Zwischen Innovation und Krise mit Dr. Stefan Wolf
🔹Digitaler Zwilling im THT-Lötprozess mit Dr.-Ing. Reinhardt Seidel
🔹Insourcing vs. Outsourcing: Ein Praxisleitfaden für die Elektronikfertigung mit Thomas Skoczowski
🔹KI-gestützte Feinplanung als echten Wettbewerbsvorteil mit Mira Grünhaupt
🔹Smarter Materialfluss zur nachhaltigen Produktivitätssteigerung mit Nikolai Knapp
🔹Wie kann Forschung schneller in the Wirtschaft kommen mit Ulf Oestermann
✅ Fachlicher Austausch auf Augenhöhe: Die Pausen und Diskussionsrunden wurden rege genutzt für fachlichen Austausch, neue Impulse und wertvolle Kontakte.
✅ Klare Perspektiven für die Praxis: Konkrete Beispiele aus der Industrie haben gezeigt, wohin sich Prozesse, Technologien und Anforderungen entwickeln – und wo sich jetzt Handlungsfelder ergeben.

Melden Sie sich jetzt für Salzburg an! https://www.electronicsontheroad.com/details-registrierung/electronics-on-the-road-salzburg/form

Alternativ können Sie sich für unseren letzten Termin in 2026 anmelden 👉 Berlin, 18. & 19. November

Unsere Partner, Table-Top Aussteller und Kollegen freuen sich auf Sie!

03/06/2026

How can you remain technologically and industrially competitive in a rapidly evolving electronics market and enable PCBs for AI and high‑performance computing (HPC)?

At the 7th Technology Forum Electronics Manufacturing on June 17 & 18, 2026 at Ersa in Wertheim, a program highlights will address this question:

In their hands-on session, Christoph Öckl from ASMPT and an expert from Ersa will place XL BGAs with the dimensions of 134 x 134 x 7 mm³ and 500 g on a SIPLACE SX live in their Customer Care Center in Wertheim.

BGAs are a key building block in AI Server Applications, where increasingly complex board designs, high-value components and zero-defect requirements are pushing SMT production to new levels of precision, reliability and process control.

ASMPT addresses these challenges with integrated SMT solutions specifically designed for AI and HPC production. Visit our webpage to learn more about AI Server Applications!

Another highlight of the event:

In his keynote presentation, Josef Ernst CEO of ASMPT SMT Solutions will discuss the strategic importance of innovation and technological leadership in securing Germany's future position within the global electronics industry.

01/06/2026

How do you prepare for the next generation of SMT manufacturing while keeping today’s production stable and efficient?

That was one of the key questions behind the development of the new SIPLACE V placement platform.

In this video, Felix Friedrich, Electrical Engineer at ASMPT SMT Solutions, explains how SIPLACE V combines next generation connectivity with full compatibility to existing ASMPT environments.

Its high-speed Gigabit Ethernet architecture enables real time data availability and creates the basis for advanced analytics, AI supported optimization and future automation concepts on the shop floor.

At the same time, SIPLACE V remains fully compatible with existing ASMPT hardware and software, protecting investments while enabling a confident move into the future.

👉 Learn more about the SIPLACE V on our website.

29/05/2026

Multifunctional SIPLACE CA2 high-speed platform revolutionizes SiP production.

Electronics production is currently experiencing a technological quantum leap: SMD and die processing, two previously strictly separate areas, are merging. This requires a whole new generation of placement machines.

We at ASMPT already have this new generation on the market – for example with the SIPLACE CA2, a multifunctional high-speed placement machine that processes both classic SMDs and dies – the latter even directly from the pre-separated wafer. To prevent the machine from becoming a productivity brake in SiP production, we had to come up with a few ideas.

We have parallelized the die stripping and placement process and thus accelerated it to such an extent that the SIPLACE CA2 can even keep up with modern high-speed SMT production lines. And if you can do both SMT and die processing, you will leave your competitors behind in the rapidly growing advanced packaging market.

SIPLACE CA2 - it works!

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https://smt.asmpt.com/

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Elektronik