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ASMPT SMT Solutions

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ASMPT SMT Solutions

Are smartphones, TVs, computers and the internet part of your daily life? Do you travel by car, train, or airplane? None of them would exist without electronics.

Welcome to the official page of ASMPT SMT Solutions the world’s leading provider of first-class equipment and the technology process partner for the electronics industry. At ASMPT, we make all this progress possible. Based on our vision of “Enabling the Digital World”, we help to make the world safer, more functional and more sustainable with complete, connected and highly integrated hard

ware and software solutions and as a component partner for building integrated smart factories. Our Open Automation concept forms the basis for modular, flexible, non-proprietary and therefore economically feasible automation in SMT production. At ASMPT, everyone pursues the same goal of improving the workflows of our customers and putting new technologies to use to advance the industry’s process integration and make electronics even better and more efficient.

05/06/2026

Electronics on the Road 2026 – wir kommen nach Salzburg!

Starten Sie am 24. Juni mit unserer After-Work-Lounge in den Abend und treffen Sie bereits hier auf Branchenkollegen und Fachexperten in entspannter Atmosphäre. Freuen Sie sich dabei auf unseren beliebten Science Slam!

Am 25. Juni erwartet Sie tiefgreifendes Praxiswissen rund um die Elektronikfertigung. Der persönliche Austausch, fundierte Fachvorträge und konkrete Lösungsansätze stehen klar im Mittelpunkt.

Die Highlights der letzten Stationen:

✅ Praxisnahe Vorträge:
🔹Elektronikfertigung unter Spannung – Zwischen Innovation und Krise mit Dr. Stefan Wolf
🔹Digitaler Zwilling im THT-Lötprozess mit Dr.-Ing. Reinhardt Seidel
🔹Insourcing vs. Outsourcing: Ein Praxisleitfaden für die Elektronikfertigung mit Thomas Skoczowski
🔹KI-gestützte Feinplanung als echten Wettbewerbsvorteil mit Mira Grünhaupt
🔹Smarter Materialfluss zur nachhaltigen Produktivitätssteigerung mit Nikolai Knapp
🔹Wie kann Forschung schneller in the Wirtschaft kommen mit Ulf Oestermann
✅ Fachlicher Austausch auf Augenhöhe: Die Pausen und Diskussionsrunden wurden rege genutzt für fachlichen Austausch, neue Impulse und wertvolle Kontakte.
✅ Klare Perspektiven für die Praxis: Konkrete Beispiele aus der Industrie haben gezeigt, wohin sich Prozesse, Technologien und Anforderungen entwickeln – und wo sich jetzt Handlungsfelder ergeben.

Melden Sie sich jetzt für Salzburg an! https://www.electronicsontheroad.com/details-registrierung/electronics-on-the-road-salzburg/form

Alternativ können Sie sich für unseren letzten Termin in 2026 anmelden 👉 Berlin, 18. & 19. November

Unsere Partner, Table-Top Aussteller und Kollegen freuen sich auf Sie!

03/06/2026

How can you remain technologically and industrially competitive in a rapidly evolving electronics market and enable PCBs for AI and high‑performance computing (HPC)?

At the 7th Technology Forum Electronics Manufacturing on June 17 & 18, 2026 at Ersa in Wertheim, a program highlights will address this question:

In their hands-on session, Christoph Öckl from ASMPT and an expert from Ersa will place XL BGAs with the dimensions of 134 x 134 x 7 mm³ and 500 g on a SIPLACE SX live in their Customer Care Center in Wertheim.

BGAs are a key building block in AI Server Applications, where increasingly complex board designs, high-value components and zero-defect requirements are pushing SMT production to new levels of precision, reliability and process control.

ASMPT addresses these challenges with integrated SMT solutions specifically designed for AI and HPC production. Visit our webpage to learn more about AI Server Applications!

Another highlight of the event:

In his keynote presentation, Josef Ernst CEO of ASMPT SMT Solutions will discuss the strategic importance of innovation and technological leadership in securing Germany's future position within the global electronics industry.

01/06/2026

How do you prepare for the next generation of SMT manufacturing while keeping today’s production stable and efficient?

That was one of the key questions behind the development of the new SIPLACE V placement platform.

In this video, Felix Friedrich, Electrical Engineer at ASMPT SMT Solutions, explains how SIPLACE V combines next generation connectivity with full compatibility to existing ASMPT environments.

Its high-speed Gigabit Ethernet architecture enables real time data availability and creates the basis for advanced analytics, AI supported optimization and future automation concepts on the shop floor.

At the same time, SIPLACE V remains fully compatible with existing ASMPT hardware and software, protecting investments while enabling a confident move into the future.

👉 Learn more about the SIPLACE V on our website.

29/05/2026

Multifunctional SIPLACE CA2 high-speed platform revolutionizes SiP production.

Electronics production is currently experiencing a technological quantum leap: SMD and die processing, two previously strictly separate areas, are merging. This requires a whole new generation of placement machines.

We at ASMPT already have this new generation on the market – for example with the SIPLACE CA2, a multifunctional high-speed placement machine that processes both classic SMDs and dies – the latter even directly from the pre-separated wafer. To prevent the machine from becoming a productivity brake in SiP production, we had to come up with a few ideas.

We have parallelized the die stripping and placement process and thus accelerated it to such an extent that the SIPLACE CA2 can even keep up with modern high-speed SMT production lines. And if you can do both SMT and die processing, you will leave your competitors behind in the rapidly growing advanced packaging market.

SIPLACE CA2 - it works!

28/05/2026

“These solutions reflect our core competencies of flexibility and quality perfectly.“ - Andrea Gozzi, General Manager at System Electronics.

To ensure effective process improvements, WORKS Optimization provides comprehensive quality control along the entire SMT line. With its Printing, Placement and Quality Viewer modules, both the printing and the placement processes can be optimized.

Components for premium car brands, Formula 1 racing cars, MotoGP motorcycles: Since the 1980s, System Electronics, Modena, has been producing cutting-edge technology for the most demanding customers. Making this high-mix, low-volume production economical is a major challenge.

They gained electronics production that’s state-of-the-art – top quality on a flexible and perfectly balanced line.

Learn more on our Website about how WORKS Optimization is successfully used in many SMT production facilities. You will find the link in the comments below.

Learn more about how WORKS Optimization is successfully used in many SMT production facilities: https://tools.smt.asmpt.com/addmindms/download.aspx?domid=10&fdl=0&d_id=50dda4f0-922f-79c9-8d09-b9b7738e8844

27/05/2026

Why is the SIPLACE SX the placement platform of choice for most high-mix, low-volume manufacturers?

Because it flexibly adapts to the diverse challenges on the modern shop floor! Even complex mixed assemblies of the smallest passive 0201metric components and THT heavyweights are no problem for this machine.

With the SIPLACE SX, we are also the technology leader in highly flexible SMT production for demanding customers, e.g. in the automotive sector:
🔷 Low, medium and high-speed orders can be processed with only one machine.
🔷 Scalable as required with interchangeable gantries, three placement heads, many feeding options for tapes, sticks, bowls and trays, flexible multiple-track conveyors and PCB sizes up to 1.525 mm × 560 mm, from touchless placement and 0.5 N to a placement force of 100 N, from the placement of sensitive LEDs to robust connectors – more flexibility is not possible
🔷 With the OSC package, even highly complex THT assemblies can be integrated into standard SMT production.

Regardless of high complexity or high throughput, with the SIPLACE SX you are well equipped for today's and tomorrow's challenges in SMT production.

Find out more about the SIPLACE SX and its flexibility for demanding SMT applications on our website.

21/05/2026

Can one platform deliver maximum precision across the entire component spectrum?

The new SIPLACE V head generation delivers up to 30 percent higher performance under real production conditions while maintaining placement accuracy of up to 20 µm @ 3σ.

Component-specific control of rotary drives enables each head segment to be individually controlled. Components are aligned immediately after pickup, minimizing angular correction during placement. High-resolution inspection and precisely adjustable placement forces ensure stable, repeatable precision at full speed.

From ultra-miniature components such as 016008M formats to large and heavy components such as BGAs up to 200 × 200 × 28 mm, the platform, with its three optimized placement heads, covers the entire spectrum of modern electronics manufacturing.

Engineered for assemblies with high component density and a wide range of component sizes across automotive and industrial applications, as well as smartphones, consumer electronics, IT and network infrastructure, SIPLACE V marks the beginning of a new era in electronics manufacturing.

👉 Learn more about SIPLACE V on our website.

20/05/2026

Performance is not a question of component shape

Why does the SIPLACE SX achieve amazing performance even in high-mix, low-volume production? Why do we lead with the lowest derating in the industry? Because we consistently adapt our pick-and-place machines to the requirements of the modern shop floor!

Miniaturized data processing components and large, heavy power electronics increasingly share mixed assembly lines. Maximum performance is only possible with maximum flexibility.

With the SIPLACE SX, we are the technology leader — even in performance for high-mix, low-volume production:
✅ High-precision, flexible placement heads ensure the broadest component spectrum for perfect line balancing.
✅ Outstanding planning & optimization software harmonizes customer and production requirements.
✅ Self-contained changeover tables enable fast product changes with minimal machine downtime.

Even in highly complex mixed production, performance remains high. The SIPLACE SX is ideally equipped for future markets like electromobility —because with this pick-and-place machine, complexity is no longer a performance brake.

Find out more in our product brochure 👉 https://lnkd.in/dKSU4Wfe

18/05/2026

How quickly can you access the right information to steer your SMT production?

In increasingly complex manufacturing environments, decisions depend on how fast and how clearly data can be accessed.

With the latest WORKS Monitoring update, we have further enhanced how production data is structured, visualized and made accessible.

The focus: Making shop floor data easier to navigate across the entire SMT line.

What’s new:

✅More detailed visibility of production data at line and machine level
✅Enhanced filter and search functions for fast, targeted access
✅Improved visualization for clear and consistent KPI transparency

WORKS Monitoring consolidates data across the full SMT line and provides a real-time overview of all relevant KPIs in one consistent view.

This creates the transparency required to react faster, prioritize effectively and keep production on track.

WORKS Monitoring — now with enhanced data accessibility and clarity.

15/05/2026

Quality does not tolerate mistakes!

Why does the SIPLACE SX have the lowest DPMO rate in the industry?
Because we use cutting-edge technology in all areas! Our placement machines are used successfully all over the world and we know from many years of experience what really matters for which component.

With the SIPLACE SX, we are technology leaders, also in terms of quality:
🔷 Linear motors for efficient, high-precision positioning
🔷 Totally closed loop in pickup & placement process for maximum process reliability
🔷 Digital vision system with programmable lightening intensity and angle for each component , regardless of size and complexity
🔷 Self-learning of component height and PCB warpage, for consistent quality under changing conditions
🔷 Individual, software-controlled placement force for processing a wide range of components

High-precision placement technology and a sophisticated quality assurance system guarantee that every component receives exactly the processing it needs. Passive 0201 metric tiny components are placed just as optimally THT heavyweights.

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Munich

Webseite

https://smt.asmpt.com/

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Kategorie

Elektronik