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03/09/2024

Why is Advantages of MC LED PCBs

MC LED PCBs (Metal Core Printed Circuit Boards) offer several significant benefits due to their unique design and materials:

Enhanced Thermal Management: MC PCBs utilize specialized substrate materials that enhance reliability and perform well at elevated temperatures. They integrate a dielectric polymer layer with high thermal conductivity, resulting in lower thermal resistance.

Superior Heat Dissipation: Metal core PCBs transfer heat 8 to 9 times faster than traditional FR4 PCBs. This effective heat dissipation keeps heat-generating components cooler, which leads to improved performance and extended lifespan of the components.

Increased Performance and Longevity: By efficiently managing heat, MC LED PCBs help maintain optimal operating conditions for LEDs, leading to better performance and a longer operational life.

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04/07/2024

Reducing Glue Residue and Improving Hole Shape in Rogers RO3003 PTFE Laser Drilling

With breakthroughs in 5G technology, the realization of automotive autonomous driving is becoming increasingly imminent. The autonomous driving process requires the installation of numerous sensors to detect the surrounding environment, with 77G millimeter-wave radars being widely used for vehicle body perimeter detection (Figure 1). To reduce signal transmission loss in automotive radar PCB products, radar antenna surfaces predominantly use PTFE-based high-frequency PCB materials.

Abstract: in order to reduce signal loss, automotive millimeter-wave radar boards use PTFE highfrequency materials as the base material on the radar antenna surface. The commonly used PTFE material inthe industry is RO3003 supplied by Rogers Corporation, which uses molten PTFE as the resin base, and thefller inside is SiO, with a diameter ranging from 5-70 um. Because PTFE resin itself has a high melting poinand is dificult to decompose, at the same time, this material has a high proportion of SiO, fller and a largeparticle size. Laser blind hole processing has always been a problem in the industry. If the energy is large, itis easy to carbonize and agglomerate, resulting in molten black spots. Attached to the wall and bottom of thehole, the energy is small, the hole shape is very irregular, In this paper, the research on the selection of laserparameters of the laser light source and the optimization of the bottom glue removal method have effectivelreduced the residual glue, and the hole shape has also been greatly optimized. This greatly improves productreliability and processability.

R03003 Material parameters

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08/04/2024

LED Spot Light PCBA is a special type of printed circuit board (PCB) used for manufacturing LED lighting products such as LED light strips and bulbs. It is typically a long, strip-shaped PCB with multiple LED chips and other electronic components mounted on it. The design and fabrication of the PCB must take into consideration the electrical and mechanical requirements of the LED light strip or bulb, such as power input, current control, heat dissipation, and size factors. Typically, the PCB will use aluminum-based or ceramic-based materials to provide better heat dissipation performance while ensuring stable operation of the LED chips.

28/03/2024

High density Circuit PCB means a compact circuit board, which is to increase component interconnect density, it is necessary to compress the circuit and interconnection space from a geometric perspective, allowing more connection points to be accommodated in a small area and thus improving interconnect density. Additionally, stacking multiple components in a single location can enhance assembly density. Therefore, high-density circuit boards are not just a circuit board technology, but also an issue related to electronic assembly and packaging.

To achieve increased circuit density, the diameter of laser holes and the target pads for receiving laser holes are shrinking. Some customers are engaged in mass production of products with a high-density design, featuring 175um target pads and 75um laser holes. This means that, excluding the etching amount for image transfer, the total offset across three processes - image transfer, pressing, and laser drilling - should be less than 40um.

If the offset exceeds the specified limit, the laser hole will shift off the target pad and onto the next layer, leading to the risk of short circuits after copper plating or CAF defects. High density Circuit PCB manufacturers fail to improve their alignment capabilities promptly, it will inevitably result in significant yield losses and pose severe challenges for them.

The industry generally uses HDI (High Density PCB) laser drilling technology to produce printed circuit boards with blind via designs. When customers have higher withstand voltage requirements, the dielectric thickness of the blind via layer needs to be relatively thick, or when the blind vias need to carry larger currents, the blind via diameters need to be larger. In such cases, conventional HDI techniques may not meet the customers' design requirements, and mechanical blind via design becomes a preferred choice.

For mechanical blind via PCBs, the commonly used processing method is to first create the through-hole connections in the blind via layer and fill the blind vias with resin plugs to ensure proper filling. Then, the inner layer circuitry is created, followed by lamination. After lamination, the outer layer is processed using a similar process to conventional multilayer boards.

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20/03/2024

From the depths of the silicon to the heights of the sky,You're the bridge that spans the realms, where data never dies.With your copper and your solder, you forge a path so true,Guiding us to the future, where innovation shines anew.

15/03/2024

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13/03/2024

We can say that a TF card is the smallest memory card available. TF stands for TransFlash, which Toshiba and SanDisk jointly created in 2004. Following the SD Association's acquisition at the end of the same year, the name was later changed to micro SD card. The TF card board then formally joined SD products

In fact, there are not absolute standards for thin boards in the PCB industry. Any board thickness below 0.6mm can be referred to as a thin board in PCB field. Therefore, many PCB manufacturers advertise their processes as capable of producing TF card board with a minimum thickness of 0.6mm. However, true thin boards are much thinner than 0.6mm.

Such as this kind of thin PCBs, also called TF card boards, which requires specialized equipment such as dedicated cutting machines, racks for manufacturing thin boards, horizontal conveyors, and other specialized fixtures.

What are some techniques for designing thin PCBs（TF card board）?

Designing ultra-thin PCBs can lead to warping issues. To mitigate this, it's advisable to keep the remaining copper foils on the top and bottom layers as close as possible and symmetrically distribute them.

You can use high-TG (glass transition temperature) materials to prevent deformation at high temperatures.

When panelizing, it's a good practice to fully enclose the perimeter of the panels and add a 10mm rail in the middle to reduce the number of panels. Any detail please send a message to ， kind visit our websit: www.bsinterconn.net, send email to [email protected]

07/03/2024

RO3003 is a high-frequency material specifically designed for applications requiring excellent signal integrity and low loss at microwave frequencies. It offers low dielectric loss and high thermal conductivity, making it suitable for high-frequency circuitry.

"In order to minimize the loss of signal, automotive millimeter-wave radar boards utilize high-frequency materials made of PTFE (polytetrafluoroethylene) as the base material on the surface of the radar antenna. The industry commonly employs RO3003, a type of PTFE material provided by Rogers Corporation. This particular material incorporates SiO2 particles with diameters ranging from 5-70 um into molten PTFE resin as its base. However, due to the challenges posed by the high melting point and decomposition difficulty of PTFE resin, as well as the large particle size and high proportion of SiO2 filler, laser blind hole processing has always been a complex task in this field. Insufficient energy during processing can result in irregular hole shapes while excessive energy may lead to carbonization and agglomeration, causing molten black spots to adhere to both the wall and bottom surfaces of the hole.

Utilizing CO2 laser drilling with controlled energy parameters enables improved through-hole quality, characterized by reduced debris and enhanced pe*******on. Building upon this, the integration of UV repair techniques further enhances the cleanliness and integrity of blind hole bottoms, ensuring optimal interlayer connectivity and structural integrity.

11/12/2023

A night lamp, as all known as night light, which is not intended to serve as the primary source of illumination. Typically, Night Lamp's brightness ranges from 1 to 3 watts, emitting a soft and diffused glow. This level of brightness is sufficient to see objects in the room without the need for additional lighting when getting up at night, whether in a bedroom or living room.

In terms of power consumption, the LED bulb in a night lamp typically consumes less than one watt. However, it's essential to consider the power used by the driver and amend circuitry. If a night lamp employs a switch-mode power supply, this component's power consumption is minimal and can be practically disregarded, although it can increase the overall cost of the night lamp.

Alternatively, if the night lamp uses a capacitive current-limiting and voltage-reduction circuit, it may result in higher power consumption. Capacitive current-limiting circuits tend to have a lower power factor, leading to a significant amount of reactive power generation, often several times the power of the LED bulb itself.

Therefore, for LED bulbs with a power rating of less than one watt, the overall power consumption of the night lamp typically exceeds three watts. This means that, contrary to some claims by night lamp manufacturers, it does consume more electricity over the course of a year, but still only a few kilowatt-hours rather than a significant amount.

The power consumption of a night lamp can be estimated as follows:

1. 1W fluorescent tube night lamp consumes 1 watt of electricity per hour. One kilowatt-hour (kWh) is equivalent to using 1000 watts for one hour. Assuming it's used for 8 hours at night, it would consume 8 watts, which is equal to 8/1000 kWh of electricity. Over a month of 30 days, this adds up to 8/1000 kWh x 30 days, which is less than 1 kWh. So, it uses less than 1 kWh of electricity in a month.

2.Night lamps typically have a power rating of 3 to 5 watts. This translates to approximately 72 to 120 watt-hours per day. Over a month, this ranges from 2160 to 3600 watt-hours, which is equivalent to 2.16 kWh to 3.6 kWh. If your electricity costs 60 cents per kWh, the maximum cost of using the night lamp for a month would be approximately 2 to 3 yuan (Chinese currency).

So, in both cases, the electricity consumption and cost of using a night lamp are quite low.

07/12/2023

A 2 oz finished copper PCB is a printed circuit board whose copper weight per square foot amounts to two ounces

What's is advantage for 2oz finished copper PCB

2 OZ Copper PCB is superior to 1 OZ Copper PCB; however, the cost of 2 OZ is more than that of 1 OZ, but the performance, current, and thermal management are considerably better. Chargers and adapters, for example.

The normal inner layer copper thickness chosen for the inner layer is 2oz copper (70m thick or 2.8 mils). This is the normal beginning copper thickness for the PCB's outer layer when the finished copper weight is 3 oz.

Flexible PCBs are also starting to employ 2 oz. PCBs in the market, and the most popular copper weights for flexible PCBs are 0.5 oz. and 1 oz., but lesser copper weights are also available.

Today, we will first focus on the thick copper plating process of 2oz copper board. Monitoring the process parameters is crucial to prevent unnecessary losses, which can result from both subjective and objective factors. To ensure the success of the thick copper plating process, it's essential to address the following aspects:

1. Adjust the area value calculated by the computer, taking into parameters accumulated during actual production, by increasing it by a certain value.

2. To maintain the coating's integrity within the hole, increase the original current value with an impulse current based on the calculated current value, and then promptly revert to the original value.

3. After 5 minutes of electroplating on the circuit board, remove the substrate and inspect whether the copper layer on the surface and inside the hole is complete. Ensure a favorable and metallic shiny copper in all the holes.

4. Maintain a specific distance between substrates.

5. Upon reaching the required plating time for thickening copper, maintain a certain current level during substrate removal. This is done to prevent any blackening or darkening on the surface of subsequent substrates and inside the holes.

Below board is used for medical ozone treatment instrument, which is an instrument for making and degrading ozone gas (O3)

28/12/2022

Why do you chooice 94V-0 to your product?