Alinx

04/09/2026

🌟 New Product Release: ALINX ACVM2152 SoM & AXVM2152 Development Platform!

Looking for a high-performance, flexible solution for real-time data processing and edge computing?

The ACVM2152 SoM combines the AMD Versal™ Prime XCVM2152 Adaptive SoC with 4 GB of ultra-fast LPDDR5 memory, 32 GB eMMC, and rich DSP resources on a compact 80 x 80 mm pluggable module.

Paired with the AXVM2152 carrier board, it opens up versatile hardware expansion capabilities—including PCIe Gen4/Gen5 host interfaces, FMC+ connectors, MIPI camera support, display interfaces, Gigabit Ethernet, and CAN communication for rapid prototyping.

Perfect for:
• Industrial Automation & Edge Control
• Video Infrastructure & Embedded Imaging
• Data Center Acceleration & Telecom
• Automotive & Aerospace Systems

Ready to jumpstart your next-generation embedded system? Reach out to our team at [email protected] or visit [https://www.en.alinx.com]to learn more! 🚀

02/09/2026

Product Announcement: ALINX HEA47 Heterogeneous RF & AI Computing Platform!

We are thrilled to unveil the HEA47, designed for engineers and researchers building the next generation of high-speed wireless, radar, and physical AI systems!

The HEA47 pairs the AMD Xilinx Zynq UltraScale+™ RFSoC ZU47DR with NVIDIA® Jetson AGX Orin / Thor modules over an ultra-fast PCIe Gen3 x8 interface (80 Gbps bandwidth).

Why HEA47?

🔸Direct RF Sampling: Eliminates complex analog down-conversion stages with 8-channel 5 GSPS ADCs and 8-channel 9.85 GSPS DACs.

🔸Unrivaled Edge AI Power: Scalable compute options ranging from 241 TOPS (AGX Orin) up to 2,070 FP4 TFLOPS with the NVIDIA Jetson Thor T5000 module.

🔸Built for Industrial Systems: High-density SMP connectors, 10G/5G Ethernet options, M.2 expansion, and robust industrial-grade interfaces.

🔸Perfect for Software Defined Radio (SDR), 5G/6G basebands, electronic warfare, robotics, and edge AI inference.

💬 Have questions or want to evaluate the HEA47 for your project? Drop a comment or email us at [email protected]!

27/08/2026

We are thrilled and honored to receive a special appreciation memento from AMD at the AMD Embedded Computing Summit (ECS) 2026 in Bengaluru! 🏆✨

A massive shoutout to our distributor, Tenet Technetronics, for brilliantly representing ALINX at the summit, presenting our hardware solutions, and engaging with the vibrant tech community in India.

This recognition marks another milestone in our strong partnership with AMD as we continue to deliver high-performance FPGA and edge AI hardware platforms.

Thank you to the AMD team and Tenet Technetronics for making this success possible! 🚀

27/08/2026

Tomorrow is the day! AMD ECS Japan kicks off August 28th! 🚀

The ALINX team has arrived in Tokyo and we are getting everything set up for tomorrow’s event. If you’re coming to AMD Embedded Tech Day Japan, we’d love to meet you at our booth! 👋

🎬 What can you expect at the ALINX booth?

We’ll be running a live demonstration of our FPGA-Based CMOS Image Acquisition & USB® 3.2 Video Pipeline, showcasing how hardware-level processing eliminates latency for multi-sensor edge AI setups.

Plus, you can check out our hardware boards up close:

VD100 (AMD Versal™ Prime VE2302)

ACAU15 (AMD Artix™ UltraScale+ AU15P)

FH7621 (High-Performance FPGA Board)

See you tomorrow in Japan! ✨

Tech

25/08/2026

Greetings from AMD Embedded Tech Day (ECS) South Korea!

Today, the ALINX team is live at AMD ECS showcasing our high-speed video acquisition pipeline and FPGA hardware! If you're attending the event today, make sure to drop by our booth and say hi! 👋

🎬 What’s on live demo?

We’re running a live FPGA-Based CMOS Image Acquisition & USB® 3.2 Video Pipeline. It handles hardware pixel sync, format conversion (RAW, YUV, RGB), and timestamping directly on-chip—giving you ultra-low latency and plug-and-play transmission to PCs or edge AI systems.

We also brought along some of our popular hardware boards for you to check out up close:

🔹VD100 (AMD Versal™ Prime VE2302)

🔹ACAU15 (AMD Artix™ UltraScale+ AU15P)

🔹FH7621 (High-Performance FPGA Board)

🇯🇵 Heading to Japan next!

We’ll also be exhibiting at AMD ECS Japan on August 28th. Mark your calendars and stay tuned for more updates from the road! 🚀

21/08/2026

🎉 You're Invited to Visit Us at elexcon 2026!

We are thrilled to join The 23rd Shenzhen International Electronics and Embedded Show! Come visit the ALINX booth to explore our latest FPGA industry solutions.

Event Overview:
📍 Booth Number: 16A49 (Entrance/Exit Gate No. 2)
🗓️ Date: September 9–11, 2026
🏢 Venue: Shenzhen World Exhibition & Convention Center (Bao'an District, Shenzhen)

Whether you are interested in FPGA hardware, automotive vision systems, or edge AI acceleration, our team is ready to connect with you on-site!

👇 Claim your free ticket and meet us at Booth 16A49!

12/08/2026

🎉 ALINX on Tour: AMD ECS 2026!

Asia, we’re coming your way! ALINX is hitting the road for AMD ECS 2026, bringing our cutting-edge FPGA platforms and hardware solutions right to your doorstep.

📍 Where & When to Find Us:
🇮🇳 Bengaluru: Aug 20, 2026

🇰🇷 Seoul: Aug 25, 2026

🇯🇵 Tokyo: Aug 28, 2026

Come meet our team, get hands-on with our hardware, and see how ALINX can power your next innovation. See you at the booth! 👋

🔗 Details & Registration: https://www.en.alinx.com

03/08/2026

🔥 Meet the Ultimate FPGA + AI Heterogeneous Compute Platform: AXVU9F! 🔥

Are you working on high-speed data acquisition, radar systems, IC emulation, or high-throughput AI acceleration? The AXVU9F Development Board is built specifically for high-performance testing and verification!

💡 What Makes AXVU9F Stand Out?
1️⃣ FPGA + GPU Dual-Engine Acceleration:
Combines an AMD Virtex UltraScale+ VU9P FPGA (2.58M Logic Cells) with an NVIDIA Jetson Orin NX module (8GB/16GB, up to 100–157 TOPS AI performance) connected over PCIe 3.0 x4.

2️⃣ Massive Expansion Options:
Features 4 x FMC+ expansion connectors offering 384 I/Os and 68 pairs of ultra-fast 28.21Gbps GTY transceivers—perfect for connecting high-speed ADCs, cameras, HDMI modules, and RF daughtercards!

3️⃣ High-Speed Networking & Storage:
Includes a 100G QSFP28 optical port, DDR4 SODIMM slot (up to 32GB), NVMe M.2 SSD slot, USB 3.0 ports, Gigabit Ethernet, and 4K DisplayPort output!

🌍 Ideal For:
Compute & Network Acceleration

5G & Radar Systems

Machine Learning & AI Inference

Medical Equipment & Industrial Robotics

Chip Emulation & Prototyping

Interested in boosting your hardware development speed? Contact our sales team today to learn more or request a package quote!

📩 Email: [email protected]

25/07/2026

Milestone Moment! ALINX Joins SGET and the oHFM FPGA Standard Workgroup! 🎉🌐

We have some huge news to share! ALINX is officially a member of SGET (Standardization Group for Embedded Technologies), making us the first FPGA solution vendor from Mainland China to join the oHFM (Open Harmonized FPGA Module) workgroup!

What does this mean for developers and system integrators?

💡 No More Redundant Redesigns: oHFM establishes a unified hardware framework for FPGA System-on-Modules (SoMs), allowing you to swap modules without redesigning your entire carrier board.
🔄 Two Flexible Form Factors:

oHFM.c: Pluggable connector design for easy updates & AI prototyping.

oHFM.s: Compact solderable design built for rugged industrial environments.
🚀 Faster Deployment: Speeds up development for smart manufacturing, robotics, communication infrastructure, and edge AI.

We are thrilled to partner with the global embedded community to make FPGA platforms more open, standardized, and accessible!

What are your thoughts on open hardware standards for FPGAs? Drop a comment below! 👇

24/07/2026

Say goodbye to FPGA vendor lock-in! 🛠️✨

Proprietary modules and incompatible interfaces have caused high R&D costs and slow product iterations for too long. SGET’s new oHFM (Open Harmonized FPGA Module) standard is here to change the game!

Here is what makes oHFM a game-changer:
💡 100% Open: Completely license-free and vendor-neutral.
🔌 oHFM.c (Pluggable): Easy upgrades for high-speed AI & networking.
🛡️ oHFM.s (Solderable): Compact & ultra-durable for rugged industrial environments.
⚡ Faster Time-to-Market: Focus on your custom application, not redesigning core FPGA circuitry.

Learn more: https://www.linkedin.com/pulse/why-does-fpga-industry-need-open-harmonized-module-standard-alinx-vcvuc/?trackingId=Sgf2aXvO0JGvxTm3y3YvNA%3D%3D

Question for the engineers out there: Which form factor would suit your project better—the pluggable oHFM.c for easy upgrades, or the solderable oHFM.s for high durability?

Drop your thoughts below! 👇

Driven by the rapid adoption of AI, edge computing, high-speed communications, industrial automation, and machine vision, FPGAs have become essential across telecommunications, industrial control, healthcare, and aerospace. Their high parallel processing capability, reconfigurable architecture, and