Meline Group

27/05/2026

🏭Meline Group popular science series----Ersa Hotflow 3/20 XL 10 Zone Reflow Oven🏭

🚦Ersa Hotflow 3/20 XL 10 Zone Reflow Oven👇👇👇
1️⃣The nitrogen reflow soldering system is integrated with a high-capacity nitrogen supply unit using 99.999% high-purity nitrogen, creating a stable low-oxygen environment inside the oven. Oxygen concentration, oven temperature, and equipment status are continuously monitored to ensure process stability and minimize oxidation during SMT production.👀

2️⃣Nitrogen protection reduces oxidation during reflow, improving solder wettability and solder joint formation while minimizing defects such as cold solder joints, insufficient solder, solder bridging, and solder balls. It is particularly suitable for high-density and fine-pitch SMT assemblies including BGA, QFN, CSP, fine-pitch ICs, and 01005 components.📍

3️⃣Supported by a stable nitrogen environment and optimized reflow profiles, the system provides precise thermal control through preheating, soaking, reflow, and cooling stages. Combined with hot air convection and multi-zone control, it helps reduce thermal shock, minimize PCB warpage, and protect temperature-sensitive components.🔍

4️⃣The production line is equipped with the Ersa Hotflow 3/20 XL 10-zone nitrogen reflow oven, featuring 10 independently controlled heating zones on both the upper and lower sides and 4 independent cooling zones. It supports PCB widths up to 610 mm and thicknesses up to 10 mm, meeting the requirements of large-size, multilayer, and complex PCBA products.⛓️

5️⃣ The high-precision hot air convection system delivers temperature control accuracy of ±1°C, while PCB temperature distribution is controlled within ±1.5°C, ensuring stable and uniform reflow soldering performance.🌡️

6️⃣The multi-zone forced cooling system rapidly lowers PCB temperature after soldering, helping form stable solder joints while minimizing residual heat impact on temperature-sensitive components and improving product reliability.🧑‍🏭

7️⃣After reflow soldering, PCBAs are automatically transferred to the 3D Automated Optical Inspection (AOI) system for in-line inspection of solder volume, component offset, solder bridging, insufficient solder, and open solder joints, ensuring SMT process quality and long-term reliability.✅

👉For more information about our PCB assembly services, please visit🌐: https://www.melinegroup.com/pcb-assembly-service

15/05/2026

🔎Meline Group popular science series----New 2D AOI🔍

📍2D AOI Inspection Process:👇👇👇
1️⃣Prepare the required CAD data📁 for the equipment and match it with the corresponding machine model to ensure data integrity and accuracy.🧑‍🏭
2️⃣Create a new inspection program by inputting the PCB length and width, and adjusting the conveyor width. Load the PCB and perform full-board scanning for image acquisition. After saving the program, import the CAD data, align it with the scanned image, and enhance alignment accuracy using image recognition algorithms.🏭
3️⃣Create fiducial (MARK) points and calibrate component positions.🎯
4️⃣After completing the program, start inspection. Detected exceptions are automatically routed to the repair station mode, where the system classifies and filters inspection results. QC personnel review alarm images one by one via the interface, and the system marks suspected defects to assist judgment.🚦
5️⃣If the AOI-detected defect falls within the acceptable visual inspection criteria, press the Insert key to classify it as a pass. ✅
6️⃣ If the AOI-detected defect exceeds the acceptable visual inspection criteria, use numeric keys to select and assign the specific defect type. The system simultaneously records defect data for quality analysis and traceability.📝

👉For more information, please see us on🌐: www.melinegroup.com

30/04/2026

🎉Happy International Workers' Day from Meline Group!☺️✨

🔷From every PCB to each precise assembly process, from attention to detail to strict quality control, every detail matters.🏭🏆

📍Meline Group remains committed to quality, professionalism, and innovation, and looks forward to working closely with our global partners to deliver more reliable and efficient PCBA solutions.✅🤝

👉For more information, please see us on🌐: www.melinegroup.com

22/04/2026

https://www.linkedin.com/feed/update/urn:li:activity:7452609381289885696

First Article Inspection at Meline Group (II)

22/04/2026

https://www.linkedin.com/feed/update/urn:li:activity:7450483620626055168

First Article Inspection at Meline Group (I)

08/04/2026

🔎Meline Group popular science series----Outgoing Quality Inspection🔍

📍Outgoing Quality Inspection:👇👇👇
1️⃣Quality inspectors must first implement electrostatic protection measures and wear an ESD wrist strap.🧑‍🏭
2️⃣Place the PCBA at the center of the workbench. Adjust the magnification of the digital microscope by operating the mouse to ensure the PCBA is clearly displayed on the monitor.🔬
3️⃣Inspect the edges of the PCBA under the microscope to check for burrs, chipped corners, or cracks. Verify that the board corners are free from impact marks or deformation, ensuring the substrate’s structural integrity.🏭
4️⃣Examine the board surface for visible contaminants such as stains, flux residues, solder balls, or metal debris, with particular attention to the gaps between mounted components.💬
5️⃣Inspect the solder joints on the PCBA to ensure they are full and smooth, without cold solder joints or solder bridging. The size and shape of the solder joints must meet process specifications.✨
6️⃣Verify that all components on the PCBA are correctly mounted and securely fixed. Check that component leads are properly aligned and that there is no component misalignment, tilting, or lifting.📄
7️⃣For critical components such as IC chips on the PCBA, inspect the leads for abnormalities such as bending or oxidation to ensure stable performance.🛫
8️⃣Inspect edge connectors on the PCBA to confirm that the contact fingers are flat and undamaged, ensuring reliable electrical connectivity.✅
9️⃣Place qualified PCBAs into anti-static bags. After sealing with a heat sealer, transfer them to the next production process.📦

👉For more information, please see us on🌐: www.melinegroup.com

01/04/2026

https://www.linkedin.com/pulse/temperature-control-meline-groups-reflow-oven-part-2-melinegroup-b4x6c

As a one-stop PCB/PCBA service provider, Meline Group regards delivering high-quality and reliable PCBA as its utmost commitment to customers. As is well known, the PCBA process primarily comprises the following key steps: SMT assembly, DIP soldering, testing, and final assembly and packaging.

24/03/2026

🔎Meline Group popular science series----3D-SPI Solder Paste Inspection Process Overview🔍

1️⃣Information Collection
First, review the product operation manual to identify critical control points (CCPs) within the inspection process.
Next, obtain the stencil (steel mesh) data file and develop the SPI inspection program accordingly.
Meanwhile, perform stencil verification and measure its thickness to establish appropriate solder paste inspection standards.📄

2️⃣Equipment Programming
Program the SPI inspection system. Optimize the inspection path and configure corresponding inspection groups based on component types (such as resistors, capacitors, and irregular-shaped devices).🏭

3️⃣Solder Paste and Silkscreen Differentiation
The equipment must accurately distinguish between solder paste deposits and silkscreen markings to ensure the accuracy and reliability of inspection results.📍

4️⃣Reverse Validation Test
Conduct reverse validation using a bare PCB to verify that the system can effectively detect defective boards.🔬

5️⃣Production Release
Upon completion of the above steps, the SPI inspection program can be officially launched to ensure stable and controlled production operations.✅

👉For more information, please see us on🌐: www.melinegroup.com

10/03/2026

🏭Meline Group popular science series----SMT Solder Paste Printing Operation Specification🏭

🔎Solder paste printing is a critical SMT process that directly impacts soldering quality and product reliability. This specification outlines essential procedures and control points.🧑‍🏭

📍I. Precision Stencil Alignment Procedure
1️⃣Stencil Verification: Confirm stencil matches PCB model (aperture size, thickness, revision).
2️⃣PCB Parameter Input: Enter PCB dimensions (length, width, thickness) into the printer.
3️⃣PCB Positioning: Use support pins to level the PCB, aligning it parallel and centered with the stencil.
4️⃣Automatic Optical Alignment: Vision system identifies PCB fiducials for baseline positioning.
5️⃣Rail & Stencil Installation: Raise rails for optimal contact and mount the stencil.
6️⃣Fine Calibration: Verify pad-to-aperture alignment, then lock stencil with pneumatic clamps.
7️⃣MARK Point Correction: Perform camera-based alignment of PCB and stencil fiducials.
8️⃣Error-Proofing: Configure orientation marks to prevent incorrect PCB placement.
9️⃣Trial Print: Conduct trial and optimize parameters based on SPI results.

📍II. Key Process Control Points
1️⃣PCB Orientation: Verify orientation before loading to prevent batch defects.
2️⃣Printing Accuracy: Control offset to ≤ 0.02mm to prevent paste shift.
3️⃣Offset Risk: Misalignment can cause tombstoning, bridging, or insufficient solder.
4️⃣Squeegee Pressure:
Excessive: Reduces stencil/squeegee life.
Insufficient: Causes incomplete prints or insufficient solder.
5️⃣Printing Speed: Optimize for uniform paste deposition; extremes affect consistency.
6️⃣Stencil Separation Speed: Control speed to prevent solder peaks.
7️⃣Squeegee Angle: Maintain recommended 65° for optimal paste transfer.

📍III. Core Objectives
Precise alignment and stable control achieve:
1️⃣Improved First Pass Yield (FPY)
2️⃣Reduced bridging, tombstoning, and insufficient solder
3️⃣Optimized BGA and fine-pitch soldering
4️⃣Extended stencil and squeegee life
5️⃣Consistent mass production quality

✅In SMT, printing accuracy determines soldering quality and final product reliability. Strict adherence to these standards is fundamental.❗

👉For more information, please see us on🌐: www.melinegroup.com

06/03/2026

https://www.linkedin.com/pulse/temperature-control-meline-groups-reflow-oven-part-1-melinegroup-90coc

As a one-stop PCB/PCBA service provider, Meline Group regards delivering high-quality and reliable PCBA as its utmost commitment to customers. As is well known, the PCBA process primarily comprises the following key steps: SMT assembly, DIP soldering, testing, and final assembly and packaging.