20/08/2026
Soldering defects like cold solder joints, solder bridges, insufficient solder, tombstoning, solder balls, and component misalignment are common challenges in PCBA manufacturing.
Some defects are visible to the naked eye, while others can only be detected through AOI, X-ray inspection, or electrical testing. The root cause can come from many factors — solder paste printing, stencil design, reflow temperature profiles, component placement, or even the PCB design itself.
Finding defects is only the first step. Identifying the root cause and continuously improving the process is what truly drives better yield.
Which PCBA soldering defect do you think is the easiest to overlook?